Formation of Defects in Solid-Liquid Reaction-Diffusion Bonding of Copper Using a Tin Film Interlayer
2014 ◽
Vol 15
(1)
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pp. 143-147
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1996 ◽
Vol 79
(6)
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pp. 1717-1719
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2011 ◽
Vol 282-283
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pp. 267-270
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2006 ◽
Vol 21
(6)
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pp. 1443-1450
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