Modeling Thermal Behavior of System-in-Package with Dynamic Compact Model
Integrating more functionality into smaller size increases the heat dissipation density and emphasizes the need for thermal simulations and accurate thermal models. With a compact thermal model (CTM) the dynamic and steady state thermal behavior of a package with several heat dissipating dice can be modeled. The optimization of the model's parameters requires a properly defined cost function. In this paper a two-phase optimization routine was used to find simultaneously good capacitance and resistance values. The accuracy of the model was improved when effective surface areas defined the convections of a CTM. Parameter optimization in time domain, for variable thermal load and nonlinear system, was tested and found accurate, but time consuming.