Theoretical Model of Grinding Force in Quick-Point Grinding

2009 ◽  
Vol 626-627 ◽  
pp. 75-80 ◽  
Author(s):  
Jian Qiu ◽  
Ya Dong Gong ◽  
Yue Ming Liu ◽  
J. Cheng
Keyword(s):  
Material Removal ◽  
Tangential Velocity ◽  
Grinding Force ◽  
Grinding Wheel ◽  
Equivalent Diameter ◽  
Grinding Forces ◽  
Cutting Depth ◽  
Force Ratio ◽  
Grinding Mechanism ◽  
Material Removal Mode

Separating the workpiece velocity on the plane of grinding wheel, it is helpful to analyze Quick-point grinding mechanism. There are some relations among wheel’s deflective angle, workpiece feed velocity and tangential velocity. In this research, the resultant workpiece speed, grinding contact zone and material removal mode is analyzed. And a model is established which is helpful to analyze the tendency of component grinding forces and force ratio. It is found the grinding force is influenced by the factors such as cutting depth, wheel velocity, grinding angle as well as equivalent diameter, respectively. Finally, a theoretical basis for actual processing is provided.

scholarly journals Experimental Study on Grinding Force of Zirconia Ceramics in Dry/Wet Grinding Environment

2018 ◽  
Vol 198 ◽  
pp. 02004
Author(s):  
Junping Zhang ◽  
Weidong Wang ◽  
Songhua Li ◽  
Han Tao
Keyword(s):  
Grinding Force ◽  
Grinding Wheel ◽  
Feed Speed ◽  
Zirconia Ceramics ◽  
Grinding Forces ◽  
Measuring Device ◽  
Linear Speed ◽  
Wet Grinding ◽  
Dry Grinding ◽  
Force Ratio

The impacts of different linear speed of grinding wheel, grinding depth and workpiece feed speed with or without grinding fluid on grinding force were studied by plane grinding machining of zirconia ceramics. The impacts of different machining environment and grinding parameter on normal and tangential grinding forceswere studied by testing the grinding force during grinding with a force measuring device. The studies showed that the normal and tangential grinding forces decrease with the increase of the linear speed of grinding wheel and increase with the improvement of grinding depth and workpiece feed speed. The grinding depth has the greatest impacts on the normal and tangential grinding forces in dry grinding environment; while in wet grinding environment, the grinding depth exerts the greatest impacts on the normal grinding force and the linear speed of grinding wheel imposes the greatest impacts on the tangential grinding force. In addition, it was found that the normal grinding force in dry grinding is minor than that in wet grinding, that the tangential grinding force in dry grinding is greater than that in wet grinding, and that the grinding force ratio in dry grinding is lower than that in wet grinding.

scholarly journals Experimental Research on Material Removal Mechanism and Grinding Force of FeCoNiCrMo0.1 High Entropy Alloy (HEA)

2021 ◽  
Author(s):  
Ruchu Xu ◽  
Xuelong Wen ◽  
Yadong Gong ◽  
Xingchen Yu
Keyword(s):  
Material Removal ◽  
Grinding Force ◽  
Grinding Wheel ◽  
High Entropy Alloy ◽  
Force Model ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Grinding Forces ◽  
High Entropy ◽  
Cbn Grinding Wheel

Abstract High entropy alloy (HEA) is an advanced alloy material, which has a wide application prospect due to its excellent properties. However, the material removal mechanism and change rule of grinding force of HEA in the grinding process have seldom been studied. The main work of this paper is that the material removal mechanism of the FeCoNiCrMo0.1 HEA is obtained by analyzing grinding debris and subsurface microstructure after grinding, the theoretical grinding force model of HEAs in plane grinding process is established on the basis of the force of a single abrasive grain, and the experimental verification is performed. According to the experimental results, the influences of different grinding parameters on grinding force are discussed, the influences of different types of grinding wheels on grinding force are analyzed, and the grinding forces generated by grinding different FeCoNiCr HEAs are compared. The results indicate that the material removal mechanism of FeCoNiCrMo0.1 HEA is the plastic removal. With the increase of grinding speed and the decrease of grinding depth and feed speed, both normal and tangential grinding forces decrease. Under the same grinding parameters, the grinding force produced by electroplated CBN grinding wheel is greater, followed by resin-bonded CBN grinding wheel and vitrified CBN grinding wheel. The grinding force produced by grinding FeCoNiCrAl0.1 HEA is lower than that produced by grinding FeCoNiCrMo0.1 HEA under the same grinding conditions. The calculated value of grinding force model is consistent with the experimental value, which can scientifically reflect the variation law of HEA grinding force.

Grinding Characteristic Research of High Efficiency Deep Grinding for Viscous Material

2010 ◽  
Vol 126-128 ◽  
pp. 88-95
Author(s):  
Xiao Min Sheng ◽  
Li Guo ◽  
Kun Tang ◽  
Hai Qing Mi ◽  
Jian Wu Yu ◽  
...  
Keyword(s):  
Titanium Alloy ◽  
Material Removal ◽  
High Efficiency ◽  
Chip Thickness ◽  
Grinding Force ◽  
Tc4 Titanium Alloy ◽  
Force Ratio ◽  
Systemic Process ◽  
Material Removal Mode ◽  
Grinding Power

Focusing on the characteristic of hard-to-grinding for viscous materials, such as titanium alloy, systemic process experiments were done about grinding viscous materials, such as TC4 titanium alloy, under the high efficiency deep grinding (HEDG). Based on the analysis to the changing and characteristic of unit area grinding force F' with maximum undeformed chip thickness hmax and equivlent cutting thickness aeq , this paper discussed the changing of its material removal mode and analyzed the changing and characteristic of grinding force ratio N, specific grinding energy es with corresponding parameters further. Then, it was analyzed about the consumption of grinding power on the process of HEDG for TC4 titanium alloy. The experiment results reveal that application of HEDG can improve machining efficiency of grinding viscous materials.

scholarly journals Study on the Effect of Grinding Pressure on Material Removal Behavior Performed on a Self-Designed Passive Grinding Simulator

2021 ◽  
Vol 11 (9) ◽  
pp. 4128
Author(s):  
Peng-Zhan Liu ◽  
Wen-Jun Zou ◽  
Jin Peng ◽  
Xu-Dong Song ◽  
Fu-Ren Xiao
Keyword(s):  
Residual Stress ◽  
Surface Roughness ◽  
Service Life ◽  
Material Removal ◽  
Removal Rate ◽  
Grinding Force ◽  
Grinding Wheel ◽  
Grinding Process ◽  
Grinding Temperature ◽  
Grinding Efficiency

Passive grinding is a new rail grinding strategy. In this work, the influence of grinding pressure on the removal behaviors of rail material in passive grinding was investigated by using a self-designed passive grinding simulator. Meanwhile, the surface morphology of the rail and grinding wheel were observed, and the grinding force and temperature were measured during the experiment. Results show that the increase of grinding pressure leads to the rise of rail removal rate, i.e., grinding efficiency, surface roughness, residual stress, grinding force and grinding temperature. Inversely, the enhancement of grinding pressure and grinding force will reduce the grinding ratio, which indicates that service life of grinding wheel decreases. The debris presents dissimilar morphology under different grinding pressure, which reflects the distinction in grinding process. Therefore, for rail passive grinding, the appropriate grinding pressure should be selected to balance the grinding quality and the use of grinding wheel.

Development of Three-Dimensional Dynamometer for Wafer Grinder

2010 ◽  
Vol 126-128 ◽  
pp. 361-366 ◽  
Author(s):  
Xiang Long Zhu ◽  
Ren Ke Kang ◽  
Yong Qing Wang ◽  
Dong Ming Guo
Keyword(s):  
Three Dimensional ◽  
High Sensitivity ◽  
Grinding Force ◽  
Grinding Wheel ◽  
Grinding Process ◽  
Performance Parameters ◽  
Grinding Forces ◽  
Grinding Method ◽  
Static Performance ◽  
Good Repeatability

Grinding forces during grinding silicon wafer have great influences on the accuracy, surface quality and grinding yield of the wafer. It is necessary to develop an accurate and reliable grinding dynamometer for measuring and monitoring the grinding process of the large and thin wafer. In this work, a new 3D (three-dimensional) grinding dynamometer using piezoelectric sensors is designed and developed, which is used for a wafer grinder based on wafer rotating grinding method. The calibrating experiments of the 3D grinding dynamometer are carried out. The FEA and modal analysis are made and compared with the results of mode testing. Furthermore, the static performance parameters of the dynamometer are obtained from the loading experiment. The experiment results indicate that the 3D grinding dynamometer can measure axial, radial and tangential grinding force of grinding wheel with high sensitivity, good linearity, good repeatability and high natural frequency, and fully satisfied requirement for measuring and monitoring of the grinding force in wafer grinding process.

Study on Surface Roughness in Ultrasonic Vibration Mill-Grinding Hot-Pressed Silicon Nitride

2012 ◽  
Vol 500 ◽  
pp. 269-274 ◽  
Author(s):  
Guo Chao Qiao ◽  
Ming Zhou ◽  
Ming Wang
Keyword(s):  
Surface Roughness ◽  
Ultrasonic Vibration ◽  
Material Removal ◽  
Machining Parameters ◽  
Cutting Depth ◽  
Abrasive Grain ◽  
Feeding Speed ◽  
Material Removal Mode ◽  
Amplitude Decrease ◽  
Vibration Mill

In order to investigate the influences of machining parameters on surface roughness in ultrasonic vibration mill-grinding, the motion of abrasive grain is analyzed. The analysis indicates that grain and workpiece separate periodically which are beneficial for coolant entering into grinding zone to reduce grinding temperature and grinding force and improve surface quality. Experiments are carried out and detected by SEM and roughmeter, the results indicate that influences of spindle rate, feeding speed, cutting depth and amplitude decrease in turn. Through regression analysis, an empirical formula is obtained. The experiments indicate that material removal mode dominates surface roughness.

Finite Element Simulation of Axial Creep-Feed Grinding Engineering Ceramics Based on ANSYS/LS-DYNA

2012 ◽  
Vol 472-475 ◽  
pp. 927-931
Author(s):  
Xin Li Tian ◽  
Fu Qiang Li ◽  
Ya Tao Mao ◽  
Bao Guo Zhang ◽  
Jian Quan Wang
Keyword(s):  
Grinding Force ◽  
Grinding Forces ◽  
Engineering Ceramics ◽  
Creep Feed Grinding ◽  
Creep Feed ◽  
Element Simulation ◽  
Grinding Conditions ◽  
Grinding Mechanism ◽  
Single Grain ◽  
Diamond Grain

Introducing the grinding mechanism of axial creep-feed grinding ceramics with a single diamond grain. Establishing the simulation model of a single grain grinding engineering ceramics by axial creep-feed grinding and analyzing the simulation results of the grinding force in the X,Y,Z axis. Finally, the impacts of the wheel speed, axial feed rate and workpiece speed upon grinding forces were discussed by simulating the single diamond abrasive grinding process under different grinding conditions.

Grinding Force in Creep Feed Grinding of Titanium Alloy with Monolayer Brazed CBN Wheels

2012 ◽  
Vol 565 ◽  
pp. 94-99 ◽  
Author(s):  
Chang Yong Yang ◽  
Jiu Hua Xu ◽  
Wen Feng Ding
Keyword(s):  
Titanium Alloy ◽  
Boron Nitride ◽  
Cubic Boron Nitride ◽  
Grinding Force ◽  
Grinding Forces ◽  
Specific Grinding Energy ◽  
Creep Feed Grinding ◽  
Creep Feed ◽  
Force Ratio ◽  
Composite Filler

In this paper, grinding forces of titanium alloy Ti-6Al-4V are measured during creep feed grinding with brazed cubic boron nitride (CBN) wheels. The effects of process parameters on grinding force, force ratio and specific grinding energy are investigated in detail. The grinding force is low and force ratio is about 1.5, and the specific grinding energy of titanium alloys Ti-6Al-4V is about 65J/mm3. Also, CBN wheels brazed with composite filler of Ag-Cu-Ti and 0.5wt.% lanthanum show better grinding performance than the counterpart brazed with Ag-Cu-Ti filler in this investigation.

Study on Grinding Machinability of Titanium Alloy Using SiC Abrasive

2011 ◽  
Vol 487 ◽  
pp. 34-38 ◽  
Author(s):  
Guo Giang Guo ◽  
X.H. Zheng ◽  
Z.Q. Liu ◽  
Qing Long An ◽  
Ming Chen
Keyword(s):  
Titanium Alloy ◽  
High Temperature ◽  
Surface Topography ◽  
Specific Energy ◽  
Ground Surface ◽  
Grinding Force ◽  
Grinding Forces ◽  
Grinding Mechanism ◽  
Dry Conditions ◽  
Metallurgical Structure

Experimental results of Ti-6-2-4-2S, Ti-6-4 and Ti-5-5-5-1-1 are detailed in this paper with conventional surface grinding using SiC abrasive under dry conditions. Measurements of grinding forces, surface topography and metallurgical structure of ground surface were taken to investigate the grinding mechanism of these materials. The results showed grinding force ratios to these materials were between 1.35 to 2.25 at all material remove rates, but the specific energy to Ti-5-5-5-1-1 and Ti-6-2-4-2S were little higher than Ti-6-4. Evaluation of ground surface topography indicated they were visually free of crack and burn. At the same grinding parameters, Ti-5-5-5-1-1 had the maximum depth of heat-affected zone because of its poor high temperature properties.

Multigrain Smoothed Particle Hydrodynamics and Hertzian Contact Modeling of the Grinding Force in Atherectomy

2019 ◽  
Vol 141 (4) ◽  
Author(s):  
Yihao Zheng ◽  
Yao Liu ◽  
Yang Liu ◽  
Albert J. Shih
Keyword(s):  
Smoothed Particle Hydrodynamics ◽  
Cutting Forces ◽  
Grinding Force ◽  
Grinding Wheel ◽  
Hertz Contact ◽  
Grinding Forces ◽  
Calcified Plaque ◽  
Particle Hydrodynamics ◽  
Smoothed Particle ◽  
The Impact

This study investigated the grinding force in rotational atherectomy, a clinical procedure that uses a high-speed grinding wheel to remove hardened, calcified plaque inside the human arteries. The grinding force, wheel motion, and ground surface were measured based on a ring-shape bovine bone surrogate for the calcified plaque. At 135,000, 155,000, and 175,000 rpm wheel rotational speed, the grinding forces were 1.84, 1.92, and 2.22 N and the wheel orbital speeds were 6060, 6840, and 7800 rpm, respectively. The grinding wheel was observed to bounce on the wall of the bone surrogate, leaving discrete grinding marks. Based on this observation, we modeled the grinding force in two components: impact and cutting forces. The impact force between the grinding wheel and the bone surrogate was calculated by the Hertz contact model. A multigrain smoothed particle hydrodynamics (SPH) model was established to simulate the cutting force. The grinding wheel model was built according to the wheel surface topography scanned by a laser confocal microscope. The workpiece was modeled by kinematic-geometrical cutting. The simulation predicted a cutting force of 41, 51, and 99 mN at the three investigated wheel rotational speeds. The resultant grinding forces, combining the impact and cutting forces modeled by the Hertz contact and SPH simulation, matched with the experimental measurements with relative errors less than 10%.

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