Thermal Properties of Silicon-Containing Polyimide Filled with Carbon Black of Low Structure
2014 ◽
Vol 968
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pp. 21-24
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Keyword(s):
The nanocomposites between silicon-containing polyimide (SPI) and electrically conductive carbon black (CB) of low structure (Conductex K Ultra) were prepared. The contents of the conductive nanofillers were varied from 0 to 40 phr. The thermal properties of the nanocomposites were determined via Differential Scanning Calorimeter (DSC) and Thermo-gravimetric Analyzer (TGA). DSC thermograms revealed that the glass transition temperature (Tg) and degradation temperature (Td) of the nanocomposites increased with increasing the amount of fillers. The Tg and Td values of the composites filled with high structure were higher than those of the ones filled with low structure.
2009 ◽
Vol 620-622
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pp. 197-200
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2011 ◽
Vol 239-242
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pp. 2905-2908
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2006 ◽
Vol 510-511
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pp. 578-581
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2011 ◽
Vol 217-218
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pp. 1066-1069
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2016 ◽
Vol 69
(1)
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pp. 7845-7854
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