Analysis of Temperature Field of PVC Polymerization Reactor

2014 ◽  
Vol 884-885 ◽  
pp. 200-203
Author(s):  
Hui Di Hao ◽  
Na Zhu ◽  
Yong Gao ◽  
Tian Qi Cheng ◽  
Jian Yong Lei ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Temperature Field ◽  
Displacement Vector ◽  
Analysis Software ◽  
Element Analysis ◽  
Component Selection ◽  
Polymerization Reactor ◽  
Heat Transfer Capacity ◽  
The Subject ◽  
National Industry

In view of the importance in the national industry of PVC,the subject of the PVC polymerization stirred tank uses finite element analysis software (ANSYS) of the thermodynamic analysis,mainly for the temperature field analysis.By observing the displacement vector image and temperature,the heat transfer capacity is enough, and the heat transfer component selection is reasonable.

Finite Element Analysis about the Influence that High-Speed Motorized Spindle Spindle System Material has on its Temperature Field

2013 ◽  
Vol 712-715 ◽  
pp. 1209-1212 ◽  
Author(s):  
Ke Zhang ◽  
Xiang Nan Ma ◽  
Li Xiu Zhang ◽  
Wen Da Yu ◽  
Yu Hou Wu
Keyword(s):  
Heat Transfer ◽  
Finite Element ◽  
Temperature Field ◽  
Heat Transfer Rate ◽  
Transfer Rate ◽  
High Speed ◽  
Ceramic Materials ◽  
Motorized Spindle ◽  
Element Analysis ◽  
Finite Element Software

The article has analyzed the changes of temperature of different materials of the spindle, and considered 170SD30 Ceramic Motorized Spindle and the same model Metal Motorized Spindle as the research objects, analyzed the inside heat source and heat transfer mechanism of the high-speed motorized spindle; used finite element software to set up the model of the motorized spindle, and did simulation and analysis. Verified by simulation, heat transfer rate of ceramic materials is slower than the metallic materials, in actual operation of the process, due to different materials have different heat transfer rate, so the temperature distribution of the different materials of motorized spindle are different. This conclusion provides the basis to solve motorized spindle temperature field distribution.

Numerical Analysis of Temperature Field in Laser Cladding on Teeth Surfaces of Gear Shaft

2010 ◽  
Vol 29-32 ◽  
pp. 571-576
Author(s):  
Lie Chen ◽  
Pei Lin Xie
Keyword(s):  
Temperature Field ◽  
Laser Beam ◽  
Laser Cladding ◽  
Horizontal Plane ◽  
Laser Energy ◽  
The Other ◽  
Analysis Software ◽  
Element Analysis ◽  
Result Show ◽  
Two Sides

Temperature field of laser cladding on teeth surfaces of gear shaft was numerical simulated with finite element analysis software – ANSYS. The simulation result show that the heat caused by laser beam is concentrated inside the tooth mostly. An effect of preheating in the adjacent tooth is also brought about by injected laser energy. In order to make use of the effect of preheating and avoid the concentration of heat, all of the corresponding flanks of teeth should be cladded first and the other flanks of teeth be cladded secondly in the process of laser cladding. It is also shown that the problems of excessive melted down and collapsing of tooth-tip would be easily resulted in by the heat that concentrated in tooth-tip if the tooth-side and tooth-tip be cladded at the same time. The results of analysis and experiment show that at least two times of scanning should be executed in the process of laser cladding on teeth surfaces. At the first scanning, dimension of laser beam should be reduced properly. And the tooth-tip should not be irradiated directly by laser beam. After the first scanning, the gear should be circumrotated a certain angle. And the included angles between the two sides of tooth-tip and horizontal plane should be approximately equal. Then the second scanning could be prosecuted at the tooth-tip. Experiment results show that continuous and compact cladding coat could be gained by this craft. It is proved that this technological craft is reasonable and effective.

Three-Dimensional Numerical Simulation of Temperature Field and Force Field of T-Type Turbe during Welding

2013 ◽  
Vol 690-693 ◽  
pp. 2659-2663
Author(s):  
Jian Ping Zhou ◽  
Xiang Feng Zhang ◽  
Hong Sheng Liu ◽  
Jun Yi Gao ◽  
Yan Xu
Keyword(s):  
Mechanical Properties ◽  
Residual Stress ◽  
Temperature Field ◽  
Three Dimensional ◽  
Welding Process ◽  
Three Dimension ◽  
Analysis Software ◽  
Element Analysis ◽  
Cool Process ◽  
Type Tube

Residual stress affect the lifetime of weldments directly. Temperature Generated from the welding process is the major reason that influences the microstructure and mechanical properties of the metal weldments. Therefore it is necessary to simulate the temperature field for optimizing the structure of weldments. In this work the three-dimension finite element analysis software SYSWELS was used to simulate T-type tube, and carried on a detailed analysis of temperature field and residual stress in cool process of weld.

Mathematical Modelling of Heat Transfer Physics in Sea and Air deployed PV Systems

2019 ◽  
Vol 3 (2) ◽  
pp. 24-37
Author(s):  
Stephen Sammut ◽  
Patrick Attard
Keyword(s):  
Heat Transfer ◽  
Sea Surface ◽  
Small Country ◽  
Element Analysis ◽  
Sea Temperature ◽  
Ambient Temperatures ◽  
Pv Systems ◽  
Pv Panel ◽  
The Subject ◽  
Vast Area

The sea provides a vast area which can be harnessed as a platform on which to install energy-harvesting technology. This is especially relevant for a small country such as Malta with a very small landmass when compared to the vast area of the surrounding sea. Photovoltaics (PV) also become more inefficient as they heat up. When PV panels are deployed in the sun, the temperature tends to increase and the PVs become more inefficient. This is especially so in the summer months when the ambient temperatures are at their highest levels. Sea temperature in summer is lower than the air temperature. Hence deploying the PVs in the sea can contribute to keep the panel temperature lower, thereby improving its efficiency. The subject of this paper was the study of the cooling effect of the sea on the PV material. Finite Element Analysis (FEA) of PV panels deployed on land and in sea (both in submerged and surface modes) was undertaken. FEA software ANSYS was used to conduct the analysis. The FEA conducted took into consideration the physics of heat transfer through the radiation, conduction, and convection mechanisms. The conclusions of the analysis conducted demonstrated that a PV panel submerged 10 cm below the sea surface achieved the lowest temperatures of the three cases studied.

Finite Element Analysis of Temperature Field of Traction Motor

2012 ◽  
Vol 189 ◽  
pp. 461-464
Author(s):  
An Xing Zhu ◽  
Zhi Xiong Yang ◽  
Yi Cui
Keyword(s):  
Heat Transfer ◽  
Finite Element ◽  
Temperature Field ◽  
Convective Heat Transfer Coefficient ◽  
Transient Temperature ◽  
Iron Core ◽  
Field Calculation ◽  
Three Dimension ◽  
Element Analysis ◽  
Traction Motor

Due to the fact of immeasurable inner temperature of inverter-fed traction motor, three-dimension finite element model of part of rotor iron core and half a rotor bearing were established. The convective heat transfer coefficient between the air gap of motor and rotor surface were calculated by the heat transfer and fluid mechanics theory. The influence of temperature rise on the stator and rotor resistance was considered for thermal loss calculation. The influence of the end of stator and rotor on axial temperature distribution was also taken into account. Then three-dimensional transient temperature field of the motor was simulated at the rated load. Temperature field with different loads was also computed. The aim has been to optimize the design with respect to the transient stresses. According to contrastive analysis compared with other method, it demonstrated the accuracy of simulation model and thermal field calculation results.

Thermal Transfer Boundary Condition and Thermal Load of Piston for Torpedo Cam Engines

2011 ◽  
Vol 704-705 ◽  
pp. 619-624
Author(s):  
Qin Chao Xu ◽  
Shu Zong Wang ◽  
Yong Qing Lian
Keyword(s):  
Boundary Condition ◽  
Temperature Field ◽  
Thermal Load ◽  
Cooling Water ◽  
Thermal Boundary Condition ◽  
Analysis Software ◽  
Element Analysis ◽  
Thermal Transfer ◽  
Engine Piston ◽  
The Finite Element Analysis

Piston of cam engines for torpedo works in terrible condition and always be caused fatigue breakdown by thermal load. In this paper, the thermal boundary condition of different piston parts are ascertained, such as the crown surface of piston and high-temp gas, the side of piston and cooling water, and the skirt of piston and cooling oil. Then the piston’s temperature field is obtained by using the finite element analysis software. This result provides the practical reference for further improving the structure and optimizing the design of the piston. Keywords: cam engine; piston; heat-transfer coefficient; temperature field.

Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips

2018 ◽  
Vol 140 (1) ◽  
Author(s):  
David Gonzalez Cuadrado ◽  
Amy Marconnet ◽  
Guillermo Paniagua
Keyword(s):  
Heat Transfer ◽  
Temperature Field ◽  
Hot Spot ◽  
Three Dimensional ◽  
Infrared Image ◽  
Temperature Sensors ◽  
Kriging Interpolation ◽  
Algorithm Optimization ◽  
Element Analysis ◽  
Specification Method

Large thermal gradients represent major operational hazards in microprocessors; hence, there is a critical need to monitor possible hot spots both accurately and in real time. Thermal monitoring in microprocessors is typically performed using temperature sensors embedded in the electronic board. The location of the temperature sensors is primarily determined by the sensor space claim rather than the ideal location for thermal management. This paper presents an optimization methodology to determine the most beneficial locations for the temperature sensors inside of the microprocessors, based on input from high-resolution surface infrared thermography combined with inverse heat transfer solvers to predict hot spot locations. Specifically, the infrared image is used to obtain the temperature map over the processor surface, and subsequently delivers the input to a three-dimensional (3D) inverse heat conduction methodology, used to determine the temperature field within the processor. In this paper, simulated thermal maps are utilized to assess the accuracy of this method. The inverse methodology is based on a function specification method combined with a sequential regularization in order to increase accuracy in the results. Together with the number of sensors, the temperature field within the processor is then used to determine the optimal location of the temperature sensors using a genetic algorithm optimization combined with a Kriging interpolation. This combination of methodologies was validated against the finite element analysis of a chip incorporating heaters and temperature sensors. An uncertainty analysis of the inverse methodology and the Kriging interpolation was performed separately to assess the reliability of the procedure.

The Analysis of Fiber Positioning System Temperature

2012 ◽  
Vol 490-495 ◽  
pp. 1685-1688
Author(s):  
Xue Peng Liu ◽  
Dong Mei Zhao
Keyword(s):  
Heat Transfer ◽  
Mathematical Model ◽  
Thermal Deformation ◽  
Single Step ◽  
Step Motor ◽  
Positioning System ◽  
Analysis Software ◽  
Element Analysis ◽  
System Temperature ◽  
Normal Work

The LAMOST fiber positioning system is installed in focal panel. Thermal deformation influences focal panel and fiber positioning precision greatly. The heat transfer mathematical model of focal panel is established with the analysis of the focal panel structure. A single step motor heat under the normal work is detected. By using finite element analysis software Ansys the temperature distribution of the focal panel is calculated, which provides the basis for the next step calculation of the focal panel thermal deformation.

Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips

2017 ◽  
Author(s):  
D. Gonzalez Cuadrado ◽  
A. Marconnet ◽  
G. Paniagua
Keyword(s):  
Heat Transfer ◽  
Temperature Field ◽  
Hot Spot ◽  
Infrared Image ◽  
Temperature Sensors ◽  
Kriging Interpolation ◽  
Algorithm Optimization ◽  
Element Analysis ◽  
Specification Method ◽  
Inverse Heat Transfer

Significant thermal gradients and hotspots is a major safety and operational issue in microprocessors, hence accurate real-time monitoring hot spots is a critical need. This thermal monitoring is typically performed using temperature sensors embedded in the chip or processor board. The location of the temperature sensors is primarily determined by the sensor space claim rather than the ideal location for thermal management. This manuscript presents an optimization methodology to determine the most beneficial locations for the temperature sensors inside of the microprocessors, based input from high resolution surface infrared thermography combined with inverse heat transfer solvers to predict hot spot locations. Specifically, the infrared image is used to obtain the temperature map over the processor surface, and subsequently delivers the input to a 3D inverse heat conduction methodology, used to determine the temperature field within the processor. In this paper, simulated thermal maps are utilized to assess the accuracy of the method. The inverse methodology is based in a function specification method combined with a sequential regularization in order to increase accuracy in the results. Together with a number of sensors, the temperature field within the processor is then used to determine the optimal location of the temperature sensors using a genetic algorithm optimization combined with a Kriging interpolation. This combination of methodologies was validated against the Finite Element Analysis of a chip incorporating heaters and temperature sensors. An uncertainty analysis of the inverse methodology and the Kriging interpolation was performed separately to assess the reliability of the procedure.

Heat transfer monitoring by means of the hot wire technique and finite element analysis software

2014 ◽  
Vol 83 ◽  
pp. 264-267 ◽  
Author(s):  
J. Hernández Wong ◽  
V. Suarez ◽  
J. Guarachi ◽  
A. Calderón ◽  
J.B. Rojas-Trigos ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Finite Element Analysis ◽  
Finite Element ◽  
Hot Wire ◽  
Analysis Software ◽  
Element Analysis
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