Diamond Coated End Mills in Machining Silicon Carbide

2012 ◽  
Vol 576 ◽  
pp. 531-534 ◽  
Author(s):  
Mohamed Konneh ◽  
Mohammad Iqbal ◽  
Nik Mohd Azwan Faiz

Silicon Carbide (SiC) is a type of ceramic that belongs to the class of hard and brittle material. Machining of ceramic materials can result in surface alterations including rough surface, cracks, subsurface damage and residual stresses. Efficient milling of high performance ceramic involves the selection of appropriate operating parameters to maximize the material removal rate (MRR) while maintaining the low surface finish and limiting surface damage. SiC being a ceramic material, its machining poses a real problem due to its low fracture toughness, making it very sensitive to crack. The paper discusses milling of silicon carbide using diamond coated end mill under different machining conditions in order to determine the surface roughness parameter, Rt after the machining processes and to establish a relationship between the machining parameters and response variables. Based on the surface roughness carried out the lowest Rt obtained is 0.46 µm.

2012 ◽  
Vol 576 ◽  
pp. 535-538 ◽  
Author(s):  
Mohamed Konneh ◽  
Mohammad Iqbal ◽  
M. Asnawi B. Kasim ◽  
Nurbahiah B. Mohd Isa

The primary applications of silicon carbide SiC-based materials, which include include micro-structures, optoelectronic devices, high temperature electronics, radiation hard electronics and high power/high frequency devices to name a few have necessitated the need for machining SiC. The paper presents the outcome of milling of silicon carbide using diamond coated end mill under different machining conditions in order to determine the surface roughness parameter after the machining processes. Relationship between the machining parameters and response variables has been established and a mathematical model has been predicted, the minimum roughness value, Rz being 0.19 µm.


2011 ◽  
Vol 223 ◽  
pp. 804-812
Author(s):  
R. S. Jadoun

The ultrasonic drilling (USD) has been used in the manufacture of the hard, fragile, difficult to cut, nonconductive ceramic materials. In this study, the mathematical models of material removal rate (MRR) and surface roughness (SR) have been obtained for the machinability evaluation in the USD process of aluminum oxide-based ceramic material. The experimental plan adopts the face centered central composite design (CCD). The mathematical models using the response surface methodology (RSM) are developed so as to investigate the influences of three machining parameters, including the power rating, grit size and slurry concentration on the performance characteristics of MRR and SR. It has been proved that the proposed mathematical models in this study would fit and predict values of the performance characteristics, which would be close to the readings recorded in experiment with a 95% confidence level. The significant parameters that critically affect the performance characteristics are examined.


2015 ◽  
Vol 1101 ◽  
pp. 393-396
Author(s):  
Mohammad Ahsan Habib ◽  
Md. Anayet U. Patwari ◽  
Koushik Alam Khan ◽  
A.N.M. Amanullah Tomal

For cost reduction and quality improvement of machining products, optimum output machining parameters such as material removal rate, tool wear ratio and surface roughness is very essential. Moreover, these output parameters are strongly depends on the precision of the machine tool as well as the input machining parameters. In this paper, a hybrid model of Artificial Bee Colony (ABC), which is motivated by the intelligent behavior of honey bees with Response Surface Methodology (RSM), has been developed for optimizing the surface roughness of stainless steel during turning operation. The predicted optimal value of surface roughness of stainless steel is further confirmed by conducting supplementary experiments. Finally, the performance of this algorithm is evaluated in comparison with desirability analysis. The performance of ABC is at par with that of desirability analysis for different parametric conditions.


Machines ◽  
2020 ◽  
Vol 8 (1) ◽  
pp. 12 ◽  
Author(s):  
Angelos P. Markopoulos ◽  
Emmanouil-Lazaros Papazoglou ◽  
Panagiotis Karmiris-Obratański

Although electrical discharge machining (EDM) is one of the first established non-conventional machining processes, it still finds many applications in the modern industry, due to its capability of machining any electrical conductive material in complex geometries with high dimensional accuracy. The current study presents an experimental investigation of ED machining aluminum alloy Al5052. A full-scale experimental work was carried out, with the pulse current and pulse-on time being the varying machining parameters. The polishing and etching of the perpendicular plane of the machined surfaces was followed by observations and measurements in optical microscope. The material removal rate (MRR), the surface roughness (SR), the average white layer thickness (AWLT), and the heat affected zone (HAZ) micro-hardness were calculated. Through znalysis of variance (ANOVA), conclusions were drawn about the influence of machining conditions on the EDM performances. Finally, semi empirical correlations of MRR and AWLT with the machining parameters were calculated and proposed.


2005 ◽  
Vol 867 ◽  
Author(s):  
J. J. McMahon ◽  
F. Niklaus ◽  
R. J. Kumar ◽  
J. Yu ◽  
J.Q. Lu ◽  
...  

AbstractWafer-level three dimensional (3D) IC technology offers the promise of decreasing RC delays by reducing long interconnect lines in high performance ICs. This paper focuses on a viafirst 3D IC platform, which utilizes a back-end-of-line (BEOL) compatible damascene-patterned layer of copper and Benzocyclobutene (BCB). This damascene-patterned copper/BCB serves as a redistribution layer between two fully fabricated wafer sets of ICs and offers the potential of high bonding strength and low contact resistance for inter-wafer interconnects between the wafer pair. The process would thus combine the electrical advantages of 3D technology using Cu-to-Cu bonding with the mechanical advantages of 3D technology using BCB-to-BCB bonding.In this work, partially cured BCB has been evaluated for copper damascene patterning using commercially available CMP slurries as a key process step for a via-first 3D process flow. BCB is spin-cast on 200 mm wafers and cured at temperatures ranging from 190°C to 250°C, providing a wide range of crosslink percentage. These films are evaluated for CMP removal rate, surface damage (surface scratching and embedded abrasives), and planarity with commercially available copper CMP slurries. Under baseline process parameters, erosion, and roughness changes are presented for single-level damascene test patterns. After wafers are bonded under controlled temperature and pressure, the bonding interface is inspected optically using glass-to-silicon bonded wafers, and the bond strength is evaluated by a razor blade test.


2013 ◽  
Vol 535-536 ◽  
pp. 314-317 ◽  
Author(s):  
E. Uhlmann ◽  
T. Borsoi Klein ◽  
L. Schweitzer ◽  
A. Neubrand

This paper presents an approach for the development and optimization of the NC-form grinding technology for an efficient machining of carbon fibre reinforced silicon carbide composite (C/SiC). The C/SiC properties, the importance and the necessity of the application of a high performance grinding process for the machining of this innovative composite material are introduced first. Then, the methodologies and the experimental investigations of NC-form grinding with the application of several machining parameters and three distinct bond types (vitrified, metal and synthetic resin) of diamond mounted points for the abrasive machining of C/SiC are presented. In order to monitor and analyze the process, grinding forces, surface integrity of ground workpieces and grinding wheel wear are investigated. The results of this paper provide new information regarding the wear behavior of grinding tools and the optimized conditions for grinding of C/SiC


2010 ◽  
Vol 44-47 ◽  
pp. 335-339
Author(s):  
Ramezan Ali Mahdavinejad

The usage of lubrication in machining processes especially in high speed milling is very important. In this research, some steel samples are machined with and without cooling lubricant conditions. In these cases, the material removal rate and surface finishing of machined surfaces are analyzed. The comparison between two conditions shows that the usage of lubricant as coolant material, improves the output machining parameters significantly.


Author(s):  
Krishna Kumar Saxena ◽  
Sanjay Agarwal ◽  
Jyoti Mukhopadhyay

Micro-electrical discharge machining (μ-EDM) is a non-traditional manufacturing technique that has been widely used in the production of precision engineering components throughout the world in recent years. The most important performance measure in μ-EDM is the surface roughness. The Silicon Carbide is a reaction bonded advanced ceramic that is the fourth hardest material after Diamond, boron nitride and boron carbide. Due to low fracture toughness, machining of Silicon Carbide is accomplished with EDM. In this study, the experimental studies were conducted under varying gap voltage, capacitance and threshold. The numbers of experiments were reduced by L9 array of Taguchi’s theory of DOE. Signal-to-noise (S/N) ratio was employed to determine the most influencing levels of parameters that affect the surface roughness in the μ-EDM of conductive silicon carbide. To validate the study, confirmation experiment has been carried out at optimum set of parameters and predicted results have been found to be in good agreement with experimental findings. A fuzzy logic model for predicting surface roughness during μEDM was also developed on MATLAB software and the goodness of fit of predicted values with experimental values was tested using chi-square test.


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