The growth behavior of interfacial intermetallic compound between Sn–3.5Ag–0.5Cu solder and Cu substrate under different thermal-aged conditions

2017 ◽  
Vol 28 (24) ◽  
pp. 18515-18528 ◽  
Author(s):  
Tao Xu ◽  
Xiaowu Hu ◽  
Yulong Li ◽  
Xiongxin Jiang
Keyword(s):  
Intermetallic Compound ◽  
Growth Behavior ◽  
Cu Substrate ◽  
Interfacial Intermetallic Compound

Effect of Ni concentration on solderability, microstructure and hardness of SAC0705-xNi solder joints on Cu and graphene-coated Cu substrates

2019 ◽  
Vol 33 (01) ◽  
pp. 1850425 ◽  
Author(s):  
Hongming Cai ◽  
Yang Liu ◽  
Shengli Li ◽  
Hao Zhang ◽  
Fenglian Sun ◽  
...  
Keyword(s):  
Intermetallic Compound ◽  
Diffusion Barrier ◽  
Graphene Layer ◽  
Solder Joints ◽  
Cu Substrate ◽  
Ni Content ◽  
Increasing Trend ◽  
Cu Substrates ◽  
Interfacial Intermetallic Compound ◽  
Positive Effect

In this paper, solderability, microstructure and hardness of SAC0705-xNi solder joints on Cu and graphene-coated Cu (G-Cu) substrates were studied. As Ni content increases in the solder, the solderability improves gradually on both the Cu and G-Cu substrates. The solderability of SAC0705-xNi is better on G-Cu substrate than that on Cu substrate. The increasing Ni content in the solder has a positive effect on the microstructure refinement of both the kinds of substrates. Such effect is more significant on G-Cu substrate than that on Cu substrate. With the increase of Ni content, the thickness of the interfacial intermetallic compound (IMC) shows an increasing trend first and then decreasing trend on the two kinds of substrates. Since the graphene layer works as a diffusion barrier, the IMC on G-Cu is thinner than that on Cu substrate. The addition of Ni leads to the strengthening of the microstructure and thus increases the hardness of the solder bulks.

Isothermal Aging Affect to the Growth of Sn-Cu-Ni-1 wt.% TiO2 Composite Solder Paste

2016 ◽  
Vol 700 ◽  
pp. 123-131 ◽  
Author(s):  
Rita Mohd Said ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Mohd Nazree Derman ◽  
Mohd Izrul Izwan Ramli ◽  
Norhayanti Mohd Nasir ◽  
...  
Keyword(s):  
Intermetallic Compound ◽  
Solder Joint ◽  
Aging Time ◽  
Isothermal Aging ◽  
Composite Solder ◽  
Solder Paste ◽  
Cu Substrate ◽  
Interfacial Imcs ◽  
Planar Shape ◽  
Interfacial Intermetallic Compound

This work investigated the effects of 1.0 wt. % TiO2 particles addition into Sn-Cu-Ni solder paste to the growth of the interfacial intermetallic compound (IMC) on Cu substrate after isothermal aging. Sn-Cu-Ni solder paste with TiO2 particles were mechanically mixed to fabricate the composite solder paste. The composite solder paste then reflowed in the reflow oven to form solder joint. The reflowed samples were then isothermally aged 75, 125 and 150 ° C for 24 and 240 h. It was found that the morphology of IMCs changed from scallop-shape to a more uniform planar shape in both Sn-Cu-Ni/Cu joints and Sn-Cu-Ni-TiO2 /Cu joint. Cu6Sn5 and Cu3Sn IMC were identified and grew after prolong aging time and temperature. The IMCs thickness and scallop diameter of composite solder paste were reduced and the growth of IMCs thickness after isothermal aging become slower as compared to unreinforced Sn-Cu-Ni solder paste. It is suggested that TiO2 particles have influenced the evolution and retarded the growth of interfacial IMCs.

Effect of Ni Addition on the Formation and Growth of Intermetallic Compound at Eutectic SnBi/Cu Interface

2010 ◽  
Vol 160-162 ◽  
pp. 709-714
Author(s):  
Tian You Kang ◽  
Yu Yan Xiu ◽  
Bo Xu ◽  
Chun Zhong Liu ◽  
Wei Ping Tong
Keyword(s):  
Growth Rate ◽  
Intermetallic Compound ◽  
Solder Alloy ◽  
Aging Process ◽  
Growth Behavior ◽  
Cu Substrate ◽  
Diffusion Controlled ◽  
Ni Addition ◽  
Cu3sn Layer

The reactions between Cu and the eutectic SnBi (Sn58wt.%Bi) solder alloy with and without 1wt.%Ni addition were investigated in this paper. After as-reflowed process, the IMCs formed in the Sn58wt.%Bi/Cu and Sn58wt.%Bi1wt.%Ni/Cu joints were Cu6Sn5 and (CuNi)6Sn5, respectively. During aging process, the thickness of the IMC layers formed at each solder/Cu joint increased, and a new layer Cu3Sn formed adjacent to the Cu substrate. It was found that 1wt.%Ni addition in Sn58wt.%Bi solder alloy could slightly enhance the growth rate of the total IMC layer, but effectively reduce the growth rate of Cu3Sn layer during aging process. The growth behavior of IMC layer for each joint followed the diffusion-controlled mechanism during aging.

Directional Growth Behaviour of Intermetallic Compound of Sn3.0Ag0.5Cu/ImSn Subjected to Thermal Cycling

2016 ◽  
Vol 857 ◽  
pp. 36-39
Author(s):  
Maria Abu Bakar ◽  
Azman Jalar ◽  
Roslina Ismail ◽  
Abdul Razak Daud
Keyword(s):  
Intermetallic Compound ◽  
Solder Joint ◽  
Thermal Cycling ◽  
Optical Microscope ◽  
Growth Behavior ◽  
Thermal Cycling Test ◽  
Growth Behaviour ◽  
Directional Growth ◽  
Cu Substrate ◽  
Immersion Tin

Directional growth behavior of intermetallic compound (IMC) layer of Sn3.0Ag0.5Cu (SAC305) on immersion tin (ImSn) surface finished Cu substrate was investigated. The samples of SAC305 on ImSn/Cu substrate were subjected to thermal cycling at temperatures between 0 °C and 100 °C for 0 cycle up to 500 cycles. The cross-sectioned microstructures of soldered samples, SAC305 on ImSn/Cu were observed using optical microscope. The shape and orientation of IMC growth on the SAC305 on ImSn/Cu indicates that the orientation of IMC growth were observed to be non-uniform and dispersed throughout the solder joint with longer thermal cycling test.

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