Manufacturing Metamaterials Using Synchrotron Lithography

2010 ◽  
Vol 75 ◽  
pp. 230-239
Author(s):  
Herbert O. Moser ◽  
Linke Jian ◽  
Shenbaga M.P. Kalaiselvi ◽  
Selven Virasawmy ◽  
Sivakumar M. Maniam ◽  
...  
Keyword(s):  
Electromagnetic Waves ◽  
Cost Effective ◽  
Pattern Generation ◽  
Geometrical Parameters ◽  
X Ray ◽  
Spectral Bands ◽  
Left Handed ◽  
Aspect Ratios ◽  
Multi Level ◽  
Primary Pattern

The function of metamaterials relies on their resonant response to electromagnetic waves in characteristic spectral bands. To make metamaterials homogeneous, the size of the basic resonant element should be less than 10% of the wavelength. For the THz range up to the visible, structure details of 50 nm to 30 μm are required as are high aspect ratios, tall heights, and large areas. For such specifications, lithography, in particular, synchrotron radiation deep X-ray lithography, is the method of choice. X-ray masks are made via primary pattern generation by means of electron or laser writing. Several different X-ray masks and accurate mask-substrate alignment are necessary for architectures requiring multi-level lithography. Lithography is commonly followed by electroplating of metallic replica. The process can also yield mould inserts for cost-effective manufacture by plastic moulding. We made metamaterials based on rod-split-rings, split-cylinders, S-string bi-layer chips, and S-string meta-foils. Left-handed resonance bands range from 2.4 to 216 THz. Latest is the all-metal self-supported flexible meta-foil with pass-bands of 45% up to 70% transmission at 3.4 to 4.5 THz depending on geometrical parameters.

AlCu Pattern Generation on 3D StructuredWafer Using Multi Level Exposure Method on Electrodeposited Polymer Material

2003 ◽  
Vol 766 ◽  
Author(s):  
Vineet Sharma ◽  
Arief B. Suriadi ◽  
Frank Berauer ◽  
Laurie S. Mittelstadt
Keyword(s):  
Line Width ◽  
Metal Film ◽  
Focal Depth ◽  
Cost Effective ◽  
Pattern Generation ◽  
Promising Technique ◽  
Critical Dimensions ◽  
Exposure Method ◽  
Multi Level ◽  
3D Surfaces

AbstractNormal photolithography tools have focal depth limitations and are unable to meet the expectations of high resolution photolithography on highly topographic structures. This paper shows a cost effective and promising technique of combining two different approaches to achieve critical dimensions of traces on slope pattern continuity on highly topographic structures. Electrophoretically deposited photoresist is used on 3-D structured wafers. This photoresist coating technique is fairly known in the MEMS industries to achieve uniform and conformal photoresist films on 3D surfaces. Multi step exposures are used to expose electrophoretically deposited photoresist. AlCu (Cu-0.5%), 0.47-0.53 μm thick metal film is deposited on 3D structured silicon substrate to plate photoresist. By combining these two novel methods, metal (AlCu) traces of 75 μm line width and 150 μm pitch (from top flat to down the slope) have been demonstrated on isotropically etched 350 μm deep trenches with 5-10% line width loss.

The Structural Design Method of Multi-Layer Parabolic Reflective Surface for X-Ray Focusing

2013 ◽  
Vol 552 ◽  
pp. 75-78
Author(s):  
Miang Zhao Ouyang ◽  
Yue Gang Fu ◽  
Zhi Ying Liu ◽  
Jia Ke Wang ◽  
Wen Jun He
Keyword(s):  
Structural Design ◽  
Electromagnetic Waves ◽  
Critical Angle ◽  
Design Method ◽  
Grazing Incidence ◽  
High Energy ◽  
Entrance Pupil ◽  
X Ray ◽  
Spectral Bands ◽  
Effective Aperture

As an ultra-short electromagnetic waves, X-ray has a strong ability to penetrate with high-energy. The method for focusing visible spectral bands is not suitable for X-ray spectrum. At present, in X-ray astronomy, the X-ray focus mode which uses grazing incidence less than critical angle has been widely used. However, the small critical angle limits its effective aperture of the X-ray collection. This paper presents a multi-layer reflective structure working with grazing incidence and the surfaces coated multilayer high reflective for X-ray. It can guarantee the large effective entrance pupil and high energy collection. The 200mm diameter X-ray focusing device is designed as an example. It is found from simulation that a good focusing result is acquired.

scholarly journals Micro/Nanostructured Lignonanocellulose Obtained from Steam-Exploded Sugarcane Bagasse

2021 ◽  
Author(s):  
André Mazega Fontes ◽  
Cleverton L. Pirich ◽  
Gustavo Ryo Oliveira de Andrade Tanobe ◽  
Quim Tarrés ◽  
Marc Delgado-Aguilar ◽  
...  
Keyword(s):  
Sugarcane Bagasse ◽  
Steam Explosion ◽  
High Performance ◽  
Cost Effective ◽  
High Pressure Homogenization ◽  
X Ray ◽  
Aspect Ratios ◽  
Transmission Electron ◽  
Alkaline Delignification ◽  
20 Nm

Abstract This work demonstrates the isolation of lignocellulose micro-nanofibrils, nanocrystals and nanospheres from steam-exploded sugarcane bagasse (SEB). First, steam-explosion was carried out in sugarcane bagasse at 195 °C for 7.5 and 15 min (SEB-7.5 and SEB-15). Untreated sugarcane bagasse was also pretreated by mechanical refining (MRB) in a PFI mill for comparison. Then, SEB and MRB fibers were submitted to alkaline delignification, hypochlorite bleaching for 60 or 180 min (HB60 and HB180), enzymatic hydrolysis (endoglucanase), and high-pressure homogenization. The resulting materials were characterized regarding chemical composition by high-performance liquid chromatography, width and morphology by transmission electron microscopy, crystallinity by X-ray powder diffraction and aspect ratio (length/diameter) by rheology. Levels of glucans (mostly cellulose), hemicelluloses and lignin were: 53.8%, 19.7% and 11.6% in MRB-HB180; 87.8%, <0.1% and 7.2% in SEB-7.5-HB60; 84.3%, <0.1% and 4.8% in SEB-7.5-HB180, 85.9%, <0.1% and 8.4% in SE-15-HB60; and 82.2%, <0.1% and 5% in SE-15-HB180, respectively. Aspect ratios and crystallinity indexes were similar among all groups (~100 and ~73%, respectively), except for SE-15-HB180 (~ 78.5 and 77%, respectively). MRB-HB180 and SE-15 (HB60 and HB180) had the lowest fiber widths (<20 nm) with the presence of nanocrystals in SE-15-HB180, while in the SE-7.5 (HB60 and HB180), fiber widths were greater than 50 nm with the presence of lignin nanospheres in SE-7.5-HB60. Hence, lignocellulose nanomaterials with aspect ratios ranging from micro/nanofibers to nanocrystals were isolated from SEB using a cost-effective production process.

Influence of nozzle exit geometrical parameters on supersonic jet decay

2021 ◽  
Vol 0 (0) ◽  
Author(s):  
Prasanta Kumar Mohanta ◽  
B. T. N. Sridhar ◽  
R. K. Mishra
Keyword(s):  
Aspect Ratio ◽  
Nozzle Exit ◽  
Ambient Air ◽  
Schlieren Image ◽  
Geometrical Parameters ◽  
Image Study ◽  
Aspect Ratios ◽  
Core Length ◽  
Supersonic Core Length ◽  
The Impact

Abstract Experiments and simulations were carried on C-D nozzles with four different exit geometry aspect ratios to investigate the impact of supersonic decay characteristics. Rectangular and elliptical exit geometries were considered for the study with various aspect ratios. Numerical simulations and Schlieren image study were studied and found the agreeable logical physics of decay and spread characteristics. The supersonic core decay was found to be of different length for different exit geometry aspect ratio, though the throat to exit area ratio was kept constant to maintain the same exit Mach number. The impact of nozzle exit aspect ratio geometry was responsible to enhance the mixing of primary flow with ambient air, without requiring a secondary method to increase the mixing characteristics. The higher aspect ratio resulted in better mixing when compared to lower aspect ratio exit geometry, which led to reduction in supersonic core length. The behavior of core length reduction gives the identical signature for both under-expanded and over-expanded cases. The results revealed that higher aspect ratio of the exit geometry produced smaller supersonic core length. The aspect ratio of cross section in divergent section of the nozzle was maintained constant from throat to exit to reduce flow losses.

A new model for packing of type-I collagen molecules in the native fibril

1981 ◽  
Vol 1 (10) ◽  
pp. 801-810 ◽  
Author(s):  
Karl A. Piez ◽  
Benes L. Trus
Keyword(s):  
Type I Collagen ◽  
Hexagonal Lattice ◽  
Three Dimensional ◽  
Equatorial Region ◽  
Type I ◽  
X Ray Diffraction ◽  
X Ray ◽  
Left Handed ◽  
Crystal Model ◽  
Collagen Molecules

A specific fibril model is presented consisting of bundles of five-stranded microfibrils, which are usually disordered (except axially) but under lateral compression become ordered. The features are as follows (where D = 234 residues or 67 nm): (1) D-staggered collagen molecules 4.5 D long in the helical microfibril have a left-handed supercoil with a pitch of 400–700 residues, but microfibrils need not have helical symmetry. (2) Straight-tilted 0.5-D overlap regions on a near-hexagonal lattice contribute the discrete x-ray diffraction reflections arising from lateral order, while the gap regions remain disordered. (3) The overlap regions are equivalent, but are crystallographically distinguished by systematic displacements from the near-hexagonal lattice. (4) The unit cell is the same as in a recently proposed three-dimensional crystal model, and calculated intensities in the equatorial region of the x-ray diffraction pattern agree with observed values.

Cost-effective masks for deep x-ray lithography

2003 ◽  
Author(s):  
Heinz-Ulrich Scheunemann ◽  
Bernd Loechel ◽  
Linke Jian ◽  
Daniel Schondelmaier ◽  
Yohannes M. Desta ◽  
...  
Keyword(s):  
Cost Effective ◽  
X Ray

Aluminum Reflow Sputtering

MRS Bulletin ◽  
1995 ◽  
Vol 20 (11) ◽  
pp. 53-56 ◽  
Author(s):  
Kuniko Kikuta
Keyword(s):  
Integrated Circuit ◽  
High Speed ◽  
Lower Cost ◽  
High Reliability ◽  
Device Fabrication ◽  
Damascene Process ◽  
Aspect Ratios ◽  
Multi Level ◽  
Poor Adhesion ◽  
Lower Resistivity

The scaling of integrated-circuit device dimensions in the horizontal direction has caused an increase in aspect ratios of contact holes and vias without a corresponding scaledown in vertical dimensions. Conventional sputtering has become unreliable for handling higher aspect-ratio via/contact holes because of its poor step coverage. Several studies have attempted to overcome this problem by using W-CVD and reflow technology. The W-CVD is used for practical device fabrications. However, this technique has several problems such as poor adhesion to SiO2, poor W surface morphology, greater resistivity than Al, and the need of an etch-back process.Al reflow technology using a conventional DC magnetron sputtering system can simplify device-fabrication processes and achieve high reliability without Al/W interfaces. In particular, the Al reflow technology is profitable for multi-level interconnections in combination with a damascene process by using Al chemical mechanical polishing (CMP). These interconnections are necessary for miniaturized and high-speed devices because they provide lower resistivity than W and simplify fabrication processes, resulting in lower cost.This article describes recent Al reflow sputtering technologies as well as application of via and interconnect metallization.

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