Discovering and Dissecting Mechanically Excited Luminescence of Mn 2+ Activators via Matrix Microstructure Evolution

2021 ◽  
pp. 2100221
Author(s):  
Jun‐Cheng Zhang ◽  
Nan Gao ◽  
Lei Li ◽  
Shanshan Wang ◽  
Xiaofeng Shi ◽  
...  
2019 ◽  
Vol 45 (14) ◽  
pp. 17767-17774 ◽  
Author(s):  
Shuming Zhang ◽  
Minjuan Wang ◽  
Mao Wen ◽  
Ming Wu ◽  
Qingfeng Wang ◽  
...  

Metals ◽  
2019 ◽  
Vol 9 (4) ◽  
pp. 481 ◽  
Author(s):  
Zhang ◽  
Lian ◽  
Chen ◽  
Sun ◽  
Zhang ◽  
...  

The hot deformation behavior and microstructure evolution of a 7.5 vol% TiBw/near α-Ti composite with fine matrix microstructure were investigated under the deformation conditions in a temperature range of 800–950 °C and strain rate range of 0.001–1 s−1 using plane strain compression tests. The flow stress curves show different characteristics according to the various deformation conditions. At a higher strain rate (1 s−1), the flow stress of the composite continuously increases until a peak value is reached. The activation energy is 410.40 kJ/mol, much lower than the activation energy of as-sintered or as-forged composites. The decreased activation energy is ascribed to the breaking of the TiBw reinforcement during the multi-directional forging and the resultant fine matrix microstructure. Refined reinforcement and refined matrix microstructure significantly improve the hot deformation ability of the composite. The deformation conditions determine the morphology and fraction of α and β phases. At 800–900 °C and 0.01 s−1 the matrix α grains are much refined due to the continuous dynamic recrystallization (CDRX). The processing map is constructed based on the hot deformation behavior and microstructure evolution. The optimal hot processing window is determined to be 800–950 °C/0.001–0.01 s−1, which lead to CDRX of primary α grains or dynamic recovery (DRV) and dynamic recrystallization (DRX) of β phase.


2014 ◽  
Vol 29 (9) ◽  
pp. 941
Author(s):  
JIANG Jin-Long ◽  
WANG Qiong ◽  
HUANG Hao ◽  
ZHANG Xia ◽  
WANG Yu-Bao ◽  
...  

Author(s):  
Wentao Qin ◽  
Dorai Iyer ◽  
Jim Morgan ◽  
Carroll Casteel ◽  
Robert Watkins ◽  
...  

Abstract Ni(5 at.%Pt ) films were silicided at a temperature below 400 °C and at 550 °C. The two silicidation temperatures had produced different responses to the subsequent metal etch. Catastrophic removal of the silicide was seen with the low silicidation temperature, while the desired etch selectivity was achieved with the high silicidation temperature. The surface microstructures developed were characterized with TEM and Auger depth profiling. The data correlate with both silicidation temperatures and ultimately the difference in the response to the metal etch. With the high silicidation temperature, there existed a thin Si-oxide film that was close to the surface and embedded with particles which contain metals. This thin film is expected to contribute significantly to the desired etch selectivity. The formation of this layer is interpreted thermodynamically.


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