Ocean Sensor “Imaging” Arrays Based on Bio-inspired Architectures and 2-D/3-D Construction

2015 ◽  
Vol 49 (3) ◽  
pp. 43-49 ◽  
Author(s):  
David P. Fries ◽  
Chase A. Starr ◽  
Geran W. Barton
Keyword(s):  
Flexible Electronics ◽  
Printed Circuit Board ◽  
Single Point ◽  
Circuit Board ◽  
Sensor Systems ◽  
Large Area ◽  
Imaging Arrays ◽  
Printed Circuits ◽  
Single Sensor ◽  
New Vision

AbstractMany common ocean sensor systems measure a localized space above a single sensor element. Single-point measurements give magnitude but not necessarily direction information. Expanding single sensor elements, such as used in salinity sensors, into arrays permits spatial distribution measurements and allows flux visualizations. Furthermore, applying microsystem technology to these macro sensor systems can yield imaging arrays with high-resolution spatial/temporal sensing functions. Extending such high spatial resolution imaging over large areas is a desirable feature for new “vision” modes on autonomous robotic systems and for deployable ocean sensor systems. The work described here explores the use of printed circuit board (PCB) technology for new sensing concepts and designs. In order to create rigid-conformal, large area imaging “camera” systems, we have merged flexible PCB substrates with rigid constructions from 3-D printing. This approach merges the 2-D flexible electronics world of printed circuits with the 3-D printed packaging world. Furthermore, employing architectures used by biology as a basis for our imaging systems, we explored naturally and biologically inspired designs, their relationships to visual imagining, and alternate mechanical systems of perception. Through the use of bio-inspiration, a framework is laid out to base further research on design for packaging of ocean sensors and arrays. Using 3-D printed exoskeleton's rigid form with flexible printed circuits, one can create systems that are both rigid and form-fitting with 3-D shape and enable new sensor systems for various ocean sensory applications.

2D PCB WITH 3D PRINT FABRICATIONS FOR RIGID-CONFORMAL PACKAGING OF MICROSENSOR IMAGING ARRAYS BASED ON BIOINSPIRED ARCHITECTURES

2014 ◽  
Vol 2014 (DPC) ◽  
pp. 001012-001045
Author(s):  
David Fries ◽  
Chase StarrGeran Barton
Keyword(s):  
3D Printing ◽  
Sensor Systems ◽  
Construction Process ◽  
Imaging Arrays ◽  
Fused Deposition ◽  
Printed Circuits ◽  
Camera Systems ◽  
Macro Scale ◽  
3D Printed ◽  
Single Sensor

Macro sensor systems typically measure a localized space above a single sensor element. Expanding these single sensor elements into arrays permits spatial distribution measurements of a particular parameter and allow flux visualizations. Furthermore, applying microsystems technology to macro sensor systems yields imaging arrays and high resolution spatial/temporal sensing functions. Extending the high spatial resolution imaging over large areas is a desirable feature for new “vision” modes on autonomous robotic systems and for deployable environmental sensors. Rigid-flexible PCB's are desirable for miniaturization and integration of systems for mobile technology. The hybrid substrates provide substantial flexibility in systems design and integration of multiple functions into limited spaces. Using this design and construction approach allows lightweight, complex, and space efficient systems. Flex microsystems based on structured, fiber or non-fiber filled PCB laminates permits packaging to occur at two levels, at the local (micro) substrate scale and at the macro scale with the ability to flex the system across millimeter to centimeter lengths on real everyday systems. We continue to explore the use of PCB and PCBMEMS technology for new sensing concepts. In order to create rigid-conformal, large area imaging “camera” systems we have merged flexible PCB substrates with rigid constructions from 3D printing. This approach merges the 2D flexible electronics world of printed circuits with the 3D printed packaging world. Furthermore employing architectures used by biology as a basis for our imaging systems we explored naturally and biologically inspired designs, and their relationships to non-visible imagery, and alternate mechanical systems of perception. Radiolaria are extremely tiny ocean organisms that utilize a similar additive construction process to 3D printing. Their cell bodies secrete a substance mainly composed of silica to form intricate exoskeletons used as a system of protection. A correlation can be made between the radiolaria's construction process and the plastic extrusion system of the 3D fused deposition model printer. The benefits of additive construction are efficient use of materials, reduced cost and energy, and ability to customize forms. Through the use of bio-inspiration, a framework is laid out to base further research on (DFP)-design for packaging. Radiolarian exoskeletons take on a grid-like pattern while creating a cage around each microsensor interior and producing strong scaffolding. Using the 3D printed exoskeleton's form and function with flexible printed circuits one can create systems that are both rigid and form fitting with three-dimensional shape and enable new camera systems for various sensory applications.

scholarly journals Large-Area Resistive Strain Sensing Sheet for Structural Health Monitoring

Sensors ◽  
2020 ◽  
Vol 20 (5) ◽  
pp. 1386 ◽  
Author(s):  
Levent E. Aygun ◽  
Vivek Kumar ◽  
Campbell Weaver ◽  
Matthew Gerber ◽  
Sigurd Wagner ◽  
...  
Keyword(s):  
Structural Health Monitoring ◽  
Health Monitoring ◽  
Printed Circuit Board ◽  
Early Stage ◽  
Field Tests ◽  
Circuit Board ◽  
Gauge Factor ◽  
Peak Strain ◽  
Large Area ◽  
Structural Health

Damage significantly influences response of a strain sensor only if it occurs in the proximity of the sensor. Thus, two-dimensional (2D) sensing sheets covering large areas offer reliable early-stage damage detection for structural health monitoring (SHM) applications. This paper presents a scalable sensing sheet design consisting of a dense array of thin-film resistive strain sensors. The sensing sheet is fabricated using flexible printed circuit board (Flex-PCB) manufacturing process which enables low-cost and high-volume sensors that can cover large areas. The lab tests on an aluminum beam showed the sheet has a gauge factor of 2.1 and has a low drift of 1.5 μ ϵ / d a y . The field test on a pedestrian bridge showed the sheet is sensitive enough to track strain induced by the bridge’s temperature variations. The strain measured by the sheet had a root-mean-square (RMS) error of 7 μ ϵ r m s compared to a reference strain on the surface, extrapolated from fiber-optic sensors embedded within the bridge structure. The field tests on an existing crack showed that the sensing sheet can track the early-stage damage growth, where it sensed 600 μ ϵ peak strain, whereas the nearby sensors on a damage-free surface did not observe significant strain change.

Flexible Electronics Fabrication for Missile Wiring Interconnects

2012 ◽  
Vol 2012 (DPC) ◽  
pp. 001096-001114
Author(s):  
Michael R. Whitley ◽  
Tracy D. Hudson
Keyword(s):  
Unmanned Aerial Vehicles ◽  
Flexible Electronics ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Polyimide Films ◽  
Passive Components ◽  
Printed Circuit ◽  
Data Formats ◽  
Aerial Vehicles ◽  
Ink Jet

The increased usage of unmanned aerial vehicles has driven the desire for smaller and lighter missile bodies. The wiring harnesses required to connect the missile subsystems constitute a significant portion of the missile weight and cost. We have been exploring the development of flexible electronics substrates manufactured using ink jet technology on polyimide films. This technology has an advantage over traditional flex circuit manufacturing because in addition to creating traditional wiring patterns the ink jet technology enables the creation of passive components such as resistors and capacitors. The Dimatix DMP-2831 ink jet system uses individually controllable piezoelectric driven MEMS nozzles to precisely deposit nanoparticle inks. These inks are then annealed to form wiring patterns. We will present the process for converting traditional printed circuit board data formats to inkjet printable data, the process for depositing the ink, annealing and testing.

scholarly journals Design of a Fully Integrated Inductive Coupling System: A Discrete Approach Towards Sensing Ventricular Pressure

Sensors ◽  
2020 ◽  
Vol 20 (5) ◽  
pp. 1525
Author(s):  
Natiely Hernández Sebastián ◽  
Noé Villa Villaseñor ◽  
Francisco-Javier Renero-Carrillo ◽  
Daniela Díaz Alonso ◽  
Wilfrido Calleja Arriaga
Keyword(s):  
Pressure Sensor ◽  
Flexible Electronics ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Three Dimensional ◽  
Magnetic Coupling ◽  
Circuit Board ◽  
Ventricular Pressure ◽  
Capacitive Pressure Sensor ◽  
Implantable Medical Device

In this paper, an alternative strategy for the design of a bidirectional inductive power transfer (IPT) module, intended for the continuous monitoring of cardiac pressure, is presented. This new integrated implantable medical device (IMD) was designed including a precise ventricular pressure sensor, where the available implanting room is restricted to a 1.8 × 1.8 cm2 area. This work considers a robust magnetic coupling between an external reading coil and the implantable module: a three-dimensional inductor and a touch mode capacitive pressure sensor (TMCPS) set. In this approach, the coupling modules were modelled as RCL circuits tuned at a 13.56 MHz frequency. The analytical design was validated by means of Comsol Multiphysics, CoventorWare, and ANSYS HFSS software tools. A power transmission efficiency (PTE) of 94% was achieved through a 3.5 cm-thick biological tissue, based on high magnitudes for the inductance (L) and quality factor (Q) components. A specific absorption rate (SAR) of less than 1.6 W/Kg was attained, which suggests that this IPT system can be implemented in a safe way, according to IEEE C95.1 safety guidelines. The set of inductor and capacitor integrated arrays were designed over a very thin polyimide film, where the 3D coil was 18 mm in diameter and approximately 50% reduced in size, considering any conventional counterpart. Finally, this new approach for the IMD was under development using low-cost thin film manufacturing technologies for flexible electronics. Meanwhile, as an alternative test, this novel system was fabricated using a discrete printed circuit board (PCB) approach, where preliminary electromagnetic characterization demonstrates the viability of this bidirectional IPT design.

An Investigation Into the Effect of the PCB Motion on the Dynamic Response of MEMS Devices Under Mechanical Shock Loads

2008 ◽  
Vol 130 (3) ◽  
Author(s):  
Fadi Alsaleem ◽  
Mohammad I. Younis ◽  
Ronald Miles
Keyword(s):  
Printed Circuit Board ◽  
Electrostatic Force ◽  
Single Point ◽  
Circuit Board ◽  
Mechanical Shock ◽  
Shock Pulse ◽  
Mems Devices ◽  
Case Scenario ◽  
Worst Case ◽  
Shock Loads

We present an investigation into the effect of the motion of a printed circuit board (PCB) on the response of a microelectromechanical system (MEMS) device to shock loads. A two-degrees-of-freedom model is used to model the motion of the PCB and the microstructure, which can be a beam or a plate. The mechanical shock is represented as a single point force impacting the PCB. The effects of the fundamental natural frequency of the PCB, damping, shock pulse duration, electrostatic force, and their interactions are investigated. It is found that neglecting the PCB effect on the modeling of MEMS under shock loads can lead to erroneous predictions of the microstructure motion. Further, contradictory to what is mentioned in literature that a PCB, as a worst-case scenario, transfers the shock pulse to the microstructure without significantly altering its shape or intensity, we show that a poor design of the PCB or the MEMS package may result in severe amplification of the shock effect. This amplification can cause early pull-in instability for MEMS devices employing electrostatic forces.

Fabrication of micro-mixer on printed circuit board using electrochemical micromachining

2019 ◽  
Vol 2 (2) ◽  
pp. 85-94
Author(s):  
Jitendra Singh ◽  
Shantanu Bhattacharya
Keyword(s):  
Printed Circuit Board ◽  
Complex Geometry ◽  
Single Point ◽  
Machining Process ◽  
Circuit Board ◽  
Electrochemical Micromachining ◽  
Geometrical Parameters ◽  
Feature Size ◽  
Printed Circuit ◽  
Micro Mixer

Electrochemical micromachining (ECMM) has been mostly carried out in situations demanding precision, complexity in the shapes of final components and in case the surface integrity and performance are independent of the machining process. In this work, the following have been demonstrated: The first part of the work demonstrates the experimental setup for ECMM that is used to fabricate a micro-mixer on a printed circuit board (PCB) substrate by using a single point electrochemical machining tool with a tip diameter—150 µm. The method is able to show a promising route of fabrication where the circuit lines on a PCB substrate can be printed with high yield and processing speeds. The second part of the article points out that machining can be carried out on PCB substrates through electrochemical processes using a single point tool and a minimum feature size of 243 µm can be machined with a fine tolerance of 0.025 µm and roughness = 3.0459 µm~7.2404 µm. The third part of the article reports the geometrical parameters of a relatively complex geometry of a micro-mixer which is arrived at through a COMSOL based simulation platform that is fabricated using the mentioned manufacturing process. The process is further validated through the design of experiments, and fluid flow and mixing behaviour on the fabricated structure is evaluated through an epifluorescence microscope. The advantages that this technique may offer is in terms of achieving an overall low feature size in comparison to micro-milling and avoiding the complexities of lithography-driven processes to produce a process which has a much lower equipment dependency, is environmentally benign in comparison to the lithography driven techniques and is overall low in cost.

Artwork Scaling Factor for Inner Layers in Multi-Layer Board Manufacture

1999 ◽  
Author(s):  
Owen Christofferson ◽  
Chittaranjan Sahay
Keyword(s):  
Real Estate ◽  
Process Parameters ◽  
Printed Circuit Board ◽  
Scaling Factor ◽  
High Density ◽  
Circuit Board ◽  
Scaling Factors ◽  
Printed Circuit ◽  
Printed Circuits ◽  
Manufacturing Tolerances

Abstract Demands for high-density multi-layer printed circuits continue to push the limits of common materials and process capabilities. Materials and processes that can improve current manufacturing tolerances will improve yields on current designs as well as free up printed circuit board real estate for increased circuit densities. Achieving these improvements requires an understanding of all the variables that contribute to inner layer feature-to-drilled hole registration and how tolerances stack up to an overall capability. These variables include both material types and process parameters. This paper discusses the variables that affect overall registration capabilities, presents a technique for predicting artwork scaling factors.

scholarly journals Methods of Checking Printed Circuits

1984 ◽  
Vol 11 (3) ◽  
pp. 215-217
Author(s):  
I. Hajdu ◽  
P. Bánlaki ◽  
J. Pinkola ◽  
E. Tóth
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Electronic Circuits ◽  
High Quality ◽  
Printed Circuit ◽  
Printed Circuits ◽  
Quality Testing ◽  
Quality And Reliability ◽  
Quality Production

Printed circuits make up to 20 to 40 per cent of the value of electronic circuits.Quality and reliability requirements have been boosted by the general use of complex integrated circuits. An economical and high quality production is preconditioned by the continuous checking of prime materials and technologies.After a brief review of checking methods, a short examination of quality testing of the end product (double - or multilayer printed circuit board) is given, involving checking methods of assembled and non assembled boards.

Capacitive Fringing Field Moisture Sensors Implemented in Flexible Printed Circuit Board Technology

2014 ◽  
Vol 11 (3) ◽  
pp. 122-127 ◽  
Author(s):  
Robert N. Dean ◽  
Michael C. Hamilton ◽  
Michael E. Baginski
Keyword(s):  
Dielectric Constant ◽  
Flexible Electronics ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Radius Of Curvature ◽  
Printed Circuit ◽  
Sensor Performance ◽  
Fringing Field ◽  
Flexible Printed Circuit ◽  
Cu Foil

Capacitive fringing field sensors are often used in applications where moisture is detected, since the dielectric constant of liquid water is approximately 80 times greater than the dielectric constant of air. Most of these sensors, however, are realized using rigid substrates. Some applications would benefit from using a flexible capacitive fringing field sensor that could be conformally mounted on a nonplanar surface. Flexible printed circuit board technology is a mature commercially available process for manufacturing flexible electronics. This same technology can also be used to realize flexible fringing field moisture sensors where the patterned Cu foil is used for the electrodes and the soldermask coating electrically insulates the electrodes from being electrically shorted by moisture in the detection environment. Sensors were designed and characterized through flat and bending tests in air and in water. The tests demonstrated that bending a sensor over a radius of curvature as small as 13.7 mm had no measurable impact on sensor performance in air or in water. The sensors achieved a 3:1 increase in capacitance when immersed in water compared with in air.

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