Systematic Direct Solid Modeling Approach for Surface Micromachined MEMS

2012 ◽  
Vol 433-440 ◽  
pp. 3130-3137 ◽  
Author(s):  
Jian Hua Li ◽  
Yu Sheng Liu ◽  
Hao Ling ◽  
Wei Bin Guo ◽  
Gao Qi He
Keyword(s):  
Local Variation ◽  
Solid Modeling ◽  
Design Activity ◽  
Creative Design ◽  
Mems Devices ◽  
Layer Model ◽  
Modeling Approach ◽  
Practical Model ◽  
Mems Device ◽  
Direct Solid

Current MEMS design methods do not fulfill the needs of emerging complex MEMS devices. In this paper, a systematic direct solid modeling approach for surface micromachined MEMS design is proposed. In this approach, practical model of a surface micromachined MEMS device, designed in a traditional CAD environment, is simplified firstly; after simplification, masks and process sequences are generated through solid-based mask synthesis; then local variation is used to refining the 3D layer model; finally masks and process sequences are verified in rough simulation and accurate simulation. The approach aims at enabling designers to focus on creative design activity in an intuitive mode.

A Microcontroller Approach to Measuring Transmissibility of MEMS Devices

2015 ◽  
Vol 2015 (DPC) ◽  
pp. 001564-001593
Author(s):  
Chong Li ◽  
Yixuan Wu ◽  
Haoyue Yang ◽  
Luke L. Jenkins ◽  
Robert N. Dean ◽  
...  
Keyword(s):  
Resonant Frequency ◽  
Quality Factor ◽  
Real Time ◽  
High Speed ◽  
Mechanical Quality Factor ◽  
Quantization Noise ◽  
Mems Devices ◽  
Input And Output ◽  
Mechanical Quality ◽  
Mems Device

The transmissibility reveals two very useful characteristics of a micro-electro-mechanical systems (MEMS) device, the resonant frequency and the mechanical quality factor. Real time knowledge on these two important factors can enhance application performance or avoid potential problems from environmental disturbances due to fabrication tolerances and the resulting operational differences in otherwise identical devices. Expensive laboratory equipment is typically used to measure the transmissibility. However, these test systems are not readily adaptable to field use. Therefore, it is important to be able to measure the transmissibility using a real time technique with a simplified test setup. This study proposes a technique that can compute the transmissibility in real time using a low cost microcontroller. This technique utilizes two laser vibrometers to detect the input and output motions of the proof mass in a MEMS device, which are fed to high speed 500 KHz analog to digital converters (ADC) in the microcontroller. A filtering step is performed to decrease noise. After the sampling and pre-filtering, a Fast Fourier Transform (FFT) is performed to convert the time-domain signals to frequency domain signals. The amplitude of the output signal at each frequency is divided by the amplitude of the corresponding input signal at each frequency to obtain the transmissibility. To overcome the difficulties resulting from measurement and quantization noise, a recursive calculating algorithm and a de-quantization filter are introduced. The recursive calculating process guarantees that the system updates the results continually, which results in a transmissibility plot covering the entire bandwidth. The de-quantization filter considers the validity of the data and performs the transmissibility division step accordingly. A cantilevered structure was chosen as the device-under-test to verify and evaluate this technique. The cantilevered device was attached to an electromechanical shaker system for vibratory stimulation. Two laser vibrometers were used to detect the input and output motion and this data was fed into a microcontroller. The microcontroller was STM32F407, which is 32-bit and 168 MHz controller. The tests demonstrated that this technique can measure the transmissibility and therefore the resonant frequency and mechanical quality factor accurately compared to a professional signal analyzer.

Low-Temperature Indium Bonding for MEMS Devices

2012 ◽  
Vol 2012 (DPC) ◽  
pp. 002543-002566
Author(s):  
Daniel Harris ◽  
Robert Dean ◽  
Ashish Palkar ◽  
Mike Palmer ◽  
Charles Ellis ◽  
...  
Keyword(s):  
Electron Beam ◽  
Low Temperature ◽  
Room Temperature ◽  
Electron Beam Evaporation ◽  
Mems Devices ◽  
Microfabrication Technique ◽  
Mems Device ◽  
Low Temperature Bonding ◽  
Bonding Technique ◽  
Si Wafer

Low–temperature bonding techniques are of great importance in fabricating MEMS devices, and especially for sealing microfluidic MEMS devices that require encapsulation of a liquid. Although fusion, thermocompression, anodic and eutectic bonding have been successfully used in fabricating MEMS devices, they require temperatures higher than the boiling point of commonly used fluids in MEMS devices such as water, alcohols and ammonia. Although adhesives and glues have been successfully used in this application, they may contaminate the fluid in the MEMS device or the fluid may prevent suitable bonding. Indium (In) possesses the unusual property of being cold weldable. At room temperature, two sufficiently clean In surfaces can be cold welded by bringing them into contact with sufficient force. The bonding technique developed here consists of coating and patterning one Si wafer with 500A Ti, 300A Ni and 1 μm In through electron beam evaporation. A second wafer is metallized and patterned with a 500A Ti and 1 μm Cu by electron beam evaporation and then electroplated with 10 μm of In. Before the In coated sections are brought into contact, the In surfaces are chemically cleaned to remove indium-oxide. Then the sections are brought into contact and held under sufficient pressure to cold weld the sections together. Using this technique, MEMS water-filled and mercury-filled microheatpipes were successfully fabricated and tested. Additionally, this microfabrication technique is useful for fabricating other types of MEMS devices that are limited to low-temperature microfabrication processes.

Development of Bio-MEMS Device for Cell Cluster Patterning by Using Dielectrophoresis Method

2013 ◽  
Author(s):  
S. Murakami ◽  
Y. Morita ◽  
E. Nakamachi
Keyword(s):  
Cell Activation ◽  
Cell Patterning ◽  
Mems Devices ◽  
Axon Extension ◽  
Positive Effects ◽  
Research Fields ◽  
Novel Approach ◽  
Patterning Technique ◽  
Mems Device ◽  
Fundamental Mechanism

Recently, the investigation of cell-activation and tissue regeneration process has shown the great progress in the biomedical and biomechanical research fields. In this study fabricated Biomedical-Micro Electric Mechanical System (Bio-MEMS) to examine accurately the cell activation by introducing the cell patterning assignment technique, which consists of the photolithograph method to generate the MEMS device and the cell patterning technique by using the dielectrophoresis (DEP) method. In the development of Bio-MEMS devices for cell culture and micro-bioreactor system, unresolved subjects, 1) the fundamental mechanism of cell activation, 2) the flow control of culture medium 3) the accurate cell pattern technique and 4) the implementation of positive DEP methods, are remained. In this study, we fabricate 2-D patterns of point by using the DEP method introducing the positive effects and the trap method by employing the gravity effect and the adhesion technique, to reveal the fundamental mechanism of cell activations, such as the nerve cell axon extension. We succeed to establish the cell patterning technique by using a novel electrode design technique, such as 2-D patterns of point. The results is shown that our novel approach using comprehensive designed electrodes is superior to cell patterning. Therefore, our device able to produce neural network consists of a large number of cells.

Defect-Induced Shifts in the Elastic Constants of Silicon

2002 ◽  
Vol 741 ◽  
Author(s):  
Clark L. Allred ◽  
Jeffrey T. Borenstein ◽  
Marc S. Weinberg ◽  
Xianglong Yuan ◽  
Martin Z. Bazant ◽  
...  
Keyword(s):  
Elastic Constants ◽  
Atomistic Simulations ◽  
Device Performance ◽  
Mems Devices ◽  
Materials Properties ◽  
Radiation Induced ◽  
Mems Device ◽  
The Difference ◽  
Induced Defects ◽  
Constant Shift

ABSTRACTAs MEMS devices become ever more sensitive, even slight shifts in materials properties can be detrimental to device performance. Radiation-induced defects can change both the dimensions and mechanical properties of MEMS materials, which will be of concern to designers of MEMS for applications involving radiation exposure, such as those in a reactor environment or in space. We have performed atomistic simulations of the effect that defects and amorphous regions, such as could be produced by radiation damage, have on the elastic constants of silicon. We have then applied the results of the elastic constant shift calculations to a hypothetical MEMS device, and calculated the difference that would be generated by this effect.

Tele-Operated Microsystems Laboratory

2009 ◽  
Author(s):  
Ganapathy Sivakumar ◽  
Matt Mulsow ◽  
Aaron Mellinger ◽  
Shelby Lacouture ◽  
Tim Dallas
Keyword(s):  
Laboratory Testing ◽  
Main Idea ◽  
Mems Devices ◽  
Internet Connectivity ◽  
Detailed Understanding ◽  
Micro Scale ◽  
Electrostatic Mems ◽  
Mems Device ◽  
Networking Technologies ◽  
Two Degree Of Freedom

This paper presents the architecture for a remotely controllable and interactive MEMS laboratory. There have been significant advances in computer simulations of MEMS devices, but laboratory testing of devices still plays a crucial role in developing a detailed understanding of MEMS performance. New computer and networking technologies, have allowed the construction of remotely controllable labs for fields spanning education and technology. The main idea of this work is to allow a user in any part of the globe to carry out real-time experiments on a MEMS device using a computer with internet connectivity. The user also has the option of using a commercially available haptic device to feel the magnified nano/micro-scale forces associated with the devices while actuating them. The present interface was tested on a two degree-of-freedom (XY) electrostatic MEMS positioning microstage and a MEMS microgripper.

Nonlinear Time-Series Prediction Using a Single MEMS Reservoir

2020 ◽  
Author(s):  
Mohammad H. Hasan ◽  
Fadi Alsaleem
Keyword(s):  
Moving Average ◽  
System Modeling ◽  
Time Series Prediction ◽  
Mems Devices ◽  
Temporal Dependence ◽  
Dynamical System Modeling ◽  
Random Modulation ◽  
Auto Regressive ◽  
Mems Device ◽  
Computing Scheme

Abstract In this work, we show the computational potential of MEMS devices by predicting the dynamics of a 10th order nonlinear auto-regressive moving average (NARMA10) dynamical system. Modeling this system is considered complex due to its high nonlinearity and dependency on its previous values. To model the NARMA10 system, we used a reservoir computing scheme by utilizing one MEMS device as a reservoir, produced by the interaction of 100 virtual nodes. The virtual nodes are attained by sampling the input of the MEMS device and modulating this input using a random modulation mask. The interaction between virtual nodes within the system was produced through delayed feedback and temporal dependence. Using this approach, the MEMS device was capable of adequately capturing the NARMA10 response with a normalized root mean square error (NRMSE) = 6.18% and 6.43% for the training and testing sets, respectively. In practice, the MEMS device would be superior to simulated reservoirs due to its ability to perform this complex computing task in real time.

Low Cost Metal Mini-Cap Process for Suspended MEMS Device Packaging

2005 ◽  
Author(s):  
Wei Chung ◽  
Leonardo Wang ◽  
W. Fang
Keyword(s):  
Low Cost ◽  
Selective Etching ◽  
Mems Devices ◽  
Wafer Level ◽  
Carrier Wafer ◽  
Mems Device ◽  
Die Bonding ◽  
To Come ◽  
Wafer Level Package

A new wafer capping process is investigated in this study. The objective of this study is to come out a simple and low cost wafer capping process to make the capped MEMS device wafers “transparent” to traditional IC assembly processes. The carrier wafers with metal mini-caps are bonded on the MEMS device wafers through solder bonding, and the mini-caps are then transferred and left on the MEMS device wafer through a selective etching of the carrier wafers. The metal mini-cap capped device wafers are virtually of the same thickness as original ones; in addition, the transferred metal mini-caps provide a mechanical protection to the MEMS devices during the consequent assembly processes such as wafer dicing, die bonding, molding, etc. With an additional design of 2nd level interconnection on the mini-cap carrier wafer, the transferred MEMS device wafers can be singulated and become a wafer level package with compliant leads.

Computational Simulation on Thermal Aspect of Micro-Fabrication Process for MEMS Device

2005 ◽  
Author(s):  
Raymond K. Yee ◽  
Gabriel C. Chan
Keyword(s):  
Residual Stresses ◽  
Silicon Dioxide ◽  
Computational Simulation ◽  
Fabrication Process ◽  
Computational Method ◽  
Mems Devices ◽  
Micro Fabrication ◽  
Polysilicon Film ◽  
Mems Device ◽  
Micro Cantilever

The inherent residual stresses and strains from micro fabrication process can have profound effects on the functionality and reliability of MEMS devices. Surface micromachining fabrication involves a series of sequential steps of addition and subtraction of materials through deposition and etching techniques. For instance, when a typical micro cantilever beam is fabricated, layers of silicon dioxide and polysilicon structures are deposited on top of silicon substrate. Part of the silicon dioxide layer is chemically etched out before the deposition of polysilicon layer. Due to mismatch of coefficients of thermal expansion (CTE) in layered structure, thermal cycle loading during micromachining fabrication can induce significant residual stress within a part from thermal aspect alone. Computational method is used to simulate the micromachining fabrication process for MEMS and to predict the residual stresses/strains in a selected MEMS device. The focus of the study is on the thermal aspect of deposition and etching processes during micromachining. Particular attention is placed on the effects of deposition temperature and polysilicon film thickness on resulting residual stresses.

Actuation of MEMS by Light: An Optical Actuator

2001 ◽  
Author(s):  
Marc Sulfridge ◽  
Taher Saif ◽  
Norman Miller ◽  
Keith O’Hara
Keyword(s):  
Heat Transfer ◽  
Experimental Evidence ◽  
Radiation Pressure ◽  
Total Power ◽  
Transfer Model ◽  
Mems Devices ◽  
Speed Of Light ◽  
Reflected Light ◽  
Mems Device ◽  
Actuation Method

Abstract This paper presents experimental evidence that MEMS devices may be manipulated using beams of light. Light possesses momentum, and hence it imparts a force equal to 2W/c when perfectly reflected by a surface. Here W is the total power of the reflected light, and c is the speed of light. The radiation pressure of light can be quite significant to MEMS devices. This actuation method is demonstrated, both in air and in vacuum, by switching the state of a bi-stable MEMS device. The associated heat transfer model is also presented.

Effects of Die Attachment Induced Stress on the Reliability of a Packaged MEMS Device

2009 ◽  
Vol 6 (3) ◽  
pp. 164-171
Author(s):  
Chad B. O'Neal ◽  
Ajay P. Malshe ◽  
William F. Schmidt ◽  
Matthew H. Gordon ◽  
William D. Brown
Keyword(s):  
Microelectromechanical Systems ◽  
Coefficient Of Thermal Expansion ◽  
Cyanate Ester ◽  
Mems Devices ◽  
Die Attachment ◽  
Induced Stress ◽  
Device Reliability ◽  
Operational Lifetime ◽  
Baseline Values ◽  
Mems Device

A microelectromechanical systems (MEMS) actuator was selected to study the effects of packaging induced stress on device reliability. In this work, MEMS devices were obtained and packaged using cyanate ester, 96.5/3.5 Sn/Ag, and 92.5/5/2.5 Pb/Sn/Ag die attachment materials. The die attachment materials were then cured or reflowed appropriately and cooled to room temperature which induced stress through the coefficient of thermal expansion mismatches between the silicon die and alumina package. In this work, a MEMS microengine developed at Sandia National Laboratories, which is a device that has been well studied, was selected as a test vehicle to understand the effects of various die attachment solders and related processes parameters on the ultimate functionality of the packaged MEMS microengine. Particularly, the operational lifetime of these devices was measured by testing these devices to failure. These lifetimes were then compared with baseline values to determine the effect of stress on these devices. The maximum stress values observed in these studies ranged from 11–23 MPa based on the die attachment material used for cyanate ester to Pb/Sn/Ag solder, respectively. About 50% of the total population tested failed between 105 and 106 cycles, while 25% failed above 106 cycles and the remaining 25% failed below 105 cycles. The reliability results agreed well with previous results. The effect of stress did not seem to adversely affect the device lifetimes for this class of MEMS device, suggesting that these ranges of solders can be safely used to package MEMS devices.

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