Signal Integrity Analysis for Diameter-Dependent Mixed Carbon Nanotube Bundle Interconnects

2019 ◽  
pp. 481-489 ◽  
Author(s):  
Vijay Rao Kumbhare ◽  
Punya Prasanna Paltani ◽  
Manoj Kumar Majumder
Keyword(s):  
Carbon Nanotube ◽  
Signal Integrity ◽  
Integrity Analysis ◽  
Nanotube Bundle

scholarly journals Signal Integrity Analysis in Carbon Nanotube Based Through-Silicon Via

2014 ◽  
Vol 2014 ◽  
pp. 1-7 ◽  
Author(s):  
Manoj Kumar Majumder ◽  
Archana Kumari ◽  
Brajesh Kumar Kaushik ◽  
Sanjeev Kumar Manhas
Keyword(s):  
Carbon Nanotube ◽  
Signal Integrity ◽  
Research Paper ◽  
Integrated System ◽  
Phase Delay ◽  
Filler Materials ◽  
Electrical Model ◽  
Materials Used ◽  
Silicon Vias ◽  
Integrity Analysis

Development of a reliable 3D integrated system is largely dependent on the choice of filler materials used in through-silicon vias (TSVs). This research paper presents carbon nanotube (CNT) bundles as prospective filler materials for TSVs and provides an analysis of signal integrity for different single- (SWCNT), double- (DWCNT), and multi-walled CNT (MWCNT) bundle based TSVs. Depending on the physical configuration of a pair of TSVs, an equivalent electrical model is employed to analyze the in-phase and out-phase delays. It is observed that, using an MWCNT bundle (with number of shells = 10), the overall in-phase delays are reduced by 96.86%, 92.33%, 78.35%, and 32.72% compared to the bundled SWCNT, DWCNT, 4-shell MWCNT, and 8-shell MWCNT, respectively; similarly, the overall reduction in out-phase delay is 85.89%, 73.38%, 45.92%, and 12.56%, respectively.

scholarly journals Signal Integrity Analysis in Single and Bundled Carbon Nanotube Interconnects

2013 ◽  
Vol 2013 ◽  
pp. 1-6 ◽  
Author(s):  
Manoj Kumar Majumder ◽  
Nisarg D. Pandya ◽  
B. K. Kaushik ◽  
S. K. Manhas
Keyword(s):  
Carbon Nanotube ◽  
Signal Integrity ◽  
Analytical Models ◽  
Accurate Estimation ◽  
Capacitively Coupled ◽  
Interconnect Lines ◽  
Integrity Analysis ◽  
Bus Architecture ◽  
Interconnect Material ◽  
Multiwalled Cnts

Carbon nanotube (CNT) can be considered as an emerging interconnect material in current nanoscale regime. They are more promising than other interconnect materials such as Al or Cu because of their robustness to electromigration. This research paper aims to address the crosstalk-related issues (signal integrity) in interconnect lines. Different analytical models of single- (SWCNT), double- (DWCNT), and multiwalled CNTs (MWCNT) are studied to analyze the crosstalk delay at global interconnect lengths. A capacitively coupled three-line bus architecture employing CMOS driver is used for accurate estimation of crosstalk delay. Each line in bus architecture is represented with the equivalent RLC models of single and bundled SWCNT, DWCNT, and MWCNT interconnects. Crosstalk delay is observed at middle line (victim) when it switches in opposite direction with respect to the other two lines (aggressors). Using the data predicted by ITRS 2012, a comparative analysis on the basis of crosstalk delay is performed for bundled SWCNT/DWCNT and single MWCNT interconnects. It is observed that the overall crosstalk delay is improved by 40.92% and 21.37% for single MWCNT in comparison to bundled SWCNT and bundled DWCNT interconnects, respectively.

Photocurrent in Carbon Nanotube Bundle: Graded Seebeck Coefficient Phenomenon

Nano Energy ◽  
2021 ◽  
pp. 106054
Author(s):  
Shen Xu ◽  
Hamidreza Zobeiri ◽  
Nicholas Hunter ◽  
Hengyun Zhang ◽  
Gyula Eres ◽  
...  
Keyword(s):  
Carbon Nanotube ◽  
Seebeck Coefficient ◽  
Nanotube Bundle

Statistical Signal Integrity Analysis and Diagnosis Methodology for High-Speed Systems

2004 ◽  
Vol 27 (4) ◽  
pp. 611-629 ◽  
Author(s):  
E. Matoglu ◽  
N. Pham ◽  
D.N. deAraujo ◽  
M. Cases ◽  
M. Swaminathan
Keyword(s):  
High Speed ◽  
Signal Integrity ◽  
Integrity Analysis
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