Study on the Key Parameters in Etching of Fused Silica Using Atmospheric Inductively Coupled Plasma

2014 ◽  
Vol 625 ◽  
pp. 469-474 ◽  
Author(s):  
Qiang Xin ◽  
Bo Wang ◽  
Hui Liang Jin ◽  
Na Li ◽  
Duo Li ◽  
...  
Keyword(s):  
Flow Rate ◽  
Material Removal Rate ◽  
Atmospheric Pressure ◽  
Inductively Coupled Plasma ◽  
Material Removal ◽  
Removal Rate ◽  
Substrate Surface ◽  
Processing Parameters ◽  
Fused Silica ◽  
Inductively Coupled

Atmospheric Pressure Plasma Processing (APPP) of silicon-based optics and wafers is a form of chemical etching technology developed in recent years. The material removal rate is comparable to those of conventional mechanical processing methods in precision fabrication. Moreover, there is no mechanical contact or physical loading on the substrate surface, hence no surface or sub-surface damages are induced. Inductively coupled plasma is one realization of APPP. In this work, inductively coupled plasma torch is used to generate plasma and excite etchant particles at atmospheric pressure. These active particles then diffused to the workpiece surface, react with its atoms to form volatile products. The activity and number of particles in plasma are influenced by processing parameters such as input power, distance between nozzle and substrate surface, flow rate of plasma gas argon and precursor gas CF4. These factors have various impacts on material removal rate. Processing experiments are conducted on fused silica to investigate the parameters’ influences on material removal rate. The basic interaction between substrate surface and plasma is illustrated, then the relationships between processing parameters and material removal rate are analyzed. From the experiments some trends are derived. Material removal rate rises with the increase of power and flow rate of CF4, whereas decreases with the increase of processing distance, etc. The etching footprint is proved to be near Gaussian-shaped and believed to have high potential for deterministic surface processing.

Comparison of Processing Features between Semi Bonded Abrasive Lapping and Loose Abrasive Lapping

2009 ◽  
Vol 416 ◽  
pp. 439-442
Author(s):  
Xun Lv ◽  
Ju Long Yuan ◽  
Dong Hui Wen
Keyword(s):  
Surface Roughness ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Processing Parameters ◽  
Good Surface ◽  
Ultra Precision ◽  
New Processing ◽  
Short Time

Semi bonded abrasive lapping is an effective ultra-precision lapping method. It can obtain good surface quality of workpiece in short time. This paper focused on the differences of processing features by comparing semi bonded abrasive lapping and loose abrasive lapping in several groups processing parameters. The results showed that the surface roughness of workpiece in semi bonded abrasive lapping was far superior to that of loose abrasive lapping in same processing parameters. And the MRR (material removal rate) of semi bonded abrasive lapping was slightly lower than that of loose abrasive lapping. For these features of semi bonded abrasive, a new processing flow would also be proposed in this paper.

Study on Force Characteristics for High Speed Sawing of Quartz Glass with Diamond Blade

2014 ◽  
Vol 800-801 ◽  
pp. 144-149 ◽  
Author(s):  
Bo Jiang ◽  
Jian Yun Shen ◽  
Xi Peng Xu
Keyword(s):  
Quartz Glass ◽  
Material Removal Rate ◽  
Material Removal ◽  
High Speed ◽  
Removal Rate ◽  
Processing Parameters ◽  
High Productivity ◽  
Diamond Blade ◽  
Force Ratio ◽  
Advanced Machining

High speed sawing is an advanced machining technique for sawing of brittle materials with good component quality and high productivity. In the paper, sawing experiments were carried out to investigate the characteristics of sawing forces by altering many processing parameters in high speed sawing of quartz glass with a diamond blade. The sawing forces and force ratio were analyzed. The conclusions present that in the fixed material removal rate, the increasing of periphery speed can help to lower sawing forces and force ratio; sawing forces increase with material removal rate; in the high speed sawing, the effect of material removal rate on sawing forces is smaller than the one in the low speed.

Atomic Emission of Chlorine: Spectra from 200 to 900 nm by Sealed Inductively Coupled Plasma-Atomic Emission Spectroscopy

1994 ◽  
Vol 48 (3) ◽  
pp. 382-386 ◽  
Author(s):  
Tracey Jacksier ◽  
Ramon M. Barnes
Keyword(s):  
Flow Rate ◽  
Atmospheric Pressure ◽  
Inductively Coupled Plasma ◽  
Emission Spectroscopy ◽  
Atomic Emission ◽  
Molecular Spectra ◽  
Plasma Atomic Emission ◽  
Inductively Coupled ◽  
Spectral Evaluation ◽  
Atomic Chlorine

Eighty-seven atomic chlorine lines and chlorine molecular spectra emitted in the 200–900 nm wavelength range are identified in a pure chlorine discharge generated at atmospheric pressure in a sealed inductively coupled plasma. Only small quantities of chlorine are needed for spectral evaluation because the flow rate is typically less than 20 mL/min.

Investigation into Chemo-Mechanical Fixed Abrasive Polishing of Fused Silica with the Assistance of Ultrasonic Vibration

2012 ◽  
Vol 523-524 ◽  
pp. 155-160 ◽  
Author(s):  
Ya Guo Li ◽  
Yong Bo Wu ◽  
Li Bo Zhou ◽  
Hui Ru Guo ◽  
Jian Guo Cao ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Ultrasonic Vibration ◽  
Material Removal Rate ◽  
Material Removal ◽  
Optical Glass ◽  
Removal Rate ◽  
Fused Silica ◽  
Processing Efficiency ◽  
Machined Surface ◽  
Fixed Abrasive

Ultrasonic vibration assisted processing is well known for the improvement in machined surface quality and processing efficiency due to the reduced forces and tribology-generated heating when grinding hard-brittle materials. We transplanted this philosophy to chemo-mechanical fixed abrasive polishing of optical glass, namely fused silica, in an attempt to improve surface roughness and/or material removal rate. Experiments were conducted to elucidate the fundamental characteristics of chemo-mechanical fixed abrasive polishing of fused silica in the presence and absence of ultrasonic vibration on a setup with an in-house built gadget. The experimental results show that ultrasonic vibration assisted chemo-mechanical fixed abrasive polishing can yield increased material removal rate while maintaining the surface roughness of manufactured optics compared to conventional fixed abrasive polishing without ultrasonic vibration. The mechanism of material removal in fixed abrasive polishing was also delved. We found that the glass material is removed through the synergic effects of chemical and mechanical actions between abrasives and glass and the resultant grinding swarf contains ample Si element as well as Ce element, standing in stark contrast to the polisher that contains abundant Ce element and minor Si element.

scholarly journals Investigation of the Effects of Machining Parameters on Material Removal Rate in Abrasive Waterjet Turning

2014 ◽  
Vol 6 ◽  
pp. 624203 ◽  
Author(s):  
Iman Zohourkari ◽  
Mehdi Zohoor ◽  
Massimiliano Annoni
Keyword(s):  
Flow Rate ◽  
Material Removal Rate ◽  
Rotational Speed ◽  
Material Removal ◽  
Removal Rate ◽  
Traverse Speed ◽  
Abrasive Waterjet ◽  
Depth Of Cut ◽  
Machining Parameters ◽  
Cutting Head

The effects of the main operational machining parameters on the material removal rate (MRR) in abrasive waterjet turning (AWJT) are presented in this paper using a statistical approach. The five most common machining parameters such as water pressure, abrasive mass flow rate, cutting head traverse speed, workpiece rotational speed, and depth of cut have been put into a five-level central composite rotatable experimental design (CCRD). The main effects of parameters and the interaction among them were analyzed by means of the analysis of variance (ANOVA) and the response surfaces for MRR were obtained fitting a second-order polynomial function. It has been found that depth of cut and cutting head traverse speed are the most influential parameters, whereas the rotational speed is insignificant. In addition, the investigations show that interactions between traverse speed and pressure, abrasive mass flow rate and depth of cut, and pressure and depth of cut are significant on MRR. This result advances the AWJT state of the art. A complete model discussion has been reported drawing interesting considerations on the AWJT process characterising phenomena, where parameters interactions play a fundamental role.

Lapping of Polycrystalline Diamond Compact (PDC)

2010 ◽  
Vol 126-128 ◽  
pp. 469-474 ◽  
Author(s):  
Alex Fang ◽  
Elena Castell Perez ◽  
Alex Puerta Gomez ◽  
Song Sheng Zhou ◽  
Jason Sowers
Keyword(s):  
Flow Rate ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Polycrystalline Diamond ◽  
Size Distributions ◽  
Diamond Grit ◽  
Before And After ◽  
Polycrystalline Diamond Compact ◽  
Insight Into

This paper is aimed at developing an efficient process, in terms of the material removal rate (MRR), for the lapping of polycrystalline diamond compact (PDC). A carbomer based viscoelastic vehicle with a non-reversible shear-thinning property was first developed for the effective suspension of diamond grits used for lapping. The effects of key process parameters on the MRR such as lapping pressure, speed, vehicle concentration, diamond grit concentration, and vehicle flow rate have been investigated through experiments. To obtain an insight into what happened to the diamond grits during lapping, diamond abrasives were reclaimed and sieved after lapping. The grit size distributions of diamond abrasives before and after the lapping were then compared.

Utilizing Small External Vibrational Sources to Increase Polishing Material Removal Rates

2015 ◽  
Author(s):  
M. Mainuddin ◽  
R. Keanini ◽  
B. Mullany
Keyword(s):  
Material Removal Rate ◽  
Material Removal ◽  
High Speed ◽  
Removal Rate ◽  
Low Cost ◽  
Power Input ◽  
Fused Silica ◽  
Removal Rates ◽  
Dc Motors ◽  
Scientific Attention

Although precision polishing of optical grade components using pitch based tools is still common practice, the process has not received the same level of scientific attention as other precision material removal processes. Building on previous research results, this paper demonstrates the relationship between low amplitude, broad spectrum vibrational power input and fused silica material removal rates obtained with different tool-polishing machine combinations. A low cost, easy to implement method of increasing vibrational power is presented and verified through polishing tests. The method uses small, off the shelf, high speed (>10 krpm), DC motors with eccentric masses (0.5 g and 4 g). Attachment of the battery driven motors to the underside of the platen and the workpiece holder increased the vibrational input from 0.7 W to 0.22 W resulting in an increase in the material removal rate from 0.96 mg/hr to 1.10 mg/hr. A method to attenuate process generated vibrations, and thus material removal rates, is also outlined. To achieve this the tool construction is modified by the addition of a cork layer between the substrate and the pitch layer. While this approach is not as flexible as that for increasing the vibrational power input, it successfully attenuated process vibrations (0.2 W to 0.14 W) and reduced the associated material removal rate (9.67 mg/hr to 6.13 mg/hr). The results outlined this paper demonstrate that recording and controlling process vibrations provides practitioners with viable process monitoring and optimization options.

Material removal rate for nanocomposite ceramics in ultrasound-aided electrolytic in process dressing

2016 ◽  
Vol 231 (21) ◽  
pp. 3987-3998 ◽  
Author(s):  
Fan Chen ◽  
Bo Zhao ◽  
Xiaofeng Jia ◽  
Xiaobo Wang
Keyword(s):  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Ductile Failure ◽  
Processing Parameters ◽  
Depth Of Cut ◽  
Grinding Parameters ◽  
Brittle Rupture ◽  
Ductile Machining ◽  
Optimal Setting

Nanocomposite ceramics possess beneficial mechanical and physical characteristics over traditional engineering ceramics; however, there is currently no effective method of machining nanocomposites ceramics. This paper proposes a new ultrasound-aided electrolytic in-process dressing machining method. There are many factors influencing the material removal rate in the ultrasound-aided electrolytic in-process dressing grinding. In order to optimize the processing parameters and guide practice, the material removal models are developed to simulate the material removal process based on ductile failure and brittle rupture models, and the influence of grinding parameters on material removal rates is obtained. With the model, the influence of grinding parameters on the material removal rate is analyzed by MATLAB. The analysis results are verified by the ultrasound-aided electrolytic in-process dressing grinding test: the material removal rate increases with the increase of grinding parameters; depth of cut significantly improves material removal rate, followed by axial feeding speed, wheel speed, and workpiece speed that are less important; considering the comprehensive processing effect, depth of cut is the key parameter with the optimal setting at about 3.73 µm. The ultrasound-aided electrolytic in-process dressing grinding test not only proves the reliability of the model, but also proves that the ultrasound-aided electrolytic in-process dressing grinding can improve the ductile machining effect, when compared to electrolytic in-process dressing grinding, which is suitable for mirror machining of the nanocomposite materials.

Experimental Study on the Ultraprecision Lapping Technology of the Copper Substrates for Alloy Films

2007 ◽  
Vol 359-360 ◽  
pp. 349-354
Author(s):  
Cong Rong Zhu ◽  
Qin Xu ◽  
Ju Long Yuan ◽  
Dong Hui Wen ◽  
Bing Hai Lv
Keyword(s):  
Surface Roughness ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Substrate Surface ◽  
Copper Substrate ◽  
Alloy Films ◽  
Accuracy Requirement ◽  
Polishing Pad ◽  
Surface Construction

To obtain the amorphous alloy films with superior properties by method of electrochemical deposition, the accuracy requirement for the copper substrates for Alloy Films is extraordinarily strict. The ultraprecision lapping technology for the copper substrate employing polyurethane polishing pad and flannel pad is studied in this paper, surface roughness, material removal rate and change process of surface construction of copper substrates are discussed. The influences of the different lapping parameters on the surface roughness, material removal rate and the influences of lapping load on copper substrate surface formation in the ultraprecision lapping process of copper substrate are both discussed. Experiment results show that the surface scratch will disappear by employing polyurethane polishing pad and flannel pad, and an extremely smooth surface of copper substrate with roughness 6nm Ra is obtained in the final finishing lapping process.

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