Large Displacement Out-Of-Plane Bimorph Actuator for Optical Application

2006 ◽  
Vol 326-328 ◽  
pp. 1383-1386
Author(s):  
Won Kyu Jeung ◽  
Yong Jun Kim ◽  
Seog Moon Choi
Keyword(s):  
Large Deflection ◽  
Coefficient Of Thermal Expansion ◽  
Vertical Displacement ◽  
Micro Electro Mechanical System ◽  
Large Displacement ◽  
Small Temperature ◽  
Out Of Plane ◽  
Micro Actuators ◽  
Plane Displacement ◽  
Device Size

A new thermal bimorph actuator for large out-of-plane displacement is designed, fabricated and tested. The deflecting beam is composed of polyimide, heater, and polyvinyl difluorides with tetrafluoroethylene (PVDF-TrFE). The large difference of coefficient of thermal expansion (CTE) of two polymer layers (polyimide and PVDF-TrFE) can generate a large deflection with relatively small temperature rising. Compared to the most conventional micro actuators based on MEMS (micro-electro mechanical system) technology, a large displacement, over 1 mm at 20 mW, could be achieved. The proposed actuator can find applications where a large vertical displacement is needed while keeping compact overall device size, such as a micro zooming lens, micro mirror, micro valve and optical application.

scholarly journals Design and Fabrication of a Kirigami-Inspired Electrothermal MEMS Scanner with Large Displacement

Micromachines ◽  
2020 ◽  
Vol 11 (4) ◽  
pp. 362 ◽  
Author(s):  
Masaaki Hashimoto ◽  
Yoshihiro Taguchi
Keyword(s):  
Fill Factor ◽  
Vertical Displacement ◽  
Large Displacement ◽  
Microelectromechanical System ◽  
Stress Control ◽  
Japanese Art ◽  
Out Of Plane ◽  
High Fill Factor ◽  
Optical Applications ◽  
Mems Process

Large-displacement microelectromechanical system (MEMS) scanners are in high demand for a wide variety of optical applications. Kirigami, a traditional Japanese art of paper cutting and folding, is a promising engineering method for creating out-of-plane structures. This paper explores the feasibility and potential of a kirigami-inspired electrothermal MEMS scanner, which achieves large vertical displacement by out-of-plane film actuation. The proposed scanner is composed of film materials suitable for electrothermal self-reconfigurable folding and unfolding, and microscale film cuttings are strategically placed to generate large displacement. The freestanding electrothermal kirigami film with a 2 mm diameter and high fill factor is completely fabricated by careful stress control in the MEMS process. A 200 μm vertical displacement with 131 mW and a 20 Hz responsive frequency is experimentally demonstrated as a unique function of electrothermal kirigami film. The proposed design, fabrication process, and experimental test validate the proposed scanner’s feasibility and potential for large-displacement scanning with a high fill factor.

scholarly journals Sensor Integrated Load-Bearing Structures: Measuring Axis Extension with DIC-Based Transducers

Sensors ◽  
2021 ◽  
Vol 21 (12) ◽  
pp. 4104
Author(s):  
Nassr Al-Baradoni ◽  
Peter Groche
Keyword(s):  
Cost Effective ◽  
Image Correlation ◽  
Maximum Deviation ◽  
Single Image ◽  
Eccentric Load ◽  
Load Bearing ◽  
Out Of Plane ◽  
Axis Extension ◽  
Plane Displacement ◽  
Imaging Sensor

In this paper we present a novel, cost-effective camera-based multi-axis force/torque sensor concept for integration into metallic load-bearing structures. A two-part pattern consisting of a directly incident and mirrored light beam is projected onto the imaging sensor surface. This allows the capturing of 3D displacements, occurring due to structure deformation under load in a single image. The displacement of defined features in size and position can be accurately analyzed and determined through digital image correlation (DIC). Validation on a prototype shows good accuracy of the measurement and a unique identification of all in- and out-of-plane displacement components under multiaxial load. Measurements show a maximum deviation related to the maximum measured values between 2.5% and 4.8% for uniaxial loads ( and between 2.5% and 10.43% for combined bending, torsion and axial load. In the course of the investigations, the measurement inaccuracy was partly attributed to the joint used between the sensor parts and the structure as well as to eccentric load.

scholarly journals Locally Corroded Stiffener Effect on Shear Buckling Behaviors of Web Panel in the Plate Girder

2015 ◽  
Vol 2015 ◽  
pp. 1-19 ◽  
Author(s):  
Jungwon Huh ◽  
In-Tae Kim ◽  
Jin-Hee Ahn
Keyword(s):  
Corrosion Damage ◽  
Element Analysis ◽  
Buckling Strength ◽  
Lower Shear ◽  
Out Of Plane ◽  
Shear Buckling ◽  
Buckling Failure ◽  
Plane Displacement ◽  
The Web ◽  
Plate Girder

The shear buckling failure and strength of a web panel stiffened by stiffeners with corrosion damage were examined according to the degree of corrosion of the stiffeners, using the finite element analysis method. For this purpose, a plate girder with a four-panel web girder stiffened by vertical and longitudinal stiffeners was selected, and its deformable behaviors and the principal stress distribution of the web panel at the shear buckling strength of the web were compared after their post-shear buckling behaviors, as well as their out-of-plane displacement, to evaluate the effect of the stiffener in the web panel on the shear buckling failure. Their critical shear buckling load and shear buckling strength were also examined. The FE analyses showed that their typical shear buckling failures were affected by the structural relationship between the web panel and each stiffener in the plate girder, to resist shear buckling of the web panel. Their critical shear buckling loads decreased from 82% to 59%, and their shear buckling strength decreased from 88% to 76%, due to the effect of corrosion of the stiffeners on their shear buckling behavior. Thus, especially in cases with over 40% corrosion damage of the vertical stiffener, they can have lower shear buckling strength than their design level.

Mechanism of the Transition From In-Plane Buckling to Helical Buckling for a Stiff Nanowire on an Elastomeric Substrate

2016 ◽  
Vol 83 (4) ◽  
Author(s):  
Youlong Chen ◽  
Yong Zhu ◽  
Xi Chen ◽  
Yilun Liu
Keyword(s):  
High Performance ◽  
Three Dimensional ◽  
Stretchable Electronics ◽  
Buckling Mode ◽  
Design And Optimization ◽  
Out Of Plane ◽  
Plane Direction ◽  
Plane Displacement ◽  
Helical Buckling ◽  
Selection Of

In this work, the compressive buckling of a nanowire partially bonded to an elastomeric substrate is studied via finite-element method (FEM) simulations and experiments. The buckling profile of the nanowire can be divided into three regimes, i.e., the in-plane buckling, the disordered buckling in the out-of-plane direction, and the helical buckling, depending on the constraint density between the nanowire and the substrate. The selection of the buckling mode depends on the ratio d/h, where d is the distance between adjacent constraint points and h is the helical buckling spacing of a perfectly bonded nanowire. For d/h > 0.5, buckling is in-plane with wavelength λ = 2d. For 0.27 < d/h < 0.5, buckling is disordered with irregular out-of-plane displacement. While, for d/h < 0.27, buckling is helical and the buckling spacing gradually approaches to the theoretical value of a perfectly bonded nanowire. Generally, the in-plane buckling induces smaller strain in the nanowire, but consumes the largest space. Whereas the helical mode induces moderate strain in the nanowire, but takes the smallest space. The study may shed useful insights on the design and optimization of high-performance stretchable electronics and three-dimensional complex nanostructures.

Using the Simplified 3D DIC Method to Measure the Deformation of 3D Surface

2011 ◽  
Vol 121-126 ◽  
pp. 3945-3949 ◽  
Author(s):  
Shih Heng Tung ◽  
Jui Chao Kuo ◽  
Ming Hsiang Shih ◽  
Wen Pei Sung
Keyword(s):  
Measurement Accuracy ◽  
Good Accuracy ◽  
Correlation Method ◽  
Image Correlation ◽  
2D Digital Image Correlation ◽  
Plate Specimen ◽  
Before And After ◽  
Out Of Plane ◽  
Plane Displacement ◽  
2D And 3D

In recent years, 2D digital image correlation method (DIC) has been widely used in the measurement of plane strain. However, out-of-plane displacement could be induced during the loading and it would affect the measurement accuracy. Thus, a 3D measurement is necessary. This study utilizes a simplified 3D DIC to measure the geometry of an object before and after deformation. Then the finite element concept is involved to determine the strain after deformation. A flat plate specimen with in-plane and out-of-plane displacement is observed. Both 2D and 3D DIC are used to analyze the strain. The results show that using 3D DIC to measure strain is feasible and with a very good accuracy.

Sign in / Sign up

Export Citation Format

Share Document