Copper wire bonding ready for industrial mass production

2015 ◽  
Vol 2015 (1) ◽  
pp. 000399-000405 ◽  
Author(s):  
M. Brökelmann ◽  
D. Siepe ◽  
M. Hunstig ◽  
M. McKeown ◽  
K. Oftebro
Keyword(s):  
Tool Wear ◽  
Copper Wire ◽  
Tool Material ◽  
Wire Bonding ◽  
Bond Quality ◽  
Process Data ◽  
Power Semiconductors ◽  
Bonding Parameters ◽  
Copper Wire Bonding ◽  
The Impact

Copper wire as a bonding material for the top side connection of power semiconductors is highly desired. One current drawback in heavy copper wire bonding is the relatively low lifetime of the consumables. The bonding tool wear mechanisms and the corresponding factors are investigated. To reduce wear, different approaches are tested in long-term bonding tests. Optimized bonding tool tip geometry and tool material are two of these factors. Optimized bonding parameters were investigated as well and show a significant improvement in bonding tool lifetime. Wear and lifetime of the cutter and the wire guide are also examined. Additionally, the impact of bonding tool wear on different aspects of bond quality is addressed. It is also shown how wear can be monitored by machine process data recording and how a derived signal correlates to the actual wear status. These major advances in heavy copper wire bonding now make it a robust, reliable and efficient interconnection technology.

Influences of bonding parameters on the tool wear for copper wire bonding

2013 ◽  
Author(s):  
Paul Eichwald ◽  
Walter Sextro ◽  
Simon Althoff ◽  
Florian Eacock ◽  
Mark Schnietz ◽  
...  
Keyword(s):  
Tool Wear ◽  
Copper Wire ◽  
Wire Bonding ◽  
Bonding Parameters ◽  
Copper Wire Bonding

Fine Pitch Cu Wire Bonding – As Good As Gold

2010 ◽  
Vol 2010 (1) ◽  
pp. 000650-000655
Author(s):  
Bernd K. Appelt ◽  
William T. Chen ◽  
Andy Tseng ◽  
Yi-Shao Lai
Keyword(s):  
Raw Materials ◽  
Copper Wire ◽  
Commodity Prices ◽  
Gold Wire ◽  
Wire Bonding ◽  
Fine Pitch ◽  
Methodical Approach ◽  
Copper Wire Bonding ◽  
Gold Wires ◽  
The Impact

Fine pitch wire bonding has traditionally been the domain of gold wires. The significant increase in gold commodity prices has driven a continuous reduction in wire diameters to minimize the impact of the raw materials cost of the wire. This has reached a point now where copper wires are beginning to displace gold wires despite the technical challenges associated with copper wires. The basic challenges like propensity for oxidation, hardness and propensity for corrosion can be managed with the appropriate investment in tooling and infrastructure. Doubts are persisting about yield and reliability. With a very methodical approach to developing the process controls, it can be demonstrated that yields are as good as those for gold despite the fact that copper bonds are not reworkable. Likewise, the typical JEDEC reliability tests can be full filled. Here, an extensive effort has been placed on extended JEDEC testing to demonstrate that with good process control and proper materials choices, test durations of more than 2x can be passed. This excellent performance demonstrates that copper wire bonding can be as good as or better than gold wire bonding.

Copper Wire Bonding: R&D to High Volume Manufacturing

2012 ◽  
Vol 2012 (1) ◽  
pp. 000638-000649 ◽  
Author(s):  
Bob Chylak ◽  
Horst Clauberg ◽  
John Foley ◽  
Ivy Qin
Keyword(s):  
Copper Wire ◽  
Leading Edge ◽  
Relative Sensitivity ◽  
High Volume ◽  
Gold Wire ◽  
Wire Bonding ◽  
Bonding Process ◽  
Wire Diameter ◽  
Bond Quality ◽  
Copper Wire Bonding

During the past two years copper wire bonding has entered high volume manufacturing at a number of leading edge OSATs and IDMs. Usage of copper wire has achieved 20% market share and is expected to exceed 50% within three years. Products spanning the range from low pin count devices with relatively large wire diameter to FPGA's with nearly one thousand wires at 20 μm or even 18 μm wire are now using copper wire. This paper will discuss the requirements for developing a robust copper wire bonding process and then moving it to high volume manufacturing. Process optimization begins with the selection of the appropriate wire diameter, ball diameter, bonding tool and bonding process type. These are functions not only of the bond pad opening, but also of the pad aluminum thickness and relative sensitivity of the pad to damage. Proper optimization depends on the availability of new and modified bond quality metrologies, such as extensive reliance on cross-sectioning and intermetallic coverage measurements. The bonding window of a copper wire bonding process is defined in substantially new terms compared to optimization in gold wire bonding. Once an optimized process has been developed in the lab on a single bonder, it needs to be verified. Copper wire bond processes are much less forgiving with respect to the acceptable variability on the manufacturing floor. To ensure that the process is stable, a low volume pre-manufacturing test is highly recommended. This not only makes sure that the process is stable across multiple bonders, but also ensures the adequacies of manufacturing controls, incoming materials quality and sufficient equipment calibration and maintenance procedures.

scholarly journals Ultra-fine pitch palladium-coated copper wire bonding: Effect of bonding parameters

2014 ◽  
Vol 54 (11) ◽  
pp. 2555-2563 ◽  
Author(s):  
Adeline B.Y. Lim ◽  
Andrew C.K. Chang ◽  
Oranna Yauw ◽  
Bob Chylak ◽  
Chee Lip Gan ◽  
...  
Keyword(s):  
Copper Wire ◽  
Wire Bonding ◽  
Bonding Parameters ◽  
Fine Pitch ◽  
Bonding Effect ◽  
Copper Wire Bonding

Modeling of the stick-slip effect in heavy copper wire bonding to determine and reduce tool wear

2015 ◽  
Author(s):  
Andreas Unger ◽  
Walter Sextro ◽  
Tobias Meyer ◽  
Paul Eichwald ◽  
Simon Althoff ◽  
...  
Keyword(s):  
Tool Wear ◽  
Copper Wire ◽  
Wire Bonding ◽  
Slip Effect ◽  
Stick Slip ◽  
Copper Wire Bonding

Peculiarities of tool material wear at polymeric composite blank cutting

2018 ◽  
Vol 2018 (7) ◽  
pp. 27-31
Author(s):  
Юрий Зубарев ◽  
Yuriy Zubarev ◽  
Александр Приемышев ◽  
Alexsandr Priyomyshev
Keyword(s):  
Tool Wear ◽  
Tool Material ◽  
Polymeric Composite ◽  
Physical Models ◽  
Technological Parameters ◽  
Tool Materials ◽  
Materials Used ◽  
The Impact ◽  
Material Wear

Tool materials used for polymeric composite blank machining, kinds of tool material wear arising at machining these blanks, and also the impact of technological parameters upon tool wear are considered. The obtained results allow estimating the potentialities of physical models at polymeric composite blanks cutting.

Failure Analysis on Power Trench MOSFET Devices with Copper Wire Bonds

2011 ◽  
Author(s):  
Huixian Wu ◽  
Arthur Chiang ◽  
David Le ◽  
Win Pratchayakun
Keyword(s):  
Failure Analysis ◽  
Copper Wire ◽  
New Technology ◽  
Analytical Techniques ◽  
Wire Bonding ◽  
Bonding Process ◽  
Wire Bonds ◽  
Copper Wire Bonding ◽  
Wet Chemical ◽  
Microelectronic Components

Abstract With gold prices steadily going up in recent years, copper wire has gained popularity as a means to reduce cost of manufacturing microelectronic components. Performance tradeoff aside, there is an urgent need to thoroughly study the new technology to allay any fear of reliability compromise. Evaluation and optimization of copper wire bonding process is critical. In this paper, novel failure analysis and analytical techniques are applied to the evaluation of copper wire bonding process. Several FA/analytical techniques and FA procedures will be discussed in detail, including novel laser/chemical/plasma decapsulation, FIB, wet chemical etching, reactive ion etching (RIE), cross-section, CSAM, SEM, EDS, and a combination of these techniques. Two case studies will be given to demonstrate the use of these techniques in copper wire bonded devices.

scholarly journals Development of high reliability semiconductor devices by copper wire bonding.

1988 ◽  
Vol 27 (4) ◽  
pp. 299-301
Author(s):  
J. Hirota ◽  
Y. Shibutani ◽  
T. Sugimura ◽  
K. Machida ◽  
T. Okuda
Keyword(s):  
High Reliability ◽  
Copper Wire ◽  
Semiconductor Devices ◽  
Wire Bonding ◽  
Copper Wire Bonding
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