L/S ≤ 5/5μm Line Embedded Organic Substrate Manufacturing for 2.1D/2.5D SiP Application

2015 ◽  
Vol 2015 (1) ◽  
pp. 000874-000878 ◽  
Author(s):  
Yu-Hua Chen ◽  
Shyh-Lian Cheng ◽  
Dyi-Chung Hu ◽  
Tzvy-Jang Tseng
Keyword(s):  
Shape Control ◽  
Dielectric Material ◽  
Reduction Process ◽  
Organic Substrate ◽  
Fine Tuning ◽  
Organic Substrates ◽  
Additive Process ◽  
Fine Line ◽  
The Impact ◽  
Line Space

The requirement for IC packages with higher density interconnection with fine line feature has increased significantly recently. Current organic substrates are limited to line/space 8/8μm for Semi-additive Process(SAP), and it will cause yield loss from adhesion issue of line/space less than 5/5μm. But the impact of bad adhesion of fine line is very small in laser embedded (LE) substrate because of its embedded structure. There are several advantages of LE such as the capacity of stereo copper features and better electric performance with lower variation of trench width/depth. It can form fine pitch trench line/space even less than 3/3μm. It also can provide better design flexibility for its pad-less features and better reliability than SAP process. In this paper, we will discuss the key of the processes and demonstrate the fabrication of fine line substrate of 3/3μm line/space by fine tuning line embedded technology. Line embedded trace was made by laser direct ablation (LDA) on organic build-up dielectric material with fine filler size. Laser ablation process capability shows excellent trench depth and shape control. In order to get better copper thickness uniformity, novel uniformity copper plating technology on via, pad and trench has developed. Low cost and uniformity copper reduction process has also been evaluated and developed.

Innovated L/S less than 2/2μm Line Embedded 2.1D Organic Substrate Technology

2016 ◽  
Vol 2016 (DPC) ◽  
pp. 001682-001712 ◽  
Author(s):  
Yu-Hua Chen
Keyword(s):  
Dielectric Surface ◽  
Organic Substrate ◽  
Current Status ◽  
Organic Substrates ◽  
Additive Process ◽  
Molding Compound ◽  
Fine Line ◽  
Embedded Technology ◽  
Reliability Issue ◽  
Line Space

Current organic substrates are limited to lines/space of 10/10um and via size around 50um. However, the semiconductor with advance node needs fine line/space of 5/5 or 3/3 and even 2/2μm in the future. Si Interposer provides a high density interconnection with fine line and small via that cannot be matched by current laminate substrate technology. But the challenge of Si interposer is the high cost. We have developed an ultra-thin line embedded substrate for 2.1D/2.5D SiP application. There are two types of approach to meet the requirement of line/space less than 2/2μm in the organic substrate. One is the conventional Semi-Additive Process (SAP) and another is laser embedded technology. The advantage of SAP is the good compatibility with current process but the problem is yield and reliability issue for narrow copper trace on the dielectric surface. From the current status, line/space of 5/5μm will be the process limitation of SAP and 2/2μm need to be further verified for HVM. Another solution is line embedded (LE) technology with the different structure. LE technology is different from SAP includes ablation of trench by laser and panel plating with electroplating copper and then removing copper above dielectric surface for formation of Cu pattern. There are several advantages of laser embedded comparing to SAP. First, the laser embedded substrate provides a flat surface after formation of pattern which is helpful for covering a thinner solder mask with better uniformity of thickness. It can avoid the voids formation while filling molding compound. Second, the laser embedded substrate not only allows the design of pad-less via to reduce both package size and format but also can put more traces near these vias. In this study, several key technologies of laser embedded are successfully integrated in the current substrate process. By the selection of the advanced dielectric film with a suitable design as a test vehicle to verify the feasibility of laser embedded technology with line/space of 5/5μm and 3/3μm design. However, the excimer laser ablated the pattern step-by-step and the throughput was much lower than lithography by exposure. The technology trend shows that the use of non-filler photo-sensitive dielectric (PID) by exposure/development to form trenches of signal paths is a good solution to increase throughput. L/S less than 2/2μm line embedded 2.1D organic substrate achievement by adopting innovated integration PID process will be further discussed.

Advanced Build-up Materials and Processes for Packages with Fine Line and Space

2014 ◽  
Vol 2014 (1) ◽  
pp. 000444-000447 ◽  
Author(s):  
Yoshio Nishimura ◽  
Hirohisa Narahashi ◽  
Shigeo Nakamura ◽  
Tadahiko Yokota
Keyword(s):  
Printed Circuit Boards ◽  
Coefficient Of Thermal Expansion ◽  
High Reliability ◽  
Electronic Devices ◽  
Circuit Boards ◽  
Additive Process ◽  
Fine Line ◽  
Printed Circuit ◽  
Low Dielectric ◽  
Line Space

Printed circuit boards manufactured by a semi-additive process are widely used for packaging substrates. Along with increasing demands of downsizing electronic devices with high functionality, packaging substrates installed with semiconductors in such devices are strongly required to be miniaturized with high density of circuit wirings. We report our insulation build-up materials and processes for advanced packages with fine line/space and high reliability. The insulation materials we developed show low coefficient of thermal expansion (CTE), low dielectric loss tangent and good thinner insulation reliability. They can produce fine line and space (FLS) under 10μm pitch by a semi-additive process.

Development of Dielectric Material Enabling Low Insertion Loss of Organic Substrates at Various Operational Temperatures

2020 ◽  
Vol 2020 (1) ◽  
pp. 000211-000216
Author(s):  
Tatsushi Hayashi ◽  
Po Yu Lin ◽  
Ryoichi Watanabe ◽  
Seiko Ichikawa
Keyword(s):  
Insertion Loss ◽  
High Speed ◽  
High Performance ◽  
Dielectric Material ◽  
Organic Substrate ◽  
Temperature Cycle ◽  
Organic Substrates ◽  
High Crack ◽  
Low Insertion Loss ◽  
Lower Insertion Loss

Abstract With IP traffic increasing by 10-fold over the last decade, together with limitation and cost increase due to shrinking semiconductor nodes have led to requiring technological breakthrough in the packaging of semiconductor devices especially those used in high performance computing (HPC).This increase in IP traffic has led to requirement for higher data speed transmission in these devices, and consequently packaging technologies that enable those solutions such as 2.5D packaging utilizing silicon interposers. Furthermore, in recent years, increasing number of dies are placed in a single package for these devices thereby making the size of silicon interposers larger. Thus, the design of organic substrates used in these devices, are also becoming ever complex often with multiple layers with long trace lengths for routing increased number of IOs and allowing for power and signal control management. In order to facilitate the high speed data transmission requirement with longer trace lengths, stable low insertion loss design of organic substrates are becoming significantly important even when devices are exposed at elevated humidity or higher temperatures due to surrounding environment or from dies heating. Additionally, as silicon interposers are increasing in size, preventing stress build-up, which can cause cracking between the interposer and the organic substrate, is also becoming paramount. These requirements have led to innovative materials to be developed to enable organic substrates to have these properties. In this paper, we present a new dielectric build-up material for use in advanced organic substrates, by combining newly developed original resin with existing formulation technology that meet these criteria of enabling lower insertion loss with design that reduces deterioration even at elevated humidity and temperature, and furthermore having high crack resistance during temperature cycle testing.

Advanced Chemical Processes for Semi-additive PWB fabrication for Fine Line Formation Targeting Line and Space=5μm/5μm

2015 ◽  
Vol 2015 (1) ◽  
pp. 1-4 ◽  
Author(s):  
Satoshi Kawashima ◽  
Kazutaka Tajima
Keyword(s):  
Dielectric Material ◽  
Selective Dissolution ◽  
Chemical Processes ◽  
Surface Finishing ◽  
Surface Roughening ◽  
Line Formation ◽  
Additive Process ◽  
Fine Line ◽  
Finishing Process ◽  
Electroless Copper

Demand of powerful & fast computing requires the packaging configured with finer lines. The current requirement for Line and Space (L/S) is around 10μm/10μm, it will go down to less than that and 5 μm/5 μm is industry's target in our site. To achieve this miniaturization, a number of improvements are ongoing in equipment, material and chemical for surface finishing process. It seems there is a threshold which requires non-contiguous improvement for the miniaturization. The improvement in surface finishing process requires finer surface roughening for Dielectric material, selective dissolution of metals, or same metal made by different method such as Electroless copper and Electroplated copper, which never exist in the industry. In this paper, advanced chemical processes for semi-additive process (SAP) to fabricate PWB with fine line formation targeting L/S =5μm/5μm are reported. The series of improvements of chemical process enables confidence to manufacture fine lines which L/S=5μm/5μm using finer surface roughening of Electroless copper seed for better Dry Film Resist (DFR) formation, better stripping of the DFR, selective dissolution of Electroless copper seed, finer surface roughening for Solder Mask application, etc.

scholarly journals Carbon Amendments Alter Microbial Community Structure and Net Mercury Methylation Potential in Sediments

2017 ◽  
Vol 84 (3) ◽  
Author(s):  
Geoff A. Christensen ◽  
Anil C. Somenahally ◽  
James G. Moberly ◽  
Carrie M. Miller ◽  
Andrew J. King ◽  
...  
Keyword(s):  
Community Structure ◽  
Microbial Community ◽  
16S Rrna ◽  
Electron Acceptor ◽  
Microbial Community Structure ◽  
Organic Substrate ◽  
Organic Substrates ◽  
Content Type ◽  
Oak Ridge ◽  
The Impact

ABSTRACTNeurotoxic methylmercury (MeHg) is produced by anaerobicBacteriaandArchaeapossessing the geneshgcAB, but it is unknown how organic substrate and electron acceptor availability impacts the distribution and abundance of these organisms. We evaluated the impact of organic substrate amendments on mercury (Hg) methylation rates, microbial community structure, and the distribution ofhgcAB+microbes with sediments. Sediment slurries were amended with short-chain fatty acids, alcohols, or a polysaccharide. Minimal increases in MeHg were observed following lactate, ethanol, and methanol amendments, while a significant decrease (∼70%) was observed with cellobiose incubations. Postincubation, microbial diversity was assessed via 16S rRNA amplicon sequencing. The presence ofhgcAB+organisms was assessed with a broad-range degenerate PCR primer set for both genes, while the presence of microbes in each of the three dominant clades of methylators (Deltaproteobacteria,Firmicutes, and methanogenicArchaea) was measured with clade-specific degeneratehgcAquantitative PCR (qPCR) primer sets. The predominant microorganisms in unamended sediments consisted ofProteobacteria,Firmicutes,Bacteroidetes, andActinobacteria. Clade-specific qPCR identifiedhgcA+DeltaproteobacteriaandArchaeain all sites but failed to detecthgcA+Firmicutes. Cellobiose shifted the communities in all samples to ∼90% non-hgcAB-containingFirmicutes(mainlyBacillusspp. andClostridiumspp.). These results suggest that either expression ofhgcABis downregulated or, more likely given the lack of 16S rRNA gene presence after cellobiose incubation, Hg-methylating organisms are largely outcompeted by cellobiose degraders or degradation products of cellobiose. These results represent a step toward understanding and exploring simple methodologies for controlling MeHg production in the environment.IMPORTANCEMethylmercury (MeHg) is a neurotoxin produced by microorganisms that bioacummulates in the food web and poses a serious health risk to humans. Currently, the impact that organic substrate or electron acceptor availability has on the mercury (Hg)-methylating microorganisms is unclear. To study this, we set up microcosm experiments exposed to different organic substrates and electron acceptors and assayed for Hg methylation rates, for microbial community structure, and for distribution of Hg methylators. The sediment and groundwater was collected from East Fork Poplar Creek in Oak Ridge, TN. Amendment with cellobiose (a lignocellulosic degradation by-product) led to a drastic decrease in the Hg methylation rate compared to that in an unamended control, with an associated shift in the microbial community to mostly nonmethylatingFirmicutes. This, along with previous Hg-methylating microorganism identification methods, will be important for identifying strategies to control MeHg production and inform future remediation strategies.

scholarly journals A study of reflection phase of reflectarray antennas with high loss organic substrates

2019 ◽  
Vol 13 (2) ◽  
pp. 773
Author(s):  
M. Y. Ismail ◽  
H. I Malik ◽  
S. R. Masrol ◽  
Sharmiza Adnan
Keyword(s):  
Material Properties ◽  
Dielectric Material ◽  
Substrate Material ◽  
Organic Substrate ◽  
Organic Substrates ◽  
Phase Gradient ◽  
High Loss ◽  
Reflection Phase ◽  
Rectangular Patch ◽  
Full Wave Analysis

<span>This paper presents an analysis of reflection phase of reflectarray antenna based on high loss organic substrate material. Paper substrate material derived from recycled materials was characterized for dielectric material properties. The material shows excellent dielectric material properties with permittivity of 1.63 and loss tangent of 0.048. Effect of substrate height variation over the reflection phase has been discussed. Full wave analysis of the simulated model depicts that the reduction in substrate height after a certain point results in reflection phase distortion of reflectarray element. Validation of the results has been done by simulation, fabrication and scattering parameters measurements of a rectangular patch element on proposed substrate material. The results show a broadband frequency response of 355 MHz and a phase range of 301º at a phase gradient of 0.14 º/MHz.</span>

Food Safety Security: A new Concept for Enhancing Food Safety Measures

2012 ◽  
Vol 82 (3) ◽  
pp. 216-222 ◽  
Author(s):  
Venkatesh Iyengar ◽  
Ibrahim Elmadfa
Keyword(s):  
Food Safety ◽  
Hazard Analysis ◽  
Warning System ◽  
Shared Responsibility ◽  
Fine Tuning ◽  
Strategic Action ◽  
Surveillance Network ◽  
Measurement Systems ◽  
Critical Control Points ◽  
The Impact

The food safety security (FSS) concept is perceived as an early warning system for minimizing food safety (FS) breaches, and it functions in conjunction with existing FS measures. Essentially, the function of FS and FSS measures can be visualized in two parts: (i) the FS preventive measures as actions taken at the stem level, and (ii) the FSS interventions as actions taken at the root level, to enhance the impact of the implemented safety steps. In practice, along with FS, FSS also draws its support from (i) legislative directives and regulatory measures for enforcing verifiable, timely, and effective compliance; (ii) measurement systems in place for sustained quality assurance; and (iii) shared responsibility to ensure cohesion among all the stakeholders namely, policy makers, regulators, food producers, processors and distributors, and consumers. However, the functional framework of FSS differs from that of FS by way of: (i) retooling the vulnerable segments of the preventive features of existing FS measures; (ii) fine-tuning response systems to efficiently preempt the FS breaches; (iii) building a long-term nutrient and toxicant surveillance network based on validated measurement systems functioning in real time; (iv) focusing on crisp, clear, and correct communication that resonates among all the stakeholders; and (v) developing inter-disciplinary human resources to meet ever-increasing FS challenges. Important determinants of FSS include: (i) strengthening international dialogue for refining regulatory reforms and addressing emerging risks; (ii) developing innovative and strategic action points for intervention {in addition to Hazard Analysis and Critical Control Points (HACCP) procedures]; and (iii) introducing additional science-based tools such as metrology-based measurement systems.

Dynamics of phosphorus and organic substrates in anaerobic and aerobic phases of a sequencing batch reactor

1994 ◽  
Vol 30 (6) ◽  
pp. 237-246 ◽  
Author(s):  
A. Carucci ◽  
M. Majone ◽  
R. Ramadori ◽  
S. Rossetti
Keyword(s):  
Sequencing Batch Reactor ◽  
Municipal Wastewater ◽  
Batch Reactor ◽  
General Assumption ◽  
Organic Substrate ◽  
Operating Conditions ◽  
Phosphate Removal ◽  
Substrate Uptake ◽  
Organic Substrates ◽  
Polyphosphate Metabolism

This paper describes a lab-scale experimentation carried out to study enhanced biological phosphate removal (EBPR) in a sequencing batch reactor (SBR). The synthetic feed used was based on peptone and glucose as organic substrate to simulate the readily biodegradable fraction of a municipal wastewater (Wentzel et al., 1991). The experimental work was divided into two runs, each characterized by different operating conditions. The phosphorus removal efficiency was considerably higher in the absence of competition for organic substrate between P-accumulating and denitrifying bacteria. The activated sludge consisted mainly of peculiar microorganisms recently described by Cech and Hartman (1990) and called “G bacteria”. The results obtained seem to be inconsistent with the general assumption that the G bacteria are characterized by anaerobic substrate uptake not connected with any polyphosphate metabolism. Supplementary anaerobic batch tests utilizing glucose, peptone and acetate as organic substrates show that the role of acetate in the biochemical mechanisms promoting EBPR may not be so essential as it has been assumed till now.

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