Effect on Crystal Orientation on Residual Stress and Electrical Properties of a PZT Thin Film Deposited on Buffered-Si Substrate

2006 ◽  
Vol 320 ◽  
pp. 65-68
Author(s):  
Keisuke Fujito ◽  
Naoki Wakiya ◽  
Takanori Kiguchi ◽  
Nobuyasu Mizutani ◽  
Kazuo Shinozaki
Keyword(s):  
Thin Films ◽  
Residual Stress ◽  
Electrical Properties ◽  
Tensile Stress ◽  
Remanent Polarization ◽  
Residual Tensile Stress ◽  
Si Substrate ◽  
Pzt Thin Films ◽  
Pzt Film ◽  
Pzt Thin Film

Changes of residual stress and electrical properties were examined in (001)-oriented and (111)-oriented Pb(Zr0.5Ti0.5)O3 (PZT) thin films deposited on a buffered-Si substrate with a buffer and bottom electrode layer of a (La,Sr)CoO3(LSCO). A (001)-epitaxial PZT film was prepared on LSCO/CeO2 /Zr0.85Y0.15O1.93(YSZ)/Si. In addition, a (111)-oriented PZT film was prepared on LSCO/SrTiO3(ST) /Mn0.24Zn0.09Fe2.67O4(MZF)/YSZ/Si. The residual tensile stress in (001)-PZT thin films decreased from 2.92 to 1.98 GPa and the remanent polarization increased from 7.5 to 41.7 @C/cm2 as the LSCO thickness increased. In (111)-PZT, the residual tensile stress decreased from 1.72 to 0.95 GPa and remanent polarization increased from 9.5 to 26.7 @C/cm2. The residual tensile stress of (111)-PZT was less than that of (001)-PZT. The remanent polarization in the 80 nm (111)-PZT was greater than that of the 60 nm (001)-PZT. In the 700-nm-thick PZT, the remanent polarization in (001)-PZT was greater than that in (111)-PZT.

Microstructure and Electrical Properties of R.F. Magnetron Sputtering Derived PZT Thin Films Deposited on PbO Buffer Layer

2005 ◽  
Vol 486-487 ◽  
pp. 626-629 ◽  
Author(s):  
Chul Ho Park ◽  
Young Gook Son
Keyword(s):  
Thin Films ◽  
Magnetron Sputtering ◽  
Buffer Layer ◽  
Memory Window ◽  
Processing Temperature ◽  
Si Substrate ◽  
Pzt Thin Films ◽  
Maximum Value ◽  
Pzt Thin Film ◽  
Mfis Structure

The MFS and MFIS structures were prepared on the Si and PbO/Si substrate by the r.f. magnetron sputtering method. When the PbO buffer layer was inserted between the PZT thin film and Si substrate, the crystallization of the PZT thin films was considerably improved, and the processing temperature was lowered. Compared with the MFS structure, memory window values of the MFIS structure with the buffer layer were considerably improved. In particular, in the MFIS structure, the maximum value of the memory window is 2.0 V under the applied voltage of 9V for Pt/PZT (200 nm, 400ı)/PbO (80 nm)/Si structures with the PbO buffer layer deposited at the substrate temperature of 300ı.

PZT Thin Films Deposited by RF Magnetron Sputtering

2013 ◽  
Vol 302 ◽  
pp. 8-13
Author(s):  
Shun Fa Hwang ◽  
Wen Bin Li
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Annealing Temperature ◽  
Bottom Electrode ◽  
Rf Sputtering ◽  
Rf Magnetron Sputtering ◽  
Pzt Thin Films ◽  
Pzt Film ◽  
Pzt Thin Film

PZT thin film was fabricated by using RF-sputtering process, and platinum was used as bottom electrodes. The sputtering gases were Ar：O2＝25：0 sccm, Ar：O2＝20：5 sccm, or Ar：O2＝15：10 sccm. After sputtering, the PZT film was annealed for 5 minutes under O2 gas environment and at the temperature of 600 0C, 650 0C, 700 0C or 750 0C. To judge the quality of the deposited PZT film, its physical properties and electric properties were evaluated. The results indicate that the best crystallization temperature of PZT thin film is about 700 0C. Also, the roughness of the PZT thin film becomes larger with the increasing of annealing temperature. By adding more oxygen in the sputtering gas, one could have better crystallization of the PZT film. As for the electrical properties, the leakage current of PZT thin film increases with the increasing of annealing temperature. Furthermore, the ferroelectric property is affected by the crystallization amount of perovskite, the thickness of PZT thin film, and the diffusion situation between the bottom electrode and the PZT film.

Control of Grain Size of Pb(Zr,Ti)O3 Thin Films by MOCVD and the Effect of Size on the Electrical Properties

1998 ◽  
Vol 541 ◽  
Author(s):  
H. Fujisawa ◽  
S. Nakashima ◽  
M. Shimizu ◽  
H. Niu
Keyword(s):  
Thin Films ◽  
Growth Rate ◽  
Grain Size ◽  
Electrical Properties ◽  
Coercive Field ◽  
Remanent Polarization ◽  
Dielectric Constants ◽  
Pzt Thin Films ◽  
Pzt Films

AbstractThe grain size of MOCVD-Pb(Zr,Ti)O3 (PZT) thin films was successfully controlled by changing the grain size of Ir bottom electrodes and by changing the growth rate of PZT films. In Ir/PZT/Ir/SiO2/Si capacitors, the grain size of PZT thin films increased from 120 to 240nm as the grain size of bottom Ir electrodes increased from 50 to 200nm. The dielectric constants of PZT thin films increased from 760 to 1440 as the grain size increased from 120 to 240nm. Remanent polarization increased and coercive field decreased as the grain size increased. This dependence of electrical properties on the grain size coincided with that of ceramics.

Measuring Fatigue in PZT Thin Films

1990 ◽  
Vol 200 ◽  
Author(s):  
D. J. Johnson ◽  
D. T. Amm ◽  
E. Griswold ◽  
K. Sreenivas ◽  
G. Yi ◽  
...  
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Dielectric Permittivity ◽  
Dielectric Response ◽  
Remanent Polarization ◽  
Small Signal ◽  
Large Signal ◽  
Pzt Thin Films ◽  
Pzt Thin Film

ABSTRACTSmall signal dielectric response is reported for a variety of PZT thin film samples. Small and large signal responses, recorded simultaneously during the fatiguing of PZT thin films, are used to identify distinct fatigue mechanisms. Microcracking or electrode delamination less than 100 Å is sufficient to explain the high correlation between the dielectric permittivity and remanent polarization during fatigue.

scholarly journals Robust ferroelectricity enhancement of PZT thin films by a homogeneous seed layer

2021 ◽  
Author(s):  
jie jiang ◽  
Lei Liu ◽  
Kuo Ouyang ◽  
Zhouyu Chen ◽  
Shengtao Mo ◽  
...  
Keyword(s):  
Thin Films ◽  
Electrical Properties ◽  
Remanent Polarization ◽  
Perovskite Phase ◽  
Ferroelectric Properties ◽  
Sol Gel ◽  
Pzt Thin Films ◽  
Large Dielectric Constant ◽  
Sol Gel Process ◽  
A New Technique

Abstract With its excellent ferroelectric properties such as large dielectric constant and large remanent polarization, PZT thin films are extensively used in micro-sensors and other devices. In this study, the sol-gel process was used to fabricate Pb(Zr0.52Ti0.48)O3 thin films with Pb(ZrxTi1−x)O3 seed islands. The experimental consequences demonstrate that all the Pb(Zr0.52Ti0.48)O3 thin films with Pb(ZrxTi1−x)O3 seeds show pure perovskite phase with no other impurity phases, and the electrical properties of Pb(Zr0.52Ti0.48)O3 thin films modified by Pb(ZrxTi1−x)O3 seed islands with different Zr/Ti ratios are improved, such as remanent polarization increased, dielectric properties increased, coercive electric field decreased, leakage current density decreased, etc. In particular, the electrical properties of the Pb(Zr0.52Ti0.48)O3 thin films with Pb(ZrxTi1−x)O3 seed islands are the most optimal when the x is 0.52. This paper provides a new technique for optimizing the electrical properties of PZT thin films, which is of great significance for breaking through the bottleneck of the development of ferroelectric memory.

scholarly journals Structural, dielectric and ferroelectric characterization of PZT thin films

Cerâmica ◽  
1999 ◽  
Vol 45 (292-293) ◽  
pp. 99-102
Author(s):  
E.B. Araújo ◽  
J.A. Eiras
Keyword(s):  
Thin Films ◽  
Remanent Polarization ◽  
Hysteresis Loops ◽  
Average Thickness ◽  
Si Substrate ◽  
Precursor Method ◽  
Pzt Thin Films ◽  
Oxide Precursor ◽  
Capacitance Voltage

In this work ferroelectric thin films of PZT were prepared by the oxide precursor method, deposited on Pt/Si substrate. Films of 0.5 mm average thickness were obtained. Electrical and ferroelectric characterization were carried out in these films. The measured value of the dielectric constant for films was 455. Ferroelectricity was confirmed by Capacitance-Voltage (C-V) characteristics and P-E hysteresis loops. Remanent polarization for films presented value around 5.0 µC/cm2 and a coercive field of 88.8 kV/cm.

scholarly journals Properties of RF-Sputtered PZT Thin Films with Ti/Pt Electrodes

2014 ◽  
Vol 2014 ◽  
pp. 1-5 ◽  
Author(s):  
Cui Yan ◽  
Yao Minglei ◽  
Zhang Qunying ◽  
Chen Xiaolong ◽  
Chu Jinkui ◽  
...  
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Residual Stress ◽  
Annealing Temperature ◽  
X Ray Diffraction ◽  
Pzt Thin Films ◽  
X Ray ◽  
Grain Sizes ◽  
Pzt Thin Film ◽  
Average Residual

Effect of annealing temperature and thin film thickness on properties of Pb(Zr0.53Ti0.47)O3(PZT) thin film deposited via radiofrequency magnetron sputtering technique onto Pt/Ti/SiO2/Si substrate was investigated. Average grain sizes of the PZT thin film were measured by atomic force microscope; their preferred orientation was studied through X-ray diffraction analysis. Average residual stress in the thin film was estimated according to the optimized Stoney formula, and impedance spectroscopy characterization was performed via an intelligent LCR measuring instrument. Average grain sizes of PZT thin films were 60 nm~90 nm and their average roughness was less than 2 nm. According to X-ray diffraction analysis, 600°C is the optimal annealing temperature to obtain the PZT thin film with better crystallization. Average residual stress showed that thermal mismatch was the decisive factor of residual stress in Pt/Ti/SiO2/Si substrate; the residual stress in PZT thin film decreased as their thickness increased and increased with annealing temperature. The dielectric constant and loss angle tangent were extremely increased with the thickness of PZT thin films. The capacitance of the device can be adjusted according to the thickness of PZT thin films.

Stress and Deformation of Pzt Thin Film on Silicon Wafer Due to Thermal Expansion

1999 ◽  
Vol 574 ◽  
Author(s):  
Ming Zang ◽  
Dennis L. Polla ◽  
Shayne M. Zurn ◽  
Tianhong Cui
Keyword(s):  
Thin Films ◽  
Thermal Stress ◽  
Silicon Nitride ◽  
Tensile Stress ◽  
Silicon Dioxide ◽  
Silicon Wafer ◽  
Thermal Stresses ◽  
Pzt Thin Films ◽  
Pzt Film ◽  
Stress And Deformation

AbstractStress and deformation of PZT thin films deposited on silicon wafers due to thermal expansion during the annealing process are modeled using a 3-D shell element of ANSYS. Two different designs of PZT thin films on the wafer are modeled. The first design is a PZT/Pt/Ti/silicon dioxide/silicon wafer, which is used for making acoustic emission sensors. The second design is a PZT/Pt/Ti/silicon dioxide/silicon nitride/silicon dioxide/silicon wafer, commonly used in fabrication of cantilever beams. For the design without the silicon nitride layer, the thermal stress of the PZT film is 298MPa, Pt 1280MPa, Ti 647MPa, the silicon dioxide layer is 228MPa, and the silicon wafer is 0.41–1.67MPa. For the design with silicon nitride, the thermal stresses are: PZT 301MPa, Pt 1280MPa, Ti 651MPa, silicon dioxide 226MPa, silicon nitride 416MPa, silicon dioxide 226MPa, and silicon wafer 1.05–4.23MPa. The residual stress of the PZT film is measured at 200–25OMPa for the design without silicon nitride, and 336MPa for the design with silicon nitride. Comparisons of the thermal stress with the tensile or proof stress of material for each layer indicate that thermal stress of the PZT film is slightly greater than its bulk tensile stress, that of Pt film is five times greater than its bulk tensile stress, and that of Ti film is approximately equal to its bulk tensile stress. The thermal stresses of silicon dioxide, silicon nitride, and silicon wafer layers are far smaller than their proof stresses.

Thick Pb(Zr,Ti)O3 films fabricated by inducing residual compressive stress during the annealing process

2005 ◽  
Vol 20 (11) ◽  
pp. 2898-2901 ◽  
Author(s):  
Jae-Wung Lee ◽  
Jong-Jin Choi ◽  
Gun-Tae Park ◽  
Chee-Sung Park ◽  
Hyoun-Ee Kim
Keyword(s):  
Residual Stress ◽  
Electrical Properties ◽  
Compressive Stress ◽  
Crack Formation ◽  
Annealing Process ◽  
Residual Compressive Stress ◽  
Silicon Substrates ◽  
Si Substrate ◽  
Pzt Film ◽  
Pzt Films

The effects of residual stress induced during the annealing process on the microstructural evolution and electrical properties of Pb(Zr,Ti)O3 (PZT) films were investigated. PZT films were deposited on platinized silicon substrates by the radio frequency magnetron sputtering method using a single oxide target. Compressive stress was induced in the film by bending the silicon substrate during sputtering using a specially designed substrate holder and subsequently annealing the film without the holder. Without the residual stress, the PZT film was severely cracked when it was thicker than 2 μm due to the thermal expansion mismatch between the PZT and the Si substrate. On the other hand, when the residual stress was applied, no cracks were detected in the film for thicknesses of up to 4 μm. The suppression of crack formation was attributed to the residual compressive stress that compensated for the tensile stress generated during and/or after the annealing process. The electrical properties of the PZT film with the residual stress were improved compared to those of the PZT film without the residual stress.

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