scholarly journals The influence of carbon morphologies and concentrations on the rheology and electrical performance of screen-printed carbon pastes

2022 ◽  
Author(s):  
Sarah-Jane Potts ◽  
Tatyana Korochkina ◽  
Alex Holder ◽  
Eifion Jewell ◽  
Chris Phillips ◽  
...  
Keyword(s):  
Carbon Black ◽  
Carbon Concentration ◽  
High Speed ◽  
Screen Printing ◽  
Electrical Performance ◽  
Print Quality ◽  
Graphite Nanoplatelets ◽  
Shear Rheology ◽  
Custom Made ◽  
Printing Inks

AbstractScreen-printing inks containing various morphologies of carbon are used in the production of a variety of printed electronics applications. Particle morphology influences the rheology of the ink which will affect the deposition and therefore the electrical performance of a printed component. To assess the effect of both carbon morphology and concentration on print topography and conductivity, screen printable carbon inks with differing loading concentrations of graphite, carbon black and graphite nanoplatelets (GNPs) were formulated, printed and characterised, with rheological and novel print visualisation techniques used to elucidate the mechanisms responsible. Carbon morphology had significant effects on the packing of particles. The smaller carbon black particles had more interparticle interactions leading to better conductivities, but also higher ink viscosities and elasticities than the other morphologies. Increases in carbon concentration led to increases in film thickness and roughness for all morphologies. However, beyond a critical point further increases in carbon concentration led to agglomerations of particles, mesh marking and increases in surface roughness, preventing further improvements in the print conductivity. The optimal loading concentrations were identifiable using a custom-made screen-printing apparatus used with high speed imaging for all morphologies. Notable increases in filamentation during ink separation were found to occur with further increases in carbon concentration beyond the optimum. As this point could not be identified using shear rheology alone, this method combined with shear rheology could be used to optimise the carbon concentration of screen-printing inks, preventing the use of excess material which has no benefit on print quality and conductivity.

scholarly journals The Effect of Carbon Ink Rheology on Ink Separation Mechanisms in Screen-Printing

Coatings ◽  
2020 ◽  
Vol 10 (10) ◽  
pp. 1008
Author(s):  
Sarah-Jane Potts ◽  
Chris Phillips ◽  
Tim Claypole ◽  
Eifion Jewell
Keyword(s):  
Surface Roughness ◽  
Carbon Black ◽  
High Speed ◽  
Screen Printing ◽  
Relative Volume ◽  
Electrical Performance ◽  
Elastic Behavior ◽  
High Speed Imaging ◽  
Deposition Mechanism ◽  
Trade Off

Screen-printable carbon-based inks are available in a range of carbon morphologies and concentrations, resulting in various rheological profiles. There are challenges in obtaining a good print when high loading and elasticity functional inks are used, with a trade-off often required between functionality and printability. There is a limited understanding of how ink rheology influences the ink deposition mechanism during screen-printing, which then affects the print topography and therefore electrical performance. High speed imaging was used with a screen-printing simulation apparatus to investigate the effect of viscosity of a graphite and carbon-black ink at various levels of solvent dilution on the deposition mechanisms occurring during screen-printing. With little dilution, the greater relative volume of carbon in the ink resulted in a greater tendency towards elastic behavior than at higher dilutions. During the screen-printing process this led to the ink splitting into filaments while remaining in contact with both the mesh and substrate simultaneously over a greater horizonal length. The location of separating filaments corresponded with localized film thickness increases in the print, which led to a higher surface roughness (Sz). This method could be used to make appropriate adjustments to ink rheology to overcome print defects related to poor ink separation.

Highly conductive graphene/carbon black screen printing inks for flexible electronics

2021 ◽  
Vol 582 ◽  
pp. 12-21 ◽  
Author(s):  
Lixin Liu ◽  
Zhigang Shen ◽  
Xiaojing Zhang ◽  
Han Ma
Keyword(s):  
Carbon Black ◽  
Flexible Electronics ◽  
Screen Printing ◽  
Printing Inks

scholarly journals High-speed imaging the effect of snap-off distance and squeegee speed on the ink transfer mechanism of screen-printed carbon pastes

2019 ◽  
Vol 17 (2) ◽  
pp. 447-459 ◽  
Author(s):  
Sarah-Jane Potts ◽  
Chris Phillips ◽  
Eifion Jewell ◽  
Ben Clifford ◽  
Yin Cheung Lau ◽  
...  
Keyword(s):  
High Speed ◽  
Screen Printing ◽  
Printed Electronics ◽  
Functional Materials ◽  
Print Quality ◽  
High Speed Imaging ◽  
Predictive Algorithms ◽  
Wide Range ◽  
And Performance ◽  
Ink Transfer

AbstractScreen printing is the most widely used process in the production of printed electronics due to its ability to consistently transfer inks containing a wide range of functional materials onto a range of substrates. However, despite its extensive use, the mechanism by which the ink is transferred through the mesh and onto the substrate is not fully understood. Existing theories are contradictory and lack experimental validation. Therefore, high-speed imaging was used in combination with a screen-printing simulation rig that was designed to provide good optical access to study ink deposition during the screen-printing process. The variation in the four stages of ink flow through the screen, described in the theory by Messerschmitt, has been quantified with respect to changes in snap-off distance and squeegee speed. Analyses of the images were compared with measurements of the ink properties and corroborated with analyses of the prints. This has provided a better understanding of the mechanism by which the ink transfers from the mesh to the substrate and subsequently separates in screen printing. This could be used as the basis for the development of predictive algorithms, as well as to improve the understanding of how to optimize print quality and performance.

scholarly journals Screen-Printed, Pure Carbon-Black Thermocouple Fabrication and Seebeck Coefficients

Sensors ◽  
2019 ◽  
Vol 19 (2) ◽  
pp. 403 ◽  
Author(s):  
Christina Offenzeller ◽  
Marcel Knoll ◽  
Bernhard Jakoby ◽  
Wolfgang Hilber
Keyword(s):  
Carbon Black ◽  
Screen Printing ◽  
Low Cost ◽  
Carbon Particles ◽  
Seebeck Coefficients ◽  
Pure Carbon ◽  
Printing Inks ◽  
Available Carbon ◽  
Cost Efficient ◽  
Stable Linear

Thermocouples classically consist of two metals or semiconductor components that are joined at one end, where temperature is measured. Carbon black is a low-cost semiconductor with a Seebeck coefficient that depends on the structure of the carbon particles. Different carbon black screen-printing inks generally exhibit different Seebeck coefficients, and two can therefore be combined to realize a thermocouple. In this work, we used a set of four different commercially available carbon-black screen-printing inks to print all-carbon-black thermocouples. The outputs of these thermocouples were characterized and their Seebeck coefficients determined. We found that the outputs of pure carbon-black thermocouples are reasonably stable, linear, and quantitatively comparable to those of commercially available R- or S-type thermocouples. It is thus possible to fabricate thermocouples by an easily scalable, cost-efficient process that combines two low-cost materials.

Effect of ink and paperboard characteristics on flexographic print quality based on print density

TAPPI Journal ◽  
2011 ◽  
Vol 10 (9) ◽  
pp. 7-13
Author(s):  
KHODADAD MALMIRCHEGINI ◽  
FARSHAD SARKHOSH RAHMANI
Keyword(s):  
Water Absorption ◽  
Significant Influence ◽  
Particle Diameter ◽  
Print Quality ◽  
Printing Technology ◽  
Plastic Films ◽  
Printing Inks ◽  
Packaging Industry ◽  
Solids Content ◽  
Density Results

Flexography is an evolving printing technology that is suitable for printing on coated and uncoated paperboard and board, nonporous substrates including metalized and paperboard foils, and plastic films used especially in the packaging industry. This study evaluated the effect of paperboard and ink characteristics on flexographic print density in paperboard. Three commercial paperboards from different companies were prepared: brown kraft from Thailand, white kraft from Spain, and test liner from Iran. Four samples of process print inks from Iran were used in this investigation. Paperboard properties, such as roughness and water absorption, and ink characteristics, including solids content, PH and particle diameter, were measured. The inks were printed on paperboards using a roll no.15 applicator with a blade metering device, and the print densities were measured. Results showed that solids content, pH, and particle diameter of printing inks influenced print density, while the roughness and water absorption of the three types of paperboard had no significant influence on print density. Results also illustrated that two levels of ink viscosity (25–30 and 50–55 mPa·s) were insignificant to print density.

The effect of the ink composition on the performance of carbon-based conductive screen printing inks

2018 ◽  
Vol 30 (2) ◽  
pp. 1034-1044 ◽  
Author(s):  
Michal Hatala ◽  
Pavol Gemeiner ◽  
Matej Hvojnik ◽  
Milan Mikula
Keyword(s):  
Screen Printing ◽  
Printing Inks ◽  
Carbon Based

scholarly journals Electrical Behaviour of a Carbon Black-Filled Polymer-Based Concrete

1996 ◽  
Vol 5 (5) ◽  
pp. 096369359600500
Author(s):  
L. Rejón ◽  
R. Flores ◽  
M. A. Ponce ◽  
V.M. Castaño
Keyword(s):  
Carbon Black ◽  
Electrical Performance ◽  
Electrical Behaviour ◽  
Filled Polymer ◽  
Carbon Black Concentration ◽  
Before And After

The electrical performance (current, I vs. voltage, V) of a novel polymer-based composite, modified with varying amounts of carbon black, was studied. Distinctive regimens of the I vs. V curves, before and after a critical carbon black concentration, were found and the feasible mechanisms for such behaviour are discussed.

scholarly journals Integrated Durability of Automobile Alternator Test System Design Based on LabVIEW

2014 ◽  
Vol 8 (1) ◽  
pp. 839-845 ◽  
Author(s):  
Wu Weibin ◽  
Feng Yue ◽  
Du Junyi ◽  
Xu Pengbo ◽  
Feng Yunlin ◽  
...  
Keyword(s):  
Data Acquisition ◽  
Automotive Industry ◽  
Virtual Instrument ◽  
Measurement Errors ◽  
High Speed ◽  
Performance Test ◽  
Test System ◽  
Electrical Performance ◽  
Durability Test ◽  
Limit Test

New standards in the automotive industry highlighted the situation of the actual operation of the alternator and a variety of harsh environment simulation limit test. Using new standards in the automotive industry as a guide, this article presents a virtual instrument based on the durability of automobile generator integrated test system. The design adopt virtual instrument technology in designing the system, Graphic language, LabVIEW is applied in writing measure-control program. The system uses a lot of features on LABVIEW, including Data acquisition, control of serials port, etc. Test implementation uses the host computer via RS232 and RS485 communication port and the data acquisition card, NI PCI- 6221, to control the frequency hybrid motor, temperature control box, electronic loads and other intelligent devices, and to simulate a variety of automotive alternator working conditions and real-time monitoring to monitor the status of generators. Using this system, two separate automobile alternators can be tested in terms of high-speed vehicle impact and high temperature durability test and electrical performance test and other tests at the same time. As a result, the generator speed measurement error is within 1%, the control error is within 2%, voltage and current measurement errors were within 0.5% and 0.4%, which meets the requirements.

Performance Analysis of Interconnects Based on Carbon Nanotubes for AMS/RF IC Design

2015 ◽  
pp. 336-363 ◽  
Author(s):  
Rafael Vargas-Bernal
Keyword(s):  
Carbon Nanotubes ◽  
Performance Analysis ◽  
Integrated Circuit ◽  
High Speed ◽  
Electrical Current ◽  
Essential Elements ◽  
Thermal Dissipation ◽  
Electrical Performance ◽  
Ic Design ◽  
Rf Ic

Electrical interconnects are essential elements to transmit electrical current and/or to apply electrical voltage to the electronic devices found in an integrated circuit. With the introduction of carbon nanotubes in electronic applications, efficient and high-speed interconnects have allowed for optimizing the electrical performance of the integrated circuits. Additionally, technical problems, such as electromigration, large values of parasitic elements, large delays, and high thermal dissipation, presented in metallic interconnects based on copper, can be avoided. This chapter presents a performance analysis of interconnects used in AMS/RF IC design based on carbon nanotubes as the physical material where electrical variables are provided.

Electrical Characterization on a High-Speed Wafer-Level Package

2013 ◽  
Vol 2013 (DPC) ◽  
pp. 001937-001962
Author(s):  
Kai Liu ◽  
YongTaek Lee ◽  
HyunTai Kim ◽  
MaPhooPwint Hlaing ◽  
Susan Park ◽  
...  
Keyword(s):  
High Speed ◽  
Unit Length ◽  
Ground Plane ◽  
Measurement Data ◽  
Electrical Characterization ◽  
Electrical Performance ◽  
Metal Loss ◽  
Signal Loss ◽  
Wafer Level ◽  
Wafer Level Package

In this paper, a 2-layer eWLB (embedded Wafer-Level BGA) is studied and its performance is compared with an equivalent 4-layer laminate package. Since eWLB package is processed by using lithographical method, design rules on width (W) and spacing (S) are much finer (usually 2–3 times finer) than those for laminate package. In other words, signal traces can be implemented in smaller fan-out regions. The smaller feature sizes for signal traces would end up with more metal loss per unit length. But as the signal traces can be implemented in smaller fan-out regions, overall trace-routing may be shorter, and equivalent insertion-loss may be achieved. In eWLB, the ground plane is closer to the signal traces. This actually helps to reduce cross-talk between wide I/O buses, as the electrical field is contained in a smaller region by the closer ground plane. Another key advantage from wafer-level package is a smoother metal surface, which greatly reduces the extra signal loss, due to surface-roughness effect, especially for higher-frequency and higher-speed applications. In addition, through-via structures for wafer-level package are typically 2–3 times smaller. This allows to implement power/ground planes in a more continuous way, achieving better resistance and inductance for power/ground nets. Overall electrical performance, which takes into account of all the impacts above, can be evaluated by signal-integrity analysis (E-diagram). Measurement data of a 2-layer eWLB package for a LPDDR application will be presented, which shows the comparable performance typically obtained from a 4-layer laminate package

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