Thermal Conductivity of the Diamond-Cu Composites with Chromium Addition

2011 ◽  
Vol 311-313 ◽  
pp. 287-292 ◽  
Author(s):  
Qiang Zuo ◽  
Wei Wang ◽  
Meng Sen Gu ◽  
Hai Jiang Fang ◽  
Li Ma ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Expansion ◽  
Heat Conduction ◽  
Hot Pressing ◽  
Coefficient Of Thermal Expansion ◽  
High Thermal Conductivity ◽  
Electronic Components ◽  
Pressing Method ◽  
Diamond Particles ◽  
Continuous Progress

The continuous progress of the electronic industries put forward a new requirement to the electronic components that must have an excellent heat conduction performance. Thus diamond-Cu composite is developed as a high thermal conductivity and low coefficient of thermal expansion material. A vacuum hot pressing method is chosen to prepare diamond-Cu composites and the thermal conductivity of the diamond-Cu composite is researched. The effects of different contents of chromium, the size of diamond particles and the content of diamond particles on the thermal conductivity of the diamond-Cu composite are discussed. The results demonstrate that the chromium element can improve the thermal conductivity of the composites and the thermal conductivity is largest when the content of chromium is 3 percent.

Thermal Characteristics of Cu Matrix-SiC Filler Composite Using Nano-Sized Cu Powder

2021 ◽  
Vol 21 (9) ◽  
pp. 4964-4967
Author(s):  
Bok-Hyun Oh ◽  
Choong-Hwan Jung ◽  
Heon Kong ◽  
Sang-Jin Lee
Keyword(s):  
Thermal Conductivity ◽  
Thermal Expansion ◽  
Thermal Expansion Coefficient ◽  
Expansion Coefficient ◽  
Coefficient Of Thermal Expansion ◽  
Liquid Phase Sintering ◽  
High Thermal Conductivity ◽  
Ceramic Filter ◽  
Ceramic Filler ◽  
Significant Difference

A Cu metal-ceramic filter composite with high thermal conductivity and a suitable thermal expansion coefficient was designed to be applied to high performance heat dissipation materials. The purpose of using the ceramic filler was to decrease the high coefficient of thermal expansion of Cu matrix utilizing the high thermal conductivity of Cu. In this study, a SiC ceramic filler powder was added to the Cu sol including Zn as a liquid phase sintering agent. The final complex was produced by applying a PVB polymer to prepare a homogeneous precursor followed by sintering in a reducing atmosphere. The pressureless sintered composite showed lower thermal conductivity than pure bulk Cu due to the some residual pores. In the case of the Cu–SiC composite in which 10 wt% of SiC filler was added, it showed a thermal conductivity of 100 W/m·°C and a thermal expansion coefficient of 13.3×10−6/°C. The thermal conductivity showed some difference from the theoretical calculated value due to the pores in the composite, but the thermal expansion coefficient did not show a significant difference.

scholarly journals Comparison of experimental and modelling results of thermal properties in Cu-AlN composite materials

2013 ◽  
Vol 61 (2) ◽  
pp. 507-514 ◽  
Author(s):  
M. Chmielewski ◽  
W. Weglewski
Keyword(s):  
Thermal Conductivity ◽  
Thermal Expansion ◽  
Thermal Properties ◽  
Metal Matrix ◽  
Coefficient Of Thermal Expansion ◽  
Analytical Models ◽  
Matrix Composites ◽  
Pressing Method ◽  
3D Space ◽  
Automotive Electronic

Abstract Copper-based composites could be widely used in automotive, electronic or electrical industry due to their very promising thermal properties. In the present paper, Cu-AlN metal matrix composites with ceramic volume fractions between 0.1 and 0.4 were fabricated by hot pressing method in vacuum. Dependence of the coefficient of thermal expansion (CTE) and the thermal conductivity (TC) on the chemical composition of composites has been investigated. The measured values of the thermal expansion coefficient have been compared with the analytical models’ predictions. A numerical model based on FEAP 7.5 in 3D space has been used to evaluate the influence of the porosity on the thermal properties (thermal conductivity) of the composite. A fairly good correlation between the FEM results and the experimental measurements has been obtained.

Synthesis of Copper/Silicon-Carbide Composites in a Thermodynamic Disequilibrium

2015 ◽  
Vol 825-826 ◽  
pp. 189-196 ◽  
Author(s):  
Maren Klement ◽  
Alwin Nagel ◽  
Oliver Lott
Keyword(s):  
Thermal Conductivity ◽  
Silicon Carbide ◽  
Thermal Expansion ◽  
Coefficient Of Thermal Expansion ◽  
Quantitative Description ◽  
Casting Process ◽  
Heat Sinks ◽  
High Thermal Conductivity ◽  
Structure Property ◽  
Mechanical Loads

Composites with interpenetrating metal-ceramic microstructures (IPC, interpenetrating composites) can be tailored for specific applications, such as high thermal conductivity combined with low thermal expansion, e.g. for heat sinks. Heat sinks are required in power electronic devices or in future fusion reactor technology where extreme conditions and high cyclic thermo-mechanical loads appear. Due to its rigid ceramic backbone IPCs are expected to reveal high thermal stability. Pure silicon carbide exhibits high thermal conductivity, low coefficient of thermal expansion, high corrosion and wear resistance. But it is also known as a very brittle material when mechanical loads are applied. Thus a composite of silicon carbide with ductile and highly conductive copper seems to be a promising new material for a number of applications.This paper reports the synthesis of Cu-SiC composites using a unique high temperature squeeze casting process (HTSC). Microstructural design of SiC-preforms with open porosity and its synthesis progress is reported. Influence of preform properties, temperature, pressure and atmosphere during HTSC were investigated. A qualitative and quantitative description of the microstructure of the composites and their composition allows the creation of structure-property correlations that take effect retroactively to the casting process.

scholarly journals Improvement in Mechanical and Thermal Properties of Graphite Flake/Cu Composites by Introducing TiC Coating on Graphite Flake Surface

Metals ◽  
2019 ◽  
Vol 9 (5) ◽  
pp. 519 ◽  
Author(s):  
Ren Zhang ◽  
Xinbo He ◽  
Qian Liu ◽  
Xuanhui Qu
Keyword(s):  
Thermal Conductivity ◽  
Thermal Expansion ◽  
Thermal Properties ◽  
Hot Pressing ◽  
Bending Strength ◽  
Coefficient Of Thermal Expansion ◽  
Packaging Material ◽  
Graphite Flake ◽  
Mechanical And Thermal Properties ◽  
Electronic Packaging Material

In this work, TiC coating was successfully deposited on a graphite flake surface via molten salt technique, for the purpose of promoting the interfacial connection between Cu and graphite flake. Vacuum hot pressing was then employed to prepare TiC-coated graphite flake/Cu composite. The results indicate that introducing TiC coating on graphite flake surface can evidently reduce the pores and gaps at the interface, resulting in a significant improvement on the bending strength. When the TiC-coated graphite flake content is 60 vol%, the bending strength is increased by 58% compared with the uncoated one. The coefficient of thermal expansion dropped from 6.0 ppm·K−1 to 4.4 ppm·K−1, with the corresponding thermal conductivity as high as 571 W·m−1·K−1. The outstanding thermal conductivity, apposite coefficient of thermal expansion, as well as superior processability, make TiC-coated graphite flake/Cu composite a satisfactory electronic packaging material with vast prospect utilized in microelectronic industry.

scholarly journals Thermal Properties of Copper Matrix-Ceramic Filler Composite Prepared by Polymer Solution Method

2022 ◽  
Vol 60 (1) ◽  
pp. 68-75
Author(s):  
Bok-Hyun Oh ◽  
Chung-Il Ma ◽  
Ji-Yeon Kwak ◽  
Heon Kong ◽  
Sang-Jin Lee
Keyword(s):  
Thermal Conductivity ◽  
Thermal Expansion ◽  
Thermal Expansion Coefficient ◽  
Expansion Coefficient ◽  
Heat Dissipation ◽  
Coefficient Of Thermal Expansion ◽  
High Thermal Conductivity ◽  
Ceramic Filler ◽  
Aqueous Solvent ◽  
Significant Difference

A copper (Cu) metal-ceramic filler composite with high thermal conductivity and a suitable thermal expansion coefficient was designed for application as a high-performance heat dissipation material. The purpose of the designed material was to utilize the high thermal conductivity of Cu while lowering its high coefficient of thermal expansion by using a ceramic filler. In this study, a Cu-sol containing a certain amount of AlN or SiC ceramic filler was prepared using a non-aqueous solvent. A complex was produced by applying a PVB polymer to prepare a homogeneous precursor. The composite sintered without pressure in a reducing atmosphere showed low thermal conductivity due to residual pores, but the hot press sintered composite exhibited improved thermal conductivity. The Cu composite with 30 wt% AlN filler added exhibited a thermal conductivity of 290 W/m·K and a thermal expansion coefficient of 9.2 × 10-6/oC. Due to the pores in the composite, the thermal conductivity showed some difference from the theoretical value calculated from the rule of mixture. However, the thermal expansion coefficient did not show any significant difference.

High thermal conductivity graphite nanoplatelet/UHMWPE nanocomposites

RSC Advances ◽  
2015 ◽  
Vol 5 (46) ◽  
pp. 36334-36339 ◽  
Author(s):  
Junwei Gu ◽  
Nan Li ◽  
Lidong Tian ◽  
Zhaoyuan Lv ◽  
Qiuyu Zhang
Keyword(s):  
Thermal Conductivity ◽  
Molecular Weight ◽  
Ball Milling ◽  
High Molecular Weight ◽  
Hot Pressing ◽  
High Thermal Conductivity ◽  
Graphite Nanoplatelets ◽  
Pressing Method ◽  
Ultra High Molecular Weight ◽  
Mechanical Ball Milling

High thermal conductivity graphite nanoplatelets/ultra high molecular weight polyethylene (GNPs/UHMWPE) nanocomposites are fabricated via mechanical ball milling followed by a hot-pressing method.

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