Research on Recycling Method of Discarded PCB Based on Cost-Profit Model

2011 ◽  
Vol 356-360 ◽  
pp. 1860-1866
Author(s):  
Yuan Li ◽  
Shou Xu Song ◽  
Guang Fu Liu ◽  
Tao Liu
Keyword(s):  
Economic Analysis ◽  
Environmental Protection ◽  
Printed Circuit Board ◽  
Evaluation Model ◽  
Optimal Configuration ◽  
Circuit Board ◽  
Mechanical Recycling ◽  
Profit Model ◽  
Printed Circuit ◽  
Important Significance

The efficient reclamation of printed circuit board (PCB) is of important significance to environmental protection, optimal configuration of resources and development of circulation economy. In the paper, several important physical mechanical recycling strategies of PCB were analysed, and a cost-profit evaluation model for these recycling strategies was established to evaluate reclamation profit quantitatively. With one specific recycling example, an accurate economic analysis of it was given by the use of the evaluation model. Finally, the best recycling strategy of the mainboard was acquired and some suggestions were given to improve the reclamation economy.

scholarly journals Estimating Recycling Return of Integrated Circuits Using Computer Vision on Printed Circuit Boards

2021 ◽  
Vol 11 (6) ◽  
pp. 2808
Author(s):  
Leandro H. de S. Silva ◽  
Agostinho A. F. Júnior ◽  
George O. A. Azevedo ◽  
Sergio C. Oliveira ◽  
Bruno J. T. Fernandes
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Electronic Waste ◽  
Decision Criterion ◽  
Economic Feasibility ◽  
Electronic Equipment ◽  
Circuit Board ◽  
Mechanical Recycling ◽  
Printed Circuit

The technological growth of the last decades has brought many improvements in daily life, but also concerns on how to deal with electronic waste. Electrical and electronic equipment waste is the fastest-growing rate in the industrialized world. One of the elements of electronic equipment is the printed circuit board (PCB) and almost every electronic equipment has a PCB inside it. While waste PCB (WPCB) recycling may result in the recovery of potentially precious materials and the reuse of some components, it is a challenging task because its composition diversity requires a cautious pre-processing stage to achieve optimal recycling outcomes. Our research focused on proposing a method to evaluate the economic feasibility of recycling integrated circuits (ICs) from WPCB. The proposed method can help decide whether to dismantle a separate WPCB before the physical or mechanical recycling process and consists of estimating the IC area from a WPCB, calculating the IC’s weight using surface density, and estimating how much metal can be recovered by recycling those ICs. To estimate the IC area in a WPCB, we used a state-of-the-art object detection deep learning model (YOLO) and the PCB DSLR image dataset to detect the WPCB’s ICs. Regarding IC detection, the best result was obtained with the partitioned analysis of each image through a sliding window, thus creating new images of smaller dimensions, reaching 86.77% mAP. As a final result, we estimate that the Deep PCB Dataset has a total of 1079.18 g of ICs, from which it would be possible to recover at least 909.94 g of metals and silicon elements from all WPCBs’ ICs. Since there is a high variability in the compositions of WPCBs, it is possible to calculate the gross income for each WPCB and use it as a decision criterion for the type of pre-processing.

scholarly journals Advanced Recovery Techniques for Waste Materials from IT and Telecommunication Equipment Printed Circuit Boards

2019 ◽  
Vol 12 (1) ◽  
pp. 74 ◽  
Author(s):  
Horațiu Vermeșan ◽  
Ancuța-Elena Tiuc ◽  
Marius Purcar
Keyword(s):  
Flame Retardants ◽  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Raw Materials ◽  
Circuit Board ◽  
Chain Process ◽  
Mechanical Recycling ◽  
Printed Circuit ◽  
Telecommunication Equipment ◽  
Recycling Techniques

Waste from information technology (IT) and telecommunication equipment (WITTE) constitutes a significant fraction of waste from electrical and electronic equipment (WEEE). The presence of rare metals and hazardous materials (e.g., heavy metals or flame retardants) makes the necessary recycling procedures difficult and expensive. Important efforts are being made for Waste Printed Circuit Board (WPCB) recycling because, even if they only amount to 5–10% of the WITTE weight, they constitute up to 80% of the recovered value. This paper summarizes the recycling techniques applicable to WPCBs. In the first part, dismantling and mechanical recycling techniques are presented. Within the frame of electro-mechanical separation technology, the chain process of shredding, washing, and sieving, followed by one or a combination of magnetic, eddy current, corona electrostatic, triboelectrostatic, or gravity separation techniques, is presented. The chemical and electrochemical processes are of utmost importance for the fine separation of metals coming from complex equipment such as WPCBs. Thermal recycling techniques such as pyrolysis and thermal treatment are presented as complementary solutions for achieving both an extra separation stage and thermal energy. As the recycling processes of WPCBs require adequate, efficient, and ecological recycling techniques, the aim of this survey is to identify and highlight the most important ones. Due to the high economic value of the resulting raw materials relative to the WPCBs’ weight and composition, their recycling represents both a necessary environmental protection action, as well as an economic opportunity.

Recycling process assessment of mechanical recycling of printed circuit board

2005 ◽  
Vol 12 (2) ◽  
pp. 157-161 ◽  
Author(s):  
Jun-qi Pan ◽  
Zhi-feng Liu ◽  
Guang-fu Liu ◽  
Shu-wang Wang ◽  
Hai-hong Huang
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Process Assessment ◽  
Recycling Process ◽  
Mechanical Recycling ◽  
Printed Circuit

scholarly journals PRINTED CIRCUIT BOARD RECYCLING: PHYSICOCHEMICAL AND ECONOMIC ANALYSIS OF METALS

2019 ◽  
Vol 16 (4) ◽  
pp. 453-463
Author(s):  
Marcos Paulo Kohler Caldas ◽  
Monica Maria Jiménez Correa ◽  
Flávia Paulucci Cianga Silvas ◽  
Viviane Tavares de Moraes ◽  
Jorge Alberto Soares Tenório ◽  
...  
Keyword(s):  
Economic Analysis ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit

Characteristics of Radiated Emission from a Printed Circuit Board with a Slit

2012 ◽  
Vol 132 (6) ◽  
pp. 404-410 ◽  
Author(s):  
Kenichi Nakayama ◽  
Kenichi Kagoshima ◽  
Shigeki Takeda
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Radiated Emission

Confirming the Signal Integrity in Transmission of Digital Signals on Microstrip Straight Circuits via the Eye Diagrams

2014 ◽  
Vol 5 (1) ◽  
pp. 737-741
Author(s):  
Alejandro Dueñas Jiménez ◽  
Francisco Jiménez Hernández
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Board ◽  
Signal Integrity ◽  
High Volume ◽  
Information Storage ◽  
Circuit Board ◽  
Electromagnetic Simulation ◽  
Electronic Systems ◽  
Digital Signals ◽  
Printed Circuit

Because of the high volume of processing, transmission, and information storage, electronic systems presently requires faster clock speeds tosynchronizethe integrated circuits. Presently the “speeds” on the connections of a printed circuit board (PCB) are in the order of the GHz. At these frequencies the behavior of the interconnects are more like that of a transmission line, and hence distortion, delay, and phase shift- effects caused by phenomena like cross talk, ringing and over shot are present and may be undesirable for the performance of a circuit or system.Some of these phrases were extracted from the chapter eight of book “2-D Electromagnetic Simulation of Passive Microstrip Circuits” from the corresponding author of this paper.

Root Cause Analysis of a Connector Time-Delayed Fracture

2015 ◽  
Author(s):  
Prabjit Singh ◽  
Ying Yu ◽  
Robert E. Davis
Keyword(s):  
Printed Circuit Board ◽  
Ceramic Substrate ◽  
Circuit Board ◽  
Delayed Fracture ◽  
Ceramic Substrates ◽  
Printed Circuit ◽  
Root Cause ◽  
Chip Carrier ◽  
Electrical Connections ◽  
Grain Boundary Grooves

Abstract A land-grid array connector, electrically connecting an array of plated contact pads on a ceramic substrate chip carrier to plated contact pads on a printed circuit board (PCB), failed in a year after assembly due to time-delayed fracture of multiple C-shaped spring connectors. The land-grid-array connectors analyzed had arrays of connectors consisting of gold on nickel plated Be-Cu C-shaped springs in compression that made electrical connections between the pads on the ceramic substrates and the PCBs. Metallography, fractography and surface analyses revealed the root cause of the C-spring connector fracture to be plating solutions trapped in deep grain boundary grooves etched into the C-spring connectors during the pre-plating cleaning operation. The stress necessary for the stress corrosion cracking mechanism was provided by the C-spring connectors, in the land-grid array, being compressed between the ceramic substrate and the printed circuit board.

Application of Lock-in Thermography on PCB for Fault Localization and Validation of Failure Mechanism Due to External Discrete Component Variation

2010 ◽  
Author(s):  
William Ng ◽  
Kevin Weaver ◽  
Zachary Gemmill ◽  
Herve Deslandes ◽  
Rudolf Schlangen
Keyword(s):  
Failure Mechanism ◽  
Integrated Circuit ◽  
Printed Circuit Board ◽  
Hot Spot ◽  
Circuit Board ◽  
Discrete Component ◽  
Printed Circuit ◽  
Thermal Signature ◽  
Lock In

Abstract This paper demonstrates the use of a real time lock-in thermography (LIT) system to non-destructively characterize thermal events prior to the failing of an integrated circuit (IC) device. A case study using a packaged IC mounted on printed circuit board (PCB) is presented. The result validated the failing model by observing the thermal signature on the package. Subsequent analysis from the backside of the IC identified a hot spot in internal circuitry sensitive to varying value of external discrete component (inductor) on PCB.

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