Using failure modes and effects analysis techniques in assessment of medical records errors in Qadir hospital, Shiraz in 2012-2013

2013 ◽  
Vol 1 (2) ◽  
pp. 92 ◽  
Author(s):  
Hamed Rahimi ◽  
Tahereh Shafeghat ◽  
Erfan Kharazmi
Keyword(s):  
Medical Records ◽  
Failure Modes ◽  
Analysis Techniques

scholarly journals Эпидемические заболевания в Калмыцкой степи Астраханской губернии в конце ХIХ – начале ХХ в.

2021 ◽  
Vol 14 (1) ◽  
pp. 43-55
Author(s):  
Alexandr N. Komandzhaev ◽  
◽  
Saglar E. Badmaeva
Keyword(s):  
Medical Records ◽  
System Analysis ◽  
National Archive ◽  
Monitoring Methods ◽  
Medical Department ◽  
Analysis Techniques ◽  
Interdisciplinary Approaches ◽  
Police Personnel ◽  
General Scientific ◽  
Epidemic Diseases

Introduction. The article examines the understudied issues of how and to what extent epidemic diseases used to spread across Kalmyk uluses (‘districts’) in the late 19th – early 20th centuries, with special attention be paid to employed control and monitoring methods. The problem was covered in a number of published reports delivered at the First Congress of Astrakhan physicians to have worked in Kalmyk-inhabited lands during the period under study, and the former contain their shared their experiences and valuable findings. Historians hardly ever approached the topic in just a few papers. Goals. So, the work aims at a detailed survey of epidemic diseases in the Kalmyk Steppe of Astrakhan Governorate in the late 19th – early 20th centuries. Materials and Methods. The study employs a set of general scientific and specific historical research methods. The observance of the historicism principle made it possible to avoid modern misinterpretations of the century-old events examined, while system-analysis techniques and interdisciplinary approaches resulted in that certain specific events of Kalmyk life were analyzed as parts of an overall picture. The article mainly explores and newly introduces materials of the Medical Department — a healthcare agency within the Kalmyk People’s Administration — currently stored at the National Archive of Kalmykia. Results. Despite the remoteness of Kalmyk nomadic settlements (Kalm. khoton) from administrative centers and first-aid stations, healthcare practitioners still were efficient enough to promptly respond in case of epidemic outbreaks. Besides treatment proper, the medical, administrative and police personnel were largely responsible for quarantine and disinfection activities, medical examination and supervision of people living around the periphery of the effective disease area. Conclusions. The analysis of materials dealing with the issue reveals Kalmyk districts were widely affected by epidemic diseases, such as typhus, smallpox, measles, diphtheria and others, while cholera and plague were not that often. It should be admitted that the frequent occurrence of those diseases in medical records across the Kalmyk Steppe was determined by their endemicity to have resulted from a number of reasons.

Failure Analysis Techniques for Lead-Free Solder Joints

2005 ◽  
Author(s):  
Todd Castello ◽  
Dan Rooney ◽  
Dongkai Shangguan
Keyword(s):  
Failure Analysis ◽  
Printed Circuit Board ◽  
Failure Modes ◽  
Circuit Board ◽  
Lead Free ◽  
Lead Free Solder ◽  
Printed Circuit Board Assembly ◽  
Analysis Techniques ◽  
Solder Interconnects ◽  
Free Solder

Abstract Printed circuit board assembly with lead free solder is now a reality for most global electronics manufacturers. Extensive research and development has been conducted to bring lead free assembly processes to a demonstrated proficiency. Failure analysis has been an integral part of this effort and will continue to be needed to solve problems in volume production. Many failure analysis techniques can be directly applied to study lead free solder interconnects, while others may require some modification in order to provide adequate analysis results. In this paper, several of the most commonly applied techniques for solder joint failure analysis will be reviewed, including visual inspection, x-ray radiography, mechanical strength testing, dye & pry, metallography, and microscopy/photomicrography, comparing their application to lead bearing and lead free solder interconnects. Common failure modes and mechanisms will be described with examples specific to lead free solders, following PCB assembly as well as after accelerated reliability tests.

Study of Thermal Cycle Induced CPI Failure Mode in a Lidded FC-BGA Package

2019 ◽  
Author(s):  
Muhammad Monzur Morshed ◽  
Esther Chen ◽  
Anita Madan
Keyword(s):  
Failure Analysis ◽  
Failure Mode ◽  
Failure Modes ◽  
Material Selection ◽  
Interfacial Stress ◽  
Analysis Techniques ◽  
Bga Package ◽  
Induced Defects ◽  
Fatigue Failures ◽  
Insight Into

Abstract Dissimilarities of thermal expansion coefficient between chip and package materials results in stress and strain at the solder interconnect leading to fatigue failures. Underfill is used between chip and package to reduce the interfacial stress and hence increase reliability. In this work, four flipchip package test vehicles underwent thermal cycling to accelerate the stress and were investigated systematically with different failure analysis techniques to study their failure modes. The prevalent failure mode was observed to be at the corner area between the chip and package using different advanced failure analysis techniques. This work demonstrates the technical complexity of analyzing stress induced defects and provides insight into CPI-based material selection.

Coupling C-AFM with Nanoprobing Technique for Further Junction Leakage Analysis

2006 ◽  
Author(s):  
Cha-Ming Shen ◽  
Tsan-Chen Chuang ◽  
Chen-May Huang ◽  
Shi-Chen Lin ◽  
Jie-Fei Chang
Keyword(s):  
Failure Analysis ◽  
Atomic Force Microscope ◽  
Failure Modes ◽  
Electrical Characteristic ◽  
Failure Mechanisms ◽  
Gate Leakage ◽  
Process Technology ◽  
Analysis Techniques ◽  
Atomic Force ◽  
Or Gate

Abstract With the evolution of advanced process technology, failure analysis has become more and more difficult because more defects are of the non-visual type (very tiny or even invisible defects) from new failure mechanisms. In this article, a novel and effective methodology which couples the conductive atomic force microscope (C-AFM) with nano-probing technique is proposed to reveal some particular failure modes which were not observable and difficult to identify with traditional physical failure analysis techniques. The capability of coupling C-AFM with nano-probing technique is used to distinguish cases which suffer general junction leakage or gate leakage from those that form the fake junction leakage or gate leakage cases. C-AFM can detect the abnormal contacts quickly, and nano-probing could provide the precise electrical characteristic further. Then, combining these variant measuring results, the favorable tactics can be adopted to deal with different states.

Acoustic Analysis of Quiet Ball Bearing Failure Modes

1979 ◽  
Vol 16 (02) ◽  
pp. 181-188
Author(s):  
Thomas A. Rutter
Keyword(s):  
Qualitative Analysis ◽  
Failure Modes ◽  
Ball Bearing ◽  
Acoustic Analysis ◽  
Rotating Machinery ◽  
Bearing Failure ◽  
Analysis Techniques ◽  
Bearing Failures ◽  
Nonuniform Motion ◽  
Maintenance Requirements

Qualitative analysis of rotating machinery structureborne noise and vibration can identity ball bearing installation problems. Indications of improper lubrication and impending bearing failures are identified. The problem of nonuniform motion of ball bearing components in determining expected bearing frequencies is noted together with the effects of grease deterioration. The philosophy of structureborne noise versus vibration measurements and an appreciation of several analysis techniques in the context of determining maintenance requirements and evaluating subsequent repair are discussed.

Integrating TOPSIS and DEMATEL Methods to Rank the Risk of Failure of FMEA

2014 ◽  
Vol 13 (06) ◽  
pp. 1229-1257 ◽  
Author(s):  
Kuei-Hu Chang ◽  
Yung-Chia Chang ◽  
Yu-Tsai Lee
Keyword(s):  
Failure Mode ◽  
Failure Modes ◽  
Iso 9000 ◽  
Decision Makers ◽  
Risk Priority Number ◽  
Effect Analysis ◽  
Analysis Techniques ◽  
Risk Of Failure ◽  
Quality Certification ◽  
Order Preference

Failure mode and effect analysis (FMEA) is one of the risk analysis techniques recommended by international quality certification systems, such as ISO 9000, ISO/TS 16949, CE, and QS9000. Most current FMEA methods use the risk priority number (RPN) value to evaluate the risk of failure. The RPN value is the mathematical product of the three parameters of a failure mode that is rated between 1 and 10 in terms of its severity (S), occurrence (O), and detection (D), respectively. However, the RPN method has been found with three main drawbacks: (1) high duplicate RPN values, (2) failure to consider the ordered weights of S, O, and D, and (3) failure to consider the direct and indirect relationships between the failure modes and causes of failure. Therefore, this paper integrates the technique for order preference by similarity to ideal solution (TOPSIS) and the decision-making trial and evaluation laboratory (DEMATEL) approach to rank the risk of failure. A case of an inlet plate ring that has been drawn from a professional mechanical factory is presented to further illustrate the proposed approach. After comparing the result that was obtained from the proposed method with the conventional RPN and DEMATEL methods, it was found that the proposed method can resolve the abovementioned RPN ranking issues and give a more appropriate risk assessment than other listed approaches to provide valuable information for the decision makers.

Proposal for systematic studies of active suspension failures in rail vehicles

2016 ◽  
Vol 232 (1) ◽  
pp. 199-213 ◽  
Author(s):  
Alireza Qazizadeh ◽  
Sebastian Stichel ◽  
Rickard Persson
Keyword(s):  
High Speed ◽  
Failure Modes ◽  
Ride Comfort ◽  
Fault Tree Analysis ◽  
Active Suspension ◽  
Vehicle Safety ◽  
Active Suspensions ◽  
Analysis Techniques ◽  
Rail Vehicle ◽  
Rail Vehicles

Application of active suspensions in high-speed passenger trains is gradually getting more and more common. Active suspensions are primarily aimed at improving ride comfort, wear or stability. Failure of these systems may not only just deteriorate the performance but it may also put vehicle safety at risk. There are not many studies that explain how a thorough study proving safety of active suspension should be performed. Therefore, initiating this type of study is necessary for not only preventing incidences but also for assuring acceptance of active suspension by rail vehicle operators and authorities. This study proposes a flowchart for systematic studies of active suspension failures in rail vehicles. The flowchart steps are solidified by using failure mode and effects analysis and fault tree analysis techniques and also acceptance criteria from the EN14363 standard. Furthermore, six failure modes are introduced which are very general and their use can be extended to other studies of active suspension failure. In the last section of the paper, the proposed flowchart is put into practice through four failure examples of active vertical suspension.

Investigation of Rubber/Metal Bond Failures by Surface-Analysis Techniques

1991 ◽  
Vol 64 (2) ◽  
pp. 243-253 ◽  
Author(s):  
A. R. Madura
Keyword(s):  
Surface Analysis ◽  
High Performance ◽  
Failure Modes ◽  
Effective Means ◽  
Peel Test ◽  
Near Surface ◽  
Analysis Techniques ◽  
Metal Bond ◽  
Surface Analysis Techniques ◽  
Failure Locus

Abstract Surface-analysis techniques including ISS, SIMS, XPS, and SEM are highly complementary and are essential for detailed investigations of rubber/metal bond failures. Multitechnique investigations offer the most effective means of solving problems in bonding applications. EDS, a near-surface analysis technique usually associated with SEM, is a versatile supporting technique for comprehensive studies. Contamination of materials used in bonding applications, especially by silicones, is a commonly encountered factor in bond failures. However, the extent and role of the contamination is often difficult to assess. Prepared test coupons exposed to silicone spray mist considered significant in this study exhibit isolated regions of silicone contamination that did not severely influence peel-test failure modes or maximum peel-load values. The techniques used in this study can be used independently or together to identify surface-treatment effects, determine failure locus, verify the presence of conversion coatings, primers, and adhesives, and identify contaminants in rubber/metal bonding studies. Failure characteristics of bonded assemblies vary and are often complex. Failure investigations of a high-performance mount that exhibits regions of apparent interfacial failure show silicone contamination is present in the failure regions. Intact regions of the same mount failed by fracturing in liquid nitrogen do not contain silicone and show a different failure locus. This suggests that only limited areas of the part were initially contaminated to the extent that bonding was affected; or the regions disbonded in service were exposed to silicone contamination after the failure was initiated.

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