Design of Inner Wedge-Form Tool in Precision Recycle of Digital Paper Display

2009 ◽  
Vol 620-622 ◽  
pp. 607-610
Author(s):  
Pai Shan Pa
Keyword(s):  
Indium Tin Oxide ◽  
Feed Rate ◽  
Thin Film Deposition ◽  
Film Deposition ◽  
Machining Process ◽  
Slant Angle ◽  
High Rotational Speed ◽  
Digital Paper ◽  
Small Width ◽  
Short Period

The low yield of ITO thin film deposition is an important factor in optoelectronic semiconductor production. A recycle fabrication module uses micro electroremoving as a precision machining process with a new design of inner wedge-form tool to remove the defective Indium-tin-oxide (ITO) nanostructure from the optical PET surfaces of digital paper display is presented in current studies. The adopted precision recycle process requires only a short period of time to remove the ITO nanostructure easily and cleanly is based on technical and economical considerations and is highly efficient. In the current experiment, a higher feed rate of the optical PET diaphragm combines with enough electric power to drive fast micro electroremoving. A large slant angle of the cathode and a small arc rounding radius of the anode takes less time for the same amount of ITO removal. High rotational speed of the electrodes can improve the effect of dregs discharge and is advantageous to associate with the fast feed rate of the workpiece (optical PET diaphragm). A small rotational diameter of the anode accompanied by a small width of the cathode corresponds to a higher removal rate for the ITO nanostructure.

Precision Recycle Module for Digital-Paper Display Using Twins-Cylinder Tool

2010 ◽  
Vol 428-429 ◽  
pp. 387-390
Author(s):  
Pai Shan Pa
Keyword(s):  
Thin Film ◽  
Tin Oxide ◽  
Indium Tin Oxide ◽  
Feed Rate ◽  
Removal Rate ◽  
Small Diameter ◽  
Production Costs ◽  
High Rotational Speed ◽  
Digital Paper ◽  
Short Period

A new effective fabrication module was developed to mediate the problem of the low yield of Indium-tin-oxide (ITO) nanostructures deposition uses micro electroremoval technology and a design of twins-cylinder tool as a precision etching process to remove the defective Indium-tin-oxide (ITO) from the optical PET diaphragm surfaces of digital-paper displays. For the removal-process, a small gap width between the negative electrode and the workpiece (optical PET diaphragm) surface corresponds to a higher removal rate for the ITO. A small diameter of the anode or a small diameter of the cathode of the twins-cylinder tool provides large electric current density and takes less time for the same amount (20 nm) of ITO removal. High rotational speed of the twins-cylinder tool the discharge mobility and results in improving the removal effect. Providing enough electrical power can uses fast feed rate of the optical PET diaphragm combined with a fast removal rate for ITO. With increasing in current rating, pulsed direct current can improve the effect of dregs discharge and is advantageous to associate with the fast feed rate of the optical PET diaphragm. By establishing a recycling process using the ultra-precise removal of thin-film nanostructures, through the micro electroremoval and the twins-cylinder electrodes requires only a short period of time to remove the ITO thin-film easily and cleanly. The optoelectronic semiconductor industry can effectively recycle defective products, minimizing both production costs and pollution.

Reclamation of Polymer PET Substrate Using T-Form Tool

2009 ◽  
Vol 626-627 ◽  
pp. 1-4
Author(s):  
Pai Shan Pa
Keyword(s):  
Tin Oxide ◽  
Indium Tin Oxide ◽  
Feed Rate ◽  
Removal Rate ◽  
Etching Rate ◽  
High Rotational Speed ◽  
Small Thickness ◽  
Short Period ◽  
Gap Width ◽  
Pet Substrate

In the current study, a reclamation module uses micro electroetching as a precision fabrication with a new design of T-form tool to remove the defective Indium-tin-oxide (TCO) nanostructure from the optical PET surfaces of digital paper display is presented in current studies. The adopted precision reclamation process requires only a short period of time to remove the TCO nanostructure easily and cleanly is based on technical and economical considerations and is highly efficient. A large rotational diameter of the cathode accompanied by a small gap width between the cathode and the workpiece corresponds to a higher removal rate for the TCO nanostructure. A small thickness of the electrodes, or a small edge radius of the electrodes takes less time for the same amount of TCO removal. A higher feed rate of the optical PET diaphragm combines with enough electric power to drive fast etching rate. High rotational speed of the T-form tool can improve the effect of dregs discharge and is advantageous to associate with the fast feed rate of the workpiece (optical PET diaphragm).

Product Design of a Precision Recycle-Process Tool for Displays' Color Filters of TFT-LCDs

2008 ◽  
Vol 44-46 ◽  
pp. 449-454
Author(s):  
Pai Shan Pa
Keyword(s):  
Thin Film ◽  
Feed Rate ◽  
Removal Rate ◽  
Film Deposition ◽  
Production Costs ◽  
Color Filter ◽  
High Rotational Speed ◽  
Removal Process ◽  
Short Period ◽  
Thin Film Nanostructures

An effective process was developed using electroremoval as a precision removal-process for indium tin oxide (ITO) thin-film nanostructures from the displays’ color filter surface of thin film transistor liquid crystal displays (TFT-LCDs). The low yield of ITO thin-film deposition is an important factor in semiconductor production. By establishing a recycling process using the ultra-precise removal of thin-film nanostructures, the semiconductor optoelectronic industry can effectively recycle defective products, minimizing both production costs and pollution. For the removal-process, high rotational speed of the electrode (negative-pole) elevates the discharge mobility and results in improved removal. High flow velocity of the electrolyte provides larger discharge mobility and greater removal ability. An adequate gap-width between the negative-electrode and the ITO surface, or a higher working temperature, results in a higher removal rate for ITO thin-films. Also, adequate feed rate of the color filter combined with enough electrical power produces a fast removal rate. Pulsed direct current can improve the effect of dregs discharge and is advantageous to associate with the fast feed rate of the workpiece (displays’ color filter), but it raises the current rating. Electrochemical removal requires only a short period of time to remove the ITO thin-film easily and cleanly.

Convex-Shape Tool in Nano-Fabrication of Digital-Paper Display

2010 ◽  
Vol 135 ◽  
pp. 36-40
Author(s):  
Pai Shan Pa
Keyword(s):  
Indium Tin Oxide ◽  
Feed Rate ◽  
Removal Rate ◽  
Large Diameter ◽  
Electrochemical Machining ◽  
Machining Time ◽  
Convex Shape ◽  
High Rotational Speed ◽  
Nano Fabrication ◽  
Digital Paper

This study describes a new module that uses micro electrochemical machining, and a new design of a convex-shaped tool, in a precision reclamation process to remove defective Indium-tin-oxide (ITO) nanostructures from the optical PET diaphragm surfaces of a digital-paper display. This process takes very little time to remove the ITO layers easily and cleanly and is highly efficient both technically and economically. A small end radius of the cathode or a thin cathode of the bulge-form tool takes less time for the same amount (20 nm) of ITO removal. A large diameter of the cathode of the bulge-form tool combined with a small gap between the cathode and the workpiece corresponds to a higher removal rate of ITO. A high rotational speed of the bulge-form tool can also improve dregs discharge and allows a higher feed rate of the optical PET diaphragm. This higher feed rate combined with enough voltage results in a shorter machining time.

The Removal of In2O3SnO4 Thin Film Using an Arc-Form Tool for the Precision Recycling of Defective Digital-Paper

2013 ◽  
Vol 668 ◽  
pp. 288-291
Author(s):  
P.S. Pa
Keyword(s):  
Thin Film ◽  
Indium Tin Oxide ◽  
Electrochemical Etching ◽  
Removal Rate ◽  
High Rotational Speed ◽  
Digital Paper ◽  
Higher Temperature ◽  
Pulsed Direct Current ◽  
Gap Width ◽  
Thin Film Nanostructures

A newly designed arc-form shaped tool was used to carry out precise micro electrochemical etching (MECE) to remove Indium-tin-oxide (In2O3SnO2) thin-film nanostructures from the optical PET diaphragm surfaces for digital-paper surface. For this precise removal process, a higher current with a faster feed rate of the optical PET diaphragm effectively achieved rapid material removal. A pulsed direct current can improve dregs discharge and is advantageous when associated with fast PET feed rates, but this raises the total current required. A higher temperature or flow velocity of the electrolyte corresponds to a higher removal rate of the In2O3SnO2 nanostructures. A high rotational speed of the arc-form shaped tool corresponds to a higher removal rate of In2O3SnO2. A large cathode, along with a small gap-width between the cathode and the PET diaphragm, increases In2O3SnO2 removal rates. A thin cathode, or a short arc length of the arc-form anode, reduces the time taken for In2O3SnO2 removal.

A Design Reuse Process in Reduction the Low Yield Rate for Display Panel

2013 ◽  
Vol 313-314 ◽  
pp. 1144-1147 ◽  
Author(s):  
P.S. Pa
Keyword(s):  
Thin Film ◽  
Tin Oxide ◽  
Indium Tin Oxide ◽  
Feed Rate ◽  
Semiconductor Industry ◽  
Machining Process ◽  
Oxide Thin Film ◽  
Color Filter ◽  
Yield Rate ◽  
Major Interest

The low yield rate in display panel production that results from imperfect Indium Tin Oxide layer deposition is well known. In this experiment a 6thGeneration TFT-LCD is used to investigate an ultra-precise method for the removal of Indium Tin Oxide (ITO) thin film microstructure from defective display panels. The complete removal of the ITO layer makes it possible to put these panels back into the production line for reuse with a considerable reduction of both waste and production cost. This process, which involves the removal of ITO layer substructure by means of an electro-chemical etching process, is of major interest to the optoelectronics semiconductor industry. The ITO film can be removed completely by a proper combination of feed rate and electric power. In this electro machining process a high current flow and high feed rate of the display (color filter) achieves complete and efficient removal of the ITO layer. A large diameter cathode virtual rotation circle also corresponds to a higher removal rate. A small cathode end radius effectively improves dregs discharge and is an advantage when associated with a high workpiece feed rate. This precision reuse process for the recycling of defective display screen color filters is presented as an effective tool for use in the screen manufacturing process. The defective Indium Tin Oxide thin-film can be removed easily and cleanly in a short time.

Design of Surface Finish Using Synchronous Process of Grinding and Electrochemical Finishing

2007 ◽  
Vol 359-360 ◽  
pp. 259-263
Author(s):  
Pai Shan Pa
Keyword(s):  
Surface Roughness ◽  
Flow Rate ◽  
Surface Finish ◽  
Feed Rate ◽  
Rotational Speed ◽  
Machining Process ◽  
Grinding Wheel ◽  
High Rotational Speed ◽  
Plate Electrode ◽  
Electrochemical Finishing

In order to elevate the efficiency of the surface finish to reach the fast improvement of the surface roughness of the workpiece, so as to reduce the residual stress on the surface efficiently. The present study discusses the surface after traditional machining, of which the plane surface used a design of finish tool includes an electrode and a nonconductive grinding wheel to execute the synchronous process of grinding and electrochemical finishing. The electrode form and the machining process are obviously different from electrochemical grinding (ECG). In the experiment, the design electrode is used with continuous and pulsed direct current. The controlled factors include die material, and chemical composition and concentration of the electrolyte. The experimental parameters are flow rate of electrolytes, position of plate electrode, electrode thickness, electrode rotational speed, electrical current rating, feed rate of workpiece, and pulsed period. The experimental results show that the supply of current rating is near concern with the position and thickness of the plate electrode. The use of large electrolytic flow rate and thick electrode is advantageous to the finish effect. High rotational speed of finish tool produces better polishing. The finishing effect is better with longer off-time because discharge of polishing dregs becomes easier. Higher current rating with quicker workpiece feed rate effectively reaches the fast improvement of the surface roughness of the workpiece is recommend in current study.

Advances in Thin Film Technology through the Application of Modulated Pulse Power Sputtering

2010 ◽  
Vol 638-642 ◽  
pp. 208-213 ◽  
Author(s):  
Brajendra Mishra ◽  
J.J. Moore ◽  
Jian Liang Lin ◽  
W.D. Sproul
Keyword(s):  
Thin Film ◽  
Magnetron Sputtering ◽  
High Power ◽  
Thin Film Deposition ◽  
Film Deposition ◽  
Pulse Power ◽  
Degree Of Ionization ◽  
Crn Coating ◽  
Short Period ◽  
Crn Coatings

High power pulsed magnetron sputtering (HPPMS) is an emerging thin film deposition technology that generate high ionization plasma by applying a very large amount of peak power to a sputtering target for a short period of time. HPPMS is also known as High Power Impulse Magnetron Sputtering (HiPIMS). However, HPPMS/HiPIMS exhibits decreased deposition rate as compared to continuous dc magnetron sputtering. Modulated pulse power (MPP) magnetron sputtering is an alternative HPPIMS deposition technique that overcomes the rate loss problem while still achieving a high degree of ionization of the sputtered material. In the present work, the principles and some important characteristics of MPP technology were presented. Technical examples of CrN coatings were deposited using MPP and continuous dc sources. The positive ion mass distributions were characterized using an electrostatic quadrupole plasma mass spectrometer. The structure and properties of MPP and dc CrN coatings were characterized using x-ray diffraction, scanning electron microscopy, nanoindentation tests, and ball-on-disc wear test. It was found that the MPP CrN coating exhibits denser microstructure and improved mechanical and tribological properties as compared to the dc CrN coating.

TEM studies of pulse electrodeposited Cu-Se and CuInSe2 films

1990 ◽  
Vol 48 (4) ◽  
pp. 696-697
Author(s):  
G. Veilleux ◽  
M. Boumerzoug ◽  
R.G. Saint-Jacques ◽  
Lê H. Dao
Keyword(s):  
Thin Film ◽  
Heat Treatment ◽  
Indium Tin Oxide ◽  
Large Scale ◽  
Low Cost ◽  
Thin Film Deposition ◽  
Film Deposition ◽  
Phase Changes ◽  
Solution Ph ◽  
Ito Glass

Photovoltaic technology is considered as one of the major options for large-scale energy production without pollution. Thin-film technologies are seen as a potential approach to produce cost-effective electricity by photovoltaic. Among the different thin-film deposition techniques (CVD, vacuum evaporation, sputtering, etc.), electrodeposition has emerged as a low-cost method. Using a pulsed electrodeposition technique semiconductor thin films of Cu-Se and CuInSe2 with improved uniformity and lower impurity have been prepared. Varying the electrodeposition solution pH, stoichiometric CuSe, Cu3Se2, Cu2 Se and Cu2Se films on Indium Tin Oxide (ITO) coated glass or Ni electrodes were obtained. Their composition and properties varied with heat treatment (3).This paper reports the detailed study by Energy-Dispersive Spectrometry (EDS) and Transmission Electron Microscopy (TEM) of heat treatment effects on the composition and phase changes. EDS analyses were done on films deposited onto ITO glass using an Hitachi S-530 Scanning Electron Microscope (SEM). Cerac 99.99% pure powders were used to establish EDS calibration spectra. TEM studies were done on films directly deposited onto Ni grids. Selected area diffraction pattern (SADP) analyses were used to identify the structures. Samples were examined in a Philips EM-300 TEM operated at 100 kV.

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