Optimal Design and Simulation of a Cross-Plane Micro-Thermoelectric Generator

2012 ◽  
Vol 503 ◽  
pp. 240-243 ◽  
Author(s):  
Xiao Liang Zhu ◽  
De Sheng Li ◽  
Ben Dong Liu ◽  
Jiang Zhe
Keyword(s):  
Thermoelectric Generator ◽  
Low Cost ◽  
Saturated Calomel Electrode ◽  
Element Analysis ◽  
Flexible Polymer ◽  
Mems Technology ◽  
In Series ◽  
Micro Thermoelectric Generator ◽  
P Type ◽  
Releasing Process

This paper presents a new way to design a low-cost micro-thermoelectric generator (μ-TEG) which can be fabricated by using electrochemical and MEMS technology. The overall dimension of the μ-TEG is about 13mm × 13mm × 0.4mm, which contains 128 p- and n-type pairs of semiconductors connected electrically in series and thermally in parallel. The p-type antimony telluride (Sb2Te3) and n-type bismuth telluride (Bi2Te3) with an optimal thickness of 20μm were designed to deposit in a flexible polymer mold formed by photolithographic patterning of Polyimide (PI) with a three electrode configuration. Simulations of the thermocouple with PI mold were carried on, using finite element analysis. The analysis shows the possibility to achieve 3.5 mV while the difference in temperature is 10K and the thickness of the silicon substrate is 400μm, which reveals that the output power of the thermocouple without releasing process is only 4% lower than the one with the releasing process. Therefore the PI mold is not removed, considering the potential for easier fabrication and lower cost. The deposition parameters were also studied and optimized for the best thermoelectric performance. In our experiments, the n- and p-type semiconductors could be obtained when the voltage and current are around 50mV versus saturated calomel electrode (SCE) and 40 mA, respectively.

Flexible film-based thermoelectric generators

MRS Advances ◽  
2019 ◽  
Vol 4 (30) ◽  
pp. 1691-1697
Author(s):  
Shuping Lin ◽  
Wei Zeng ◽  
Lisha Zhang ◽  
Xiaoming Tao
Keyword(s):  
Seebeck Coefficient ◽  
Thermoelectric Generator ◽  
Low Cost ◽  
Thermoelectric Generators ◽  
Polystyrene Sulfonate ◽  
Paper Substrate ◽  
Thermoelectric Element ◽  
Flexible Film ◽  
P Type ◽  
Flexible Thermoelectric

ABSTRACT:The present work highlights the progress in the field of flexible thermoelectric generator (f-TEGs) fabricated by 3-D printing strategy on the typing paper substrate. In this study, printable thermoelectric paste was developed. The dimension of each planer thermoelectric element is 30mm*4mm with a thickness of 50 μm for P-type Bismuth Tellurium (Bi2Te3)-based/ poly(3,4-ethylenedioxythiophene) polystyrene sulfonate (PEDOT:PSS) leg. A single thermoleg with this dimension can generate a voltage of 5.38 mV at a temperature difference of 70 K. The calculated Seebeck Coefficient of a single thermoleg is 76.86 μV/K. This work demonstrates that low-cost printing technology is promising for the fabrication of f-TEGs.

Design, Optimization, and Experiments of Compliant Microgripper

2003 ◽  
Author(s):  
Young Seok Oh ◽  
Woo Ho Lee ◽  
Harry E. Stephanou ◽  
George D. Skidmore
Keyword(s):  
Mass Production ◽  
Low Cost ◽  
Three Dimensional ◽  
Sensory Information ◽  
Silicon On Insulator ◽  
Element Analysis ◽  
Deep Reactive Ion Etching ◽  
Design And Optimization ◽  
Mems Technology ◽  
Large Opening

Recent progress of MEMS technology enables the mass production of microdevices with low cost. However, methods for designing microgrippers and microdevice assembly processes have not been studied extensively. This paper presents the design and optimization of compliant microgripper, and snap-fit based microassembly experiments. A key issue of microassembly is to design a microgripper that is capable of handling and manipulating microparts with positional uncertainty and the lack of sensory information. Topology optimization is used to design compliant microgrippers that can produce a large opening at the tip or a gripper, and Finite Element Analysis (FEA) is performed to evaluate the characteristics of grippers. Compliant microgripper driven by the embedded thermal actuator and snap-connectors were fabricated using deep reactive ion etching (DRIE) process with Silicon On Insulator (SOI) wafer. With a fabricated microgripper and several snap-fits, the assembly of a three dimensional microstructure was successfully demonstrated.

Development of a Low Cost Planar Micro Thermoelectric Generator

2013 ◽  
pp. 267-271 ◽  
Author(s):  
S. Pelegrini ◽  
A. Adami ◽  
C. Collini ◽  
P. Conci ◽  
L. Lorenzelli ◽  
...  
Keyword(s):  
Thermoelectric Generator ◽  
Low Cost ◽  
Micro Thermoelectric Generator

scholarly journals A New Approach of Soft Joint Based on a Cable-Driven Parallel Mechanism for Robotic Applications

Mathematics ◽  
2021 ◽  
Vol 9 (13) ◽  
pp. 1468
Author(s):  
Luis Nagua ◽  
Carlos Relaño ◽  
Concepción A. Monje ◽  
Carlos Balaguer
Keyword(s):  
Parallel Mechanism ◽  
Degrees Of Freedom ◽  
Kinematic Model ◽  
Experimental Tests ◽  
Humanoid Robots ◽  
Inverse Kinematic ◽  
Element Analysis ◽  
New Approach ◽  
Flexible Polymer ◽  
The Mathematical Model

A soft joint has been designed and modeled to perform as a robotic joint with 2 Degrees of Freedom (DOF) (inclination and orientation). The joint actuation is based on a Cable-Driven Parallel Mechanism (CDPM). To study its performance in more detail, a test platform has been developed using components that can be manufactured in a 3D printer using a flexible polymer. The mathematical model of the kinematics of the soft joint is developed, which includes a blocking mechanism and the morphology workspace. The model is validated using Finite Element Analysis (FEA) (CAD software). Experimental tests are performed to validate the inverse kinematic model and to show the potential use of the prototype in robotic platforms such as manipulators and humanoid robots.

scholarly journals Mitigating the seismic pounding of multi-story buildings in series using linear and nonlinear fluid viscous dampers

2021 ◽  
Vol 21 (4) ◽  
Author(s):  
Hytham Elwardany ◽  
Robert Jankowski ◽  
Ayman Seleemah
Keyword(s):  
Substantial Improvement ◽  
Point Of View ◽  
Steel Buildings ◽  
Viscous Dampers ◽  
Element Analysis ◽  
Fluid Viscous Dampers ◽  
Adjacent Buildings ◽  
In Series ◽  
Linear And Nonlinear ◽  
Nonlinear Fluid

AbstractSeismic-induced pounding between adjacent buildings may have serious consequences, ranging from minor damage up to total collapse. Therefore, researchers try to mitigate the pounding problem using different methods, such as coupling the adjacent buildings with stiff beams, connecting them using viscoelastic links, and installing damping devices in each building individually. In the current paper, the effect of using linear and nonlinear fluid viscous dampers to mitigate the mutual pounding between a series of structures is investigated. Nonlinear finite-element analysis of a series of adjacent steel buildings equipped with damping devices was conducted. Contact surfaces with both contactor and target were used to model the mutual pounding. The results indicate that the use of linear or nonlinear dampers leads to the significant reduction in the response of adjacent buildings in series. Moreover, the substantial improvement of the performance of buildings has been observed for almost all stories. From the design point of view, it is concluded that dampers implemented in adjacent buildings should be designed to resist maximum force of 6.20 or 1.90 times the design independent force in the case of using linear or nonlinear fluid viscous dampers, respectively. Also, designers should pay attention to the design of the structural elements surrounding dampers, because considerable forces due to pounding may occur in the dampers at the maximum displaced position of the structure.

Performance of Low-Cost 3D Printer in Medical Application

2021 ◽  
Author(s):  
Nor Aiman Sukindar ◽  
Azib Azhari Awang Dahan ◽  
Sharifah Imihezri Syed Shaharuddin ◽  
Nor Farah Huda Abd Halim
Keyword(s):  
Low Cost ◽  
Medical Application ◽  
Fused Deposition Modelling ◽  
3D Printer ◽  
Layer By Layer ◽  
Total Deformation ◽  
Element Analysis ◽  
Porosity Level ◽  
Fused Deposition ◽  
Printing Parameters

Abstract Fused Deposition Modelling (FDM) is an additive manufacturing (AM) process that produces a physical object directly from a CAD design using layer-by-layer deposition of the filament material that is extruded via a nozzle. In industry, FDM has become one of the most used AM processes for the production of low batch quantity and functional prototypes, due to its safety, efficiency, reliability, low cost, and ability to process manufacturing-grade engineering thermoplastic. Recently, the market is flooded with the availability of low-cost printers produced by numerous companies. This research aims to investigate the effect of different porosity levels on a scaffold structure produced using a low-cost 3D printer. Comparisons of these porous structures were made in terms of Von-Mises strain, total deformation, as well as compressive stress. Various porosity levels were created by varying printing parameters, including layer height, infill density, and shell thickness by slicing the initial solid CAD file using Repetier Host 3D printing software. Finite Element Analysis (FEA) simulation was then performed on the created scaffold structures by using Ansys Workbench 19.2. The simulation result indicates that the greater porosity level will result in higher total deformation of the structure. Meanwhile, the compression test shows that the minimum strength value obtained was favourable at 22 MPa and had exceeded that of the trabecular femur (15 MPa). However, its porosity level (maximum at 52%) was still below that of the minimum threshold of porosity level of 70 percent. However, the printing parameters currently used can be adjusted in the future. Therefore, it was deduced that the low-cost 3D printer offers promising potential to fabricate different porosity structures with multiple outcomes.

Nickle Oxide Regulating Surface Oxygen to Promote Formaldehyde Oxidation on Manganese Oxide Catalyst

2021 ◽  
Author(s):  
Hailin Zhao ◽  
Jie Tang ◽  
Zengyuan Li ◽  
Jie Yang ◽  
Hao Liu ◽  
...  
Keyword(s):  
Manganese Oxide ◽  
High Activity ◽  
Catalytic Oxidation ◽  
Oxide Catalyst ◽  
Low Cost ◽  
Surface Oxygen ◽  
Formaldehyde Oxidation ◽  
Type Semiconductor ◽  
Manganese Oxide Catalyst ◽  
P Type

Catalytic oxidation is the most effective method to eliminate the in-door formaldehyde, the Mn-based catalyst with low cost and high activity has drawn great attention. Herein, p-type semiconductor NiO doped...

Buckling analysis of natural fiber reinforced composites

2021 ◽  
Vol 7 (2) ◽  
pp. 58
Author(s):  
Celal Çakıroğlu ◽  
Gebrail Bekdaş
Keyword(s):  
Composite Plate ◽  
Natural Fiber ◽  
Low Cost ◽  
Natural Fibers ◽  
Experimental Studies ◽  
Fiber Reinforced Composites ◽  
Fiber Types ◽  
Reinforced Composites ◽  
Fiber Reinforced ◽  
Element Analysis

In the recent years natural fiber reinforced composites are increasingly receiving attention from the researchers and engineers due to their mechanical properties comparable to the conventional synthetic fibers and due to their ease of preparation, low cost and density, eco-friendliness and bio-degradability. Natural fibers such as kenaf or flux are being considered as a viable replacement for glass, aramid or carbon. Extensive experimental studies have been carried out to determine the mechanical behavior of different natural fiber types such as the elastic modulus, tensile strength, flexural strength and the Poisson’s ratio. This paper presents a review of the various experimental studies in the field of fiber reinforced composites while summarizing the research outcome about the elastic properties of the major types of natural fiber reinforced composites. Furthermore, the performance of a kenaf reinforced composite plate is demonstrated using finite element analysis and results are compared to a glass fiber reinforced laminated composite plate.

RF-MEMS Components and Networks for High-Performance Reconfigurable Telecommunication and Wireless Systems

2012 ◽  
Vol 81 ◽  
pp. 65-74 ◽  
Author(s):  
Jacopo Iannacci ◽  
Giuseppe Resta ◽  
Paola Farinelli ◽  
Roberto Sorrentino
Keyword(s):  
High Performance ◽  
Microelectromechanical Systems ◽  
Rf Mems ◽  
Low Cost ◽  
Impedance Matching ◽  
Phase Shifters ◽  
Rf Systems ◽  
Mems Technology ◽  
And Performance ◽  
Rf Performance

MEMS (MicroElectroMechanical-Systems) technology applied to the field of Radio Frequency systems (i.e. RF-MEMS) has emerged in the last 10-15 years as a valuable and viable solution to manufacture low-cost and very high-performance passive components, like variable capacitors, inductors and micro-relays, as well as complex networks, like tunable filters, reconfigurable impedance matching networks and phase shifters, and so on. The availability of such components and their integration within RF systems (e.g. radio transceivers, radars, satellites, etc.) enables boosting the characteristics and performance of telecommunication systems, addressing for instance a significant increase of their reconfigurability. The benefits resulting from the employment of RF-MEMS technology are paramount, being some of them the reduction of hardware redundancy and power consumption, along with the operability of the same RF system according to multiple standards. After framing more in detail the whole context of RF MEMS technology, this paper will provide a brief introduction on a typical RF-MEMS technology platform. Subsequently, some relevant examples of lumped RF MEMS passive elements and complex reconfigurable networks will be reported along with their measured RF performance and characteristics.

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