Effect of Sintering Temperature on Silver-Copper Nanopaste as High Temperature Die Attach Material
A novel stencil-printable silver-copper (Ag-Cu) nanopaste that serves as an alternative high temperature die attach material was introduced in this study. The nanopaste was made by mixing 50 nm-sized of Ag and Cu particles with an organic binder system. Sintering temperatures, up to 450°C, were used to sinter nanopaste in air and its post sintered properties were investigated. The viscosity of nanopaste was 350,000 cps and it demonstrated a shear thinning behavior. Scanning electron microscope revealed the change of grain structure with the change in the sintering temperature. Formations of Ag97Cu3 and Ag1Cu99 compounds after sintering were confirmed with X-ray diffraction; and the electrical conductivity of the sintered nanopaste was increased with the increase of the sintering temperature. The study concluded 380°C was the optimum sintering temperature to form a well sintered nanopaste.