Chemical Effect on the Material Removal Rate in the CMP of Silicon Wafers
2010 ◽
Vol 126-128
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pp. 511-514
Keyword(s):
Ph Value
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This paper investigates the effects of some chemical factors on the material removal rate (MRR) in chemo-mechanical polishing (CMP) of Si (100) wafers. The CMP was carried out in alkaline slurry using alumina and ceria particles with hydrogen peroxide. When using the alumina particles, the MRR initially decreases with increasing the slurry pH value until pH = 9. Nevertheless, the application of the ceria particles increases the MRR before the pH of the slurry reaches 10. A higher slurry flow rate brings about a greater MRR.
2017 ◽
Vol 6
(4)
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pp. P113-P118
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Keyword(s):
2014 ◽
Vol 6
◽
pp. 624203
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Keyword(s):
2010 ◽
Vol 126-128
◽
pp. 469-474
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2009 ◽
Vol 404
◽
pp. 23-31
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Keyword(s):
2013 ◽
Vol 683
◽
pp. 616-620
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2014 ◽
Vol 625
◽
pp. 469-474
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2019 ◽
Vol 8
(5S3)
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pp. 372-375