The SEM and TEM Analysis of IN718 Alloy after Fatigue Push-Pull Loading at 700°C

2020 ◽  
Vol 405 ◽  
pp. 288-293
Author(s):  
Juraj Belan ◽  
Lenka Kuchariková ◽  
Alan Vaško ◽  
Eva Tillová ◽  
Mária Chalupová ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Mechanical Properties ◽  
Dynamic Properties ◽  
Fatigue Loading ◽  
Negative Influence ◽  
Tem Analysis ◽  
Fatigue Lifetime ◽  
Delta Phase ◽  
Sem And Tem ◽  
Transmission Electron

Specimens from Ni-Cr-Fe wrought superalloy INCONEL 718 were used for fatigue push-pull test at elevated temperature 700 °C. Fatigue loading was with the coefficient of cycle asymmetry R = -1. Temperature of fatigue test was chosen from two reasons; one is that limit operating temperature for this type of alloy is 650 – 700 °C due to precipitation of stable but incoherent orthorhombic Ni3Nb delta phase; the second reason for this temperature is fact that metastable body-centred tetragonal Ni3Nb gamma double prime phase starts to transform to delta phase and from that reason there is an expectation for mechanical properties decreasing due to increased volume of delta phase. For evaluation of fatigued specimens were Scanning Electron Microscopy (SEM) and Transmission Electron Microscopy (TEM) observation used. Also methods of quantitative metallography – coherent testing grids were used for evaluation of delta phase volume. Some references describe that higher volume of delta phase, mostly situated at grain boundaries, act as initiation sites for cracks and therefore decreasing mechanical properties. Employed SEM and TEM analysis confirm the increased volume of delta phase in specimens after fatigue loading but a negative influence on dynamic properties, such fatigue lifetime, for this alloy was not confirmed.

Phase Transformations in Ti-7w/oMo-3w/oMe Alloy

1974 ◽  
Vol 32 ◽  
pp. 514-515
Author(s):  
S. Fujishiro
Keyword(s):  
Electron Microscopy ◽  
Mechanical Properties ◽  
Transmission Electron Microscopy ◽  
Tensile Strength ◽  
Mechanical Processing ◽  
Ray Method ◽  
X Ray ◽  
Transmission Electron ◽  
Water Quench ◽  
Alpha Beta

The mechanical properties of three titanium alloys (Ti-7Mo-3Al, Ti-7Mo- 3Cu and Ti-7Mo-3Ta) were evaluated as function of: 1) Solutionizing in the beta field and aging, 2) Thermal Mechanical Processing in the beta field and aging, 3) Solutionizing in the alpha + beta field and aging. The samples were isothermally aged in the temperature range 300° to 700*C for 4 to 24 hours, followed by a water quench. Transmission electron microscopy and X-ray method were used to identify the phase formed. All three alloys solutionized at 1050°C (beta field) transformed to martensitic alpha (alpha prime) upon being water quenched. Despite this heavily strained alpha prime, which is characterized by microtwins the tensile strength of the as-quenched alloys is relatively low and the elongation is as high as 30%.

Transmission Electron Microscopy of an Aluminum-Silver-Stainless Steel Solid State Bond

1985 ◽  
Vol 43 ◽  
pp. 172-173
Author(s):  
M. J. Carr ◽  
J. F. Shewbridge ◽  
T. O. Wilford
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Solid State ◽  
Specimen Preparation ◽  
Dimensional Control ◽  
Tem Analysis ◽  
Metal Parts ◽  
Dissimilar Metal ◽  
Transmission Electron ◽  
Short Time

Strong solid state bonds are routinely produced between physical vapor deposited (PVD) silver coatings deposited on sputter cleaned surfaces of two dissimilar metal parts. The low temperature (200°C) and short time (10 min) used in the bonding cycle are advantageous from the standpoint of productivity and dimensional control. These conditions unfortunately produce no microstructural changes at or near the interface that are detectable by optical, SEM, or microprobe examination. Microstructural problems arising at these interfaces could therefore easily go undetected by these techniques. TEM analysis has not been previously applied to this problem because of the difficulty in specimen preparation. The purpose of this paper is to describe our technique for preparing specimens from solid state bonds and to present our initial observations of the microstructural details of such bonds.

TEM Sample Preparation Tricks for Advanced DRAMs

2015 ◽  
Author(s):  
Ching Shan Sung ◽  
Hsiu Ting Lee ◽  
Jian Shing Luo
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Sample Preparation ◽  
Integrated Circuit ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Tem Analysis ◽  
Cross Sectional ◽  
Transmission Electron ◽  
Characterization Of Materials

Abstract Transmission electron microscopy (TEM) plays an important role in the structural analysis and characterization of materials for process evaluation and failure analysis in the integrated circuit (IC) industry as device shrinkage continues. It is well known that a high quality TEM sample is one of the keys which enables to facilitate successful TEM analysis. This paper demonstrates a few examples to show the tricks on positioning, protection deposition, sample dicing, and focused ion beam milling of the TEM sample preparation for advanced DRAMs. The micro-structures of the devices and samples architectures were observed by using cross sectional transmission electron microscopy, scanning electron microscopy, and optical microscopy. Following these tricks can help readers to prepare TEM samples with higher quality and efficiency.

A Methodology to Reduce Ion Beam Induced Damage in TEM Specimens Prepared by FIB

2002 ◽  
Author(s):  
Chin Kai Liu ◽  
Chi Jen. Chen ◽  
Jeh Yan.Chiou ◽  
David Su
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Sample Preparation ◽  
Integrated Circuit ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Specimen Preparation ◽  
Tem Analysis ◽  
Sensitive Issue ◽  
Transmission Electron

Abstract Focused ion beam (FIB) has become a useful tool in the Integrated Circuit (IC) industry, It is playing an important role in Failure Analysis (FA), circuit repair and Transmission Electron Microscopy (TEM) specimen preparation. In particular, preparation of TEM samples using FIB has become popular within the last ten years [1]; the progress in this field is well documented. Given the usefulness of FIB, “Artifact” however is a very sensitive issue in TEM inspections. The ability to identify those artifacts in TEM analysis is an important as to understanding the significance of pictures In this paper, we will describe how to measure the damages introduced by FIB sample preparation and introduce a better way to prevent such kind of artifacts.

scholarly journals Structural Analysis of Jumbo Coliphage phAPEC6

2020 ◽  
Vol 21 (9) ◽  
pp. 3119 ◽  
Author(s):  
Jeroen Wagemans ◽  
Jessica Tsonos ◽  
Dominique Holtappels ◽  
Kiandro Fortuna ◽  
Jean-Pierre Hernalsteens ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Capsid Protein ◽  
Tem Analysis ◽  
Host Interaction ◽  
Cryo Electron Microscopy ◽  
Transmission Electron ◽  
Tail Sheath ◽  
Associated Proteins ◽  
Contractile Tail ◽  
Phage Capsid

The phAPEC6 genome encodes 551 predicted gene products, with the vast majority (83%) of unknown function. Of these, 62 have been identified as virion-associated proteins by mass spectrometry (ESI-MS/MS), including the major capsid protein (Gp225; present in 1620 copies), which shows a HK97 capsid protein-based fold. Cryo-electron microscopy experiments showed that the 350-kbp DNA molecule of Escherichia coli virus phAPEC6 is packaged in at least 15 concentric layers in the phage capsid. A capsid inner body rod is also present, measuring about 91 nm by 18 nm and oriented along the portal axis. In the phAPEC6 contractile tail, 25 hexameric stacked rings can be distinguished, built of the identified tail sheath protein (Gp277). Cryo-EM reconstruction reveals the base of the unique hairy fibers observed during an initial transmission electron microscopy (TEM) analysis. These very unusual filaments are ordered at three annular positions along the contractile sheath, as well as around the capsid, and may be involved in host interaction.

Microstructure Evolution and Mechanical Properties of an Al-Cu-Mg Alloy at Elevated Temperature

2014 ◽  
Vol 1004-1005 ◽  
pp. 148-153
Author(s):  
Min Hao ◽  
Ji Gang Ru ◽  
Ming Liu ◽  
Kun Zhang ◽  
Liang Wang ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Mechanical Properties ◽  
Elevated Temperature ◽  
Elevated Temperatures ◽  
Shear Fracture ◽  
S Phase ◽  
Mg Alloy ◽  
Transmission Electron ◽  
Fracture Features ◽  
Scanning Electron

Scanning electron microscopy (SEM) and transmission electron microscopy (TEM) were utilized to study the microstructure and mechanical behavior of an Al-Cu-Mg alloy after tensile test at 125°C, 150°C, 175°C and 200 °C, respectively. The yield strength and ultimate tensile strength decreased with the increase of temperature, while the elongation increased firstly and then decreased. The S and S′ precipitate after tension at elevated temperatures. When the temperature was higher than 175°C, the precipitate coarsens rapidly. The alloys displayed a shear fracture features at elevated temperature. The larger S′ and S phase coarsened and dropped which forming crack in the grain boundaries and precipitate interfaces, resulting in the decrease of the elongation of the alloy.

TEM Characterization of As-Deposited and Annealed Ni/Al Multilayer Thin Film

2010 ◽  
Vol 16 (6) ◽  
pp. 662-669 ◽  
Author(s):  
S. Simões ◽  
F. Viana ◽  
A.S. Ramos ◽  
M.T. Vieira ◽  
M.F. Vieira
Keyword(s):  
Electron Microscopy ◽  
Thin Films ◽  
Transmission Electron Microscopy ◽  
Cross Section ◽  
Ion Beam ◽  
Microstructural Characterization ◽  
Multilayer Thin Films ◽  
Tem Analysis ◽  
Plan View ◽  
Transmission Electron

AbstractReactive multilayer thin films that undergo highly exothermic reactions are attractive choices for applications in ignition, propulsion, and joining systems. Ni/Al reactive multilayer thin films were deposited by dc magnetron sputtering with a period of 14 nm. The microstructure of the as-deposited and heat-treated Ni/Al multilayers was studied by transmission electron microscopy (TEM) and scanning transmission electron microscopy (STEM) in plan view and in cross section. The cross-section samples for TEM and STEM were prepared by focused ion beam lift-out technique. TEM analysis indicates that the as-deposited samples were composed of Ni and Al. High-resolution TEM images reveal the presence of NiAl in small localized regions. Microstructural characterization shows that heat treating at 450 and 700°C transforms the Ni/Al multilayered structure into equiaxed NiAl fine grains.

Effect of Coupled Conditions of Thermal Cycle and Dump Environment on Conductivity of 5mol% Yttria Stabilized Zirconia

2013 ◽  
Vol 591 ◽  
pp. 245-248 ◽  
Author(s):  
Jin Feng Xia ◽  
Hong Qiang Nian ◽  
Tao Feng ◽  
Hai Fang Xu ◽  
Dan Yu Jiang
Keyword(s):  
Electron Microscopy ◽  
Mechanical Properties ◽  
Transmission Electron Microscopy ◽  
High Temperature ◽  
Thermal Cycle ◽  
Oxygen Sensor ◽  
Yttria Stabilized Zirconia ◽  
Cyclic Change ◽  
Stabilized Zirconia ◽  
Transmission Electron

In some applications such as automotive oxygen sensor, 5mol% Y2O3stabilized zirconia (5YSZ) is generally used because it has both excellent ionic conductivity and mechanical properties. The automotive oxygen sensor would experience a cyclic change from high temperature (engine running) environment to the low temperature damp environment (in the tail pipe when vehicle stops). The conductivity change with coupled conditions of thermal cycle and dump environment in the 5mol%Y2O3ZrO2(5YSZ) system was examined by XRD,Impedance spectroscopy and transmission electron microscopy (SEM) in this paper.

Application and Study of Reactive Polyacrylate Microgel in Pigment Paint of Printed Fabric

2011 ◽  
Vol 311-313 ◽  
pp. 1044-1048
Author(s):  
Hong Long Xing ◽  
Shui Lin Chen
Keyword(s):  
Electron Microscopy ◽  
Mechanical Properties ◽  
Transmission Electron Microscopy ◽  
Sodium Dodecyl ◽  
Ammonium Persulfate ◽  
Color Fastness ◽  
Adhesive Film ◽  
Transmission Electron ◽  
Divinyl Benzene

Polyacrylate microgel emulsion was prepared by emulsion polymerization using styrene, α-n-butyl acrylate and methyl methacrylate as monomer, polyoxyethylene octylphenol ether (TX-30) and sodium dodecyl sulfate(SDS) as combine emulsifier, divinyl benzene and ammonium persulfate (APS) as initiator，respectively. The prepared microgel was analyzed by a variety of measurment methods, such as Fourier transform infrared spectroscopy and transmission electron microscopy. The effect of microgel on the rheological properties of adhesives, leveling, mechanical properties and pigment printing performance was studied. The rhelogy and the color fastness of the pigment printing binder of printed fabrics were measured by rheometer and friction color fastness test instruments, respectively. At the same time, the mechanical properties of the adhesive film was measured by strength tester. The results show that the thixotropy, leveling and mechanical properties of adhesive printing binder and pringting quality of coating fabrics were improved when the microgel was added.

Mechanical Properties and Microstructure Evolution of Typical Over-Aging State Al-Zn-Mg-Cu Alloy during Thermal Exposure

2021 ◽  
Vol 1026 ◽  
pp. 84-92
Author(s):  
Tao Qian Cheng ◽  
Zhi Hui Li
Keyword(s):  
Electron Microscopy ◽  
Mechanical Properties ◽  
Mechanical Property ◽  
Electrical Conductivity ◽  
Transmission Electron Microscopy ◽  
Tensile Strength ◽  
Thermal Exposure ◽  
Cu Alloy ◽  
Transmission Electron ◽  
Thermal Stability Of

Al-Zn-Mg-Cu alloy have been widely used in aerospace industry. However, there is still a lack of research on thermal stability of Al-Zn-Mg-Cu alloy products. In the present work, an Al-Zn-Mg-Cu alloy with T79 and T74 states was placed in the corresponding environment for thermal exposure experiments. Performance was measured by tensile strength, hardness and electrical conductivity. In this paper, precipitation observation was analyzed by transmission electron microscopy (TEM) and high-resolution transmission electron microscopy (HREM). The precipitations of T79 state alloy were GPⅡ zone, η' phase and η phase while the ultimate tensile strength, hardness and electrical conductivity were 571MPa, 188.2HV and 22.2MS×m-1, respectively. The mechanical property of T79 state alloy decreased to 530MPa and 168.5HV after thermal exposure. The diameter of precipitate increased and the precipitations become η' and η phase at the same time. During the entire thermal exposure, T74 state alloy had the same mechanical property trend as T79 state alloy. The precipitate diameter also increased while the types of precipitate did not change under thermal exposure. The size of precipitates affected the choice of dislocation passing through the particles to affect the mechanical properties.

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