Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips

2018 ◽  
Vol 140 (1) ◽  
Author(s):  
David Gonzalez Cuadrado ◽  
Amy Marconnet ◽  
Guillermo Paniagua
Keyword(s):  
Heat Transfer ◽  
Temperature Field ◽  
Hot Spot ◽  
Three Dimensional ◽  
Infrared Image ◽  
Temperature Sensors ◽  
Kriging Interpolation ◽  
Algorithm Optimization ◽  
Element Analysis ◽  
Specification Method

Large thermal gradients represent major operational hazards in microprocessors; hence, there is a critical need to monitor possible hot spots both accurately and in real time. Thermal monitoring in microprocessors is typically performed using temperature sensors embedded in the electronic board. The location of the temperature sensors is primarily determined by the sensor space claim rather than the ideal location for thermal management. This paper presents an optimization methodology to determine the most beneficial locations for the temperature sensors inside of the microprocessors, based on input from high-resolution surface infrared thermography combined with inverse heat transfer solvers to predict hot spot locations. Specifically, the infrared image is used to obtain the temperature map over the processor surface, and subsequently delivers the input to a three-dimensional (3D) inverse heat conduction methodology, used to determine the temperature field within the processor. In this paper, simulated thermal maps are utilized to assess the accuracy of this method. The inverse methodology is based on a function specification method combined with a sequential regularization in order to increase accuracy in the results. Together with the number of sensors, the temperature field within the processor is then used to determine the optimal location of the temperature sensors using a genetic algorithm optimization combined with a Kriging interpolation. This combination of methodologies was validated against the finite element analysis of a chip incorporating heaters and temperature sensors. An uncertainty analysis of the inverse methodology and the Kriging interpolation was performed separately to assess the reliability of the procedure.

Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips

2017 ◽  
Author(s):  
D. Gonzalez Cuadrado ◽  
A. Marconnet ◽  
G. Paniagua
Keyword(s):  
Heat Transfer ◽  
Temperature Field ◽  
Hot Spot ◽  
Infrared Image ◽  
Temperature Sensors ◽  
Kriging Interpolation ◽  
Algorithm Optimization ◽  
Element Analysis ◽  
Specification Method ◽  
Inverse Heat Transfer

Significant thermal gradients and hotspots is a major safety and operational issue in microprocessors, hence accurate real-time monitoring hot spots is a critical need. This thermal monitoring is typically performed using temperature sensors embedded in the chip or processor board. The location of the temperature sensors is primarily determined by the sensor space claim rather than the ideal location for thermal management. This manuscript presents an optimization methodology to determine the most beneficial locations for the temperature sensors inside of the microprocessors, based input from high resolution surface infrared thermography combined with inverse heat transfer solvers to predict hot spot locations. Specifically, the infrared image is used to obtain the temperature map over the processor surface, and subsequently delivers the input to a 3D inverse heat conduction methodology, used to determine the temperature field within the processor. In this paper, simulated thermal maps are utilized to assess the accuracy of the method. The inverse methodology is based in a function specification method combined with a sequential regularization in order to increase accuracy in the results. Together with a number of sensors, the temperature field within the processor is then used to determine the optimal location of the temperature sensors using a genetic algorithm optimization combined with a Kriging interpolation. This combination of methodologies was validated against the Finite Element Analysis of a chip incorporating heaters and temperature sensors. An uncertainty analysis of the inverse methodology and the Kriging interpolation was performed separately to assess the reliability of the procedure.

Analysis of a Virtual Prototype First-Stage Rotor Blade Using Integrated Computer-Based Design Tools

2006 ◽  
Author(s):  
Michel Arnal ◽  
Christian Precht ◽  
Thomas Sprunk ◽  
Tobias Danninger ◽  
John Stokes
Keyword(s):  
Heat Transfer ◽  
Gas Flow ◽  
Thermal Loading ◽  
Cfd Simulation ◽  
Three Dimensional ◽  
Life Assessment ◽  
Element Analysis ◽  
Pressure Losses ◽  
Cooling Channels ◽  
Internally Cooled

The present paper outlines a practical methodology for improved virtual prototyping, using as an example, the recently re-engineered, internally-cooled 1st stage blade of a 40 MW industrial gas turbine. Using the full 3-D CAD model of the blade, a CFD simulation that includes the hot gas flow around the blade, conjugate heat transfer from the fluid to the solid at the blade surface, heat conduction through the solid, and the coolant flow in the plenum is performed. The pressure losses through and heat transfer to the cooling channels inside the airfoil are captured with a 1-D code and the 1-D results are linked to the three-dimensional CFD analysis. The resultant three-dimensional temperature distribution through the blade provides the required thermal loading for the subsequent structural finite element analysis. The results of this analysis include the thermo-mechanical stress distribution, which is the basis for blade life assessment.

Analytical Modeling of Temperature Distribution in Interposer-Based Microelectronic Systems

2013 ◽  
Author(s):  
Leila Choobineh ◽  
Dereje Agonafer ◽  
Ankur Jain
Keyword(s):  
Heat Transfer ◽  
Finite Element ◽  
Temperature Field ◽  
Temperature Distribution ◽  
Analytical Modeling ◽  
Three Dimensional ◽  
Heat Transfer Process ◽  
Thermal Design ◽  
Research Attention ◽  
On Chip

Heterogeneous integration in microelectronic systems using interposer technology has attracted significant research attention in the past few years. Interposer technology is based on stacking of several heterogeneous chips on a common carrier substrate, also referred to as the interposer. Compared to other technologies such as System-on-Chip (SoC) or System-in-Package (SiP), interposer-based integration offers several technological advantages. However, the thermal management of an interposer-based system is not well understood. The presence of multiple heat sources in various die and the interposer itself needs to be accounted for in any effective thermal model. While a finite-element based simulation may provide a reasonable temperature prediction tool, an analytical solution is highly desirable for understanding the fundamentals of the heat transfer process in interposers. In this paper, we describe our recent work on analytical modeling of heat transfer in interposer-based microelectronic systems. The basic governing energy conservation equations are solved to derive analytical expressions for the temperature distribution in an interposer-based microelectronic system. These solutions are combined with an iterative approach to provide the three-dimensional temperature field in an interposer. Results are in excellent agreement with finite-element solutions. The analytical model is utilized to study the effect of various parameters on the temperature field in an interposer system. Results from this work may be helpful in the thermal design of microelectronic systems containing interposers.

Microprocessor Silicon Die Temperature Prediction by Simplified Boundary Conditions

2015 ◽  
Author(s):  
Koji Nishi ◽  
Tomoyuki Hatakeyama ◽  
Shinji Nakagawa ◽  
Masaru Ishizuka
Keyword(s):  
Heat Transfer ◽  
Heat Conduction ◽  
Boundary Conditions ◽  
Thermal Resistance ◽  
Hot Spot ◽  
Three Dimensional ◽  
Thermal Design ◽  
Target Temperature ◽  
One Dimensional ◽  
Thermal Network

The thermal network method has a long history with thermal design of electronic equipment. In particular, a one-dimensional thermal network is useful to know the temperature and heat transfer rate along each heat transfer path. It also saves computation time and/or computation resources to obtain target temperature. However, unlike three-dimensional thermal simulation with fine pitch grids and a three-dimensional thermal network with sufficient numbers of nodes, a traditional one-dimensional thermal network cannot predict the temperature of a microprocessor silicon die hot spot with sufficient accuracy in a three-dimensional domain analysis. Therefore, this paper introduces a one-dimensional thermal network with average temperature nodes. Thermal resistance values need to be obtained to calculate target temperature in a thermal network. For this purpose, thermal resistance calculation methodology with simplified boundary conditions, which calculates thermal resistance values from an analytical solution, is also introduced in this paper. The effectiveness of the methodology is explored with a simple model of the microprocessor system. The calculated result by the methodology is compared to a three-dimensional heat conduction simulation result. It is found that the introduced technique matches the three-dimensional heat conduction simulation result well.

Clocking Effects of Inlet Non-Uniformities in a Fully Cooled High-Pressure Vane: A Conjugate Heat Transfer Analysis

2015 ◽  
Author(s):  
Duccio Griffini ◽  
Massimiliano Insinna ◽  
Simone Salvadori ◽  
Francesco Martelli
Keyword(s):  
Heat Transfer ◽  
High Pressure ◽  
Film Cooling ◽  
Conjugate Heat Transfer ◽  
Cooling System ◽  
Hot Spot ◽  
Three Dimensional ◽  
Leading Edge ◽  
Suction Side ◽  
Heat Transfer Analysis

A high-pressure vane equipped with a realistic film-cooling configuration has been studied. The vane is characterized by the presence of multiple rows of fan-shaped holes along pressure and suction side while the leading edge is protected by a showerhead system of cylindrical holes. Steady three-dimensional Reynolds-Averaged Navier-Stokes (RANS) simulations have been performed. A preliminary grid sensitivity analysis with uniform inlet flow has been used to quantify the effect of spatial discretization. Turbulence model has been assessed in comparison with available experimental data. The effects of the relative alignment between combustion chamber and high-pressure vanes are then investigated considering realistic inflow conditions in terms of hot spot and swirl. The inlet profiles used are derived from the EU-funded project TATEF2. Two different clocking positions are considered: the first one where hot spot and swirl core are aligned with passage and the second one where they are aligned with the leading edge. Comparisons between metal temperature distributions obtained from conjugate heat transfer simulations are performed evidencing the role of swirl in determining both the hot streak trajectory within the passage and the coolant redistribution. The leading edge aligned configuration is resulted to be the most problematic in terms of thermal load, leading to increased average and local vane temperature peaks on both suction side and pressure side with respect to the passage aligned case. A strong sensitivity of both injected coolant mass flow and heat removed by heat sink effect has also been highlighted for the showerhead cooling system.

Finite Element Analysis about the Influence that High-Speed Motorized Spindle Spindle System Material has on its Temperature Field

2013 ◽  
Vol 712-715 ◽  
pp. 1209-1212 ◽  
Author(s):  
Ke Zhang ◽  
Xiang Nan Ma ◽  
Li Xiu Zhang ◽  
Wen Da Yu ◽  
Yu Hou Wu
Keyword(s):  
Heat Transfer ◽  
Finite Element ◽  
Temperature Field ◽  
Heat Transfer Rate ◽  
Transfer Rate ◽  
High Speed ◽  
Ceramic Materials ◽  
Motorized Spindle ◽  
Element Analysis ◽  
Finite Element Software

The article has analyzed the changes of temperature of different materials of the spindle, and considered 170SD30 Ceramic Motorized Spindle and the same model Metal Motorized Spindle as the research objects, analyzed the inside heat source and heat transfer mechanism of the high-speed motorized spindle; used finite element software to set up the model of the motorized spindle, and did simulation and analysis. Verified by simulation, heat transfer rate of ceramic materials is slower than the metallic materials, in actual operation of the process, due to different materials have different heat transfer rate, so the temperature distribution of the different materials of motorized spindle are different. This conclusion provides the basis to solve motorized spindle temperature field distribution.

scholarly journals Three Dimensional Transient Explicit Finite Difference Heat Transfer Modeling of Billet Transport

2013 ◽  
Vol 06 (2) ◽  
Keyword(s):  
Heat Transfer ◽  
Temperature Field ◽  
Finite Difference ◽  
Coming Out ◽  
Three Dimensional ◽  
Suitable Model ◽  
Billet Temperature ◽  
Reheat Furnace ◽  
Explicit Finite Difference ◽  
Force Calculation

In steel industries the billets are heated in reheat furnace. The billets coming out from reheat furnace are transported to the rolling mill. Prediction of billet temperature during transport is vital for several reasons, like energy optimization studies, process simulation, roll force calculation and quality of the final product. Inadequate temperature measuring instruments demands suitable model for billet temperature predictions. In the present work, conduction heat transfer within the billet is modeled using the explicit finite difference method. To solve three dimensional transient discretization equations, code has been developed and implemented in MATLAB ® . Validation of the proposed numerical model has been done using analytical solutions. The model predictions of billet temperature are shown to be in good concurrence with analytical results. The model is capable of predicting temperature distribution within the billet. The model is used to examine the effect of billet transport velocity on the temperature field of the billet. The objective of this work to apply simple simulation technique to high temperature industrial process for temperature field measurements. This type of simulation may be useful for temperature predictions, design and study of new or existing transport system for hot billet transport.

scholarly journals Spatiotemporal distribution of the temperature field inside the thin heated foil during impacting liquid spray

2021 ◽  
Vol 2119 (1) ◽  
pp. 012171
Author(s):  
V V Cheverda ◽  
T G Gigola ◽  
P M Somwanshi
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Temperature Field ◽  
Heat Transfer Coefficient ◽  
Infrared Image ◽  
Image Sequence ◽  
Spatiotemporal Distribution ◽  
Average Heat Transfer Coefficient ◽  
Average Heat ◽  
Liquid Spray

Abstract The spatiotemporal distribution of the temperature inside a constantan foil during impacting spray is resolved experimentally in the present work. The received infrared image sequence will be used to find the local and average heat transfer coefficient of the foil. In the future, the results obtained will be used to calculate the heat flux in the region of the contact line of each drop.

scholarly journals Finite Element Analysis of Natural Thawing Heat Transfer of Artificial Frozen Soil in Shield-Driven Tunnelling

2020 ◽  
Vol 2020 ◽  
pp. 1-18
Author(s):  
Yong Fu ◽  
Jun Hu ◽  
Jia Liu ◽  
Shengbin Hu ◽  
Yunhui Yuan ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Finite Element ◽  
Three Dimensional ◽  
Frozen Soil ◽  
Soil Reinforcement ◽  
Freezing Process ◽  
Element Analysis ◽  
Heat Transfer Behavior ◽  
Transfer Behavior ◽  
Three Dimensional Finite Element

The technology of artificial horizontal freezing method is increasingly being used in the soil reinforcement of urban underground projects such as shield-driven tunnelling. Compared with the freezing process, the thawing process is more complicated, and the thawing behavior of artificial frozen soil surrounding shield-driven tunnels has not been well investigated in both the academic and industrial domains. This study, therefore, aims to investigate the natural thawing heat transfer behavior of artificial horizontal frozen soil in shield-driven tunnelling using a three-dimensional finite element method. The finite element modelling is based on the horizontal freezing reinforcement project of Chating Station to Jiqingmen Station Tunnel in the Nanjing Metro Line 2. Validation between finite element results and site measured results is firstly conducted. The natural thawing temperature field contours as well as the radial and longitudinal distributions of natural thawing temperature in the frozen soil surrounding the tunnel are then explicitly examined. Furthermore, sensitivity analysis of influencing factors such as the thermal conductivity, latent heat of phase change, ambient temperature inside tunnel, freezing time, and original ground temperature is carried out. The results and findings of this study may enrich the current limited database and enable a better understanding of natural thawing heat transfer behavior of artificial frozen soil in shield-driven tunnelling.

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