scholarly journals Process design of a novel combination of peel grinding and deep rolling

2021 ◽  
Author(s):  
Berend Denkena ◽  
Alexander Kroedel ◽  
Tobias Gartzke
Keyword(s):  
Surface Properties ◽  
Process Design ◽  
High Surface ◽  
Grinding Wheel ◽  
Deep Rolling ◽  
Workpiece Surface ◽  
High Surface Quality ◽  
Cycle Times ◽  
Increase In Productivity ◽  
Process Combination

AbstractGrinding is mostly considered as a finishing operation by which a high surface quality is achieved. An increase in productivity is therefore limited by maintained surface properties such as the roughness or tensile residual stresses. Thus, a roughing operation is inevitable followed by a finishing operation, while both operations are separated, leading to larger cycle times and process costs. In this paper, a novel process combination is investigated in which the roughing is done by grinding and the finishing operation by deep rolling within one tool setup. In this way, both processes are conducted parallel within the primary processing time. The objective of this study is the knowledge of the characteristics of this process combination with regard to the workpiece surface integrity. Therefore, shafts are ground in peel grinding with varying grinding wheel types and process parameters and subsequently machined with deep rolling. The process combination is evaluated with regard to the process forces and the resulting surface properties. In addition, experiments using the process combination were conducted in order to investigate the transferability of the results towards the process combination. By this approach, it was found that the surface roughness was reduced up to 80% by deep rolling showing the potential of the process combination.

Modeling and Simulation of the Surface Topography Generation With Engineered Grinding Wheel

2020 ◽  
pp. 381-403
Keyword(s):  
Surface Topography ◽  
High Surface ◽  
Kinematic Model ◽  
Grinding Wheel ◽  
Feed Speed ◽  
Profile Curve ◽  
Workpiece Surface ◽  
High Surface Quality ◽  
Engineered Grinding Wheel ◽  
Grain Distribution

Precision grinding can obtain workpiece with high surface quality and high precision, but random distribution of abrasive grains on the grinding wheel surface poses a certain difficulty to improvement of machining precision and quality. This study established kinematic model of multiple grains, simulated the grain distribution on the surface of the common grinding wheel by using the grain vibration method, and examined the effect of different grinding parameters on the surface topography of the workpiece. Results show that the peaks and valleys on the profile curve of the workpiece surface increase and the corresponding Ra and Rz heights decrease, as the peripheral velocity of the grinding wheel increases. The peaks and valleys on the profile curve of the workpiece surface decrease, and the corresponding Ra and Rz heights increase as the feed speed of the workpiece increases. The number of grinding cracks on the surface of the workpiece decreases, the length of each crack increases, and the bump height on the surface increases slightly as the grinding depth increases.

scholarly journals Experimental investigation of the machining characteristics in diamond wire sawing of unidirectional CFRP

2021 ◽  
Author(s):  
Lukas Seeholzer ◽  
Stefan Süssmaier ◽  
Fabian Kneubühler ◽  
Konrad Wegener
Keyword(s):  
Surface Quality ◽  
Influencing Factors ◽  
Material Properties ◽  
High Surface ◽  
Workpiece Surface ◽  
High Surface Quality ◽  
High Productivity ◽  
Surface Temperatures ◽  
Process Forces ◽  
The Wire

AbstractEspecially for slicing hard and brittle materials, wire sawing with electroplated diamond wires is widely used since it combines a high surface quality with a minimum kerf loss. Furthermore, it allows a high productivity by machining multiple workpieces simultaneously. During the machining operation, the wire/workpiece interaction and thus the material removal conditions with the resulting workpiece quality are determined by the material properties and the process and tool parameters. However, applied to machining of carbon fibre reinforced polymers (CFRP), the process complexity potentially increases due to the anisotropic material properties, the elastic spring back potential of the material, and the distinct mechanical wear due to the highly abrasive carbon fibres. Therefore, this experimental study analyses different combinations of influencing factors with respect to process forces, workpiece surface temperatures at the wire entrance, and the surface quality in wire sawing unidirectional CFRP material. As main influencing factors, the cutting and feed speeds, the density of diamond grains on the wire, the workpiece thickness, and the fibre orientation of the CFRP material are analysed and discussed. For the tested parameter settings, it is found that while the influence of the grain density is negligible, workpiece thickness, cutting and feed speeds affect the process substantially. In addition, higher process forces and workpiece surface temperatures do not necessarily deteriorate the surface quality.

Experimental Temperature Studies on Two Dimensional Ultrasonic Vibration Grinding the Nano-ZrO2 Ceramics

2009 ◽  
Vol 416 ◽  
pp. 540-545
Author(s):  
Ping Yan Bian ◽  
Bo Zhao ◽  
Yu Li
Keyword(s):  
Surface Temperature ◽  
Ultrasonic Vibration ◽  
High Surface ◽  
Grinding Wheel ◽  
Grinding Temperature ◽  
Two Dimensional ◽  
Workpiece Surface ◽  
Grinding Parameters ◽  
Thermocouple Method ◽  
The Relationship

In processing of engineering ceramics materials with diamond grinding wheel, grinding heat is one of vital factors influencing workpiece surface quality. Grinding parameters have important influences on workpiece surface temperature distributions. Contrast experiments on grinding temperature of nanoZrO2 under common and two dimensional ultrasonic vibration grinding(TDUVG) were carried out in this paper by manual thermocouple method. The relationship between grinding parameters and grinding temperature was clarified through theoretical analysis and experiment confirmation. The research results show that with the increases of grinding depth, grinding speed, and decrease of working table speed, the workpiece’s surface temperature would heighten accordingly. Furthermore, comparing with high surface layer temperature in common grinding, which often results in grinding burn, TDUVG can reduce grinding temperature effectively.

Study on Sapphire Wafer Grinding by Chromium Oxide (Cr2O3) Wheel

2016 ◽  
Vol 1136 ◽  
pp. 311-316 ◽  
Author(s):  
Ke Wu ◽  
Naoki Yamazaki ◽  
Yutaro Ebina ◽  
Li Bo Zhou ◽  
Jun Shimizu ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Chromium Oxide ◽  
Removal Rate ◽  
Semiconductor Industry ◽  
High Surface ◽  
Grinding Wheel ◽  
Sapphire Wafer ◽  
High Surface Quality ◽  
Revolution Speed ◽  
The Revolution

Finishing process of sapphire wafer is meeting huge challenge to fulfill the strict requirement of high surface quality in semiconductor industry. Fixed abrasive process, although can guarantee the profile accuracy, leaves damaged layer on the surface or subsurface of sapphire wafer. Chemical mechanical polishing (CMP) is famous for providing great surface roughness, however, sacrifices surface geometrical accuracy. Therefore, a new chromium oxide (Cr2O3) sapphire grinding wheel based on chemical mechanical grinding (CMG) principle has been developed and its performance has also been put into examination. The experiment result has demonstrated that Cr2O3 possesses an outstanding potential in terms of a high material removal rate of sapphire wafer, meanwhile, largely reduces surface roughness from about 150nm to below 10nm in 1 hour. In addition, the design of experiment (DOE) has also been carried out to study the effect of influencing factors towards ultimate surface roughness of sapphire wafer. It reveals that the revolution speed of sapphire wafer bears twice greater influence towards surface roughness than the revolution speed of grinding wheel.

The Experiment Research of Precision Grinding of Li-Ti Ferrite with Graphite Grinding Wheel

2010 ◽  
Vol 431-432 ◽  
pp. 322-325
Author(s):  
Bei Zhang ◽  
Hong Hua Su ◽  
Hong Jun Xu ◽  
Yu Can Fu
Keyword(s):  
Surface Quality ◽  
Material Removal ◽  
Removal Rate ◽  
High Surface ◽  
Ground Surface ◽  
Grinding Wheel ◽  
Precision Grinding ◽  
High Surface Quality ◽  
Good Surface ◽  
Good Surface Quality

Li-Ti ferrite used in aviation occasions needs good surface quality. In conventional grinding it is difficult to meet the surface demand. Accordingly, this paper proposed a new grinding process to change the situation. The process employed graphite grinding wheel which is always used in ultra-precision grinding of steel piece. The process can obtain good surface quality and ensure certain material removal rate. The ground surface appearance is nearly mirror-like. The lowest surface roughness of Ra value of the ground surface is 0.05μm in the experiment. The ground surface morphology is made up of spread glazed area and dispersed minute pits. The ductile regime dominates the material removal mechanism and no surface damage is induced in the process. In consideration of the results in the experiment it can be seen that grinding with graphite grinding wheel is a good finishing procedure in ferrite machining because of its obtained high surface quality.

Grinding of Steel-Ceramic-Composites

2011 ◽  
Vol 325 ◽  
pp. 116-121 ◽  
Author(s):  
Berend Denkena ◽  
Jens Köhler ◽  
Dennis Hahmann
Keyword(s):  
Process Design ◽  
High Surface ◽  
Ceramic Composites ◽  
Steel Matrix ◽  
Workpiece Surface ◽  
Protective Layers ◽  
Ductile Mode ◽  
New Process ◽  
Ductile Steel ◽  
Material Separation

Steel-ceramic-composites offer a high potential as protective layers of mechanically and abrasively high loaded machine parts. The machining of steel-ceramic-composites is a high challenge for the process design due to the very different material properties of the brittle ceramic particles, embedded in the ductile steel matrix. Both materials have to be machined in ductile mode simultaneously to gain high surface qualities. Thus, the material separation mechanisms have to be understood for an adequate process design. In this paper, a new process characteristic is introduced that describes the influence of the grinding process settings on the process forces and workpiece surface roughness in grinding steel-ceramic-composites.

Study on Grinding Force and Surface Roughness of Ni3Al Based Superalloy

2018 ◽  
Author(s):  
Xiaoxiang Zhu ◽  
Wenhu Wang ◽  
Ruisong Jiang ◽  
Xiaofen Liu
Keyword(s):  
Surface Roughness ◽  
Surface Topography ◽  
Process Parameters ◽  
High Surface ◽  
Temperature Characteristic ◽  
Grinding Force ◽  
Wheel Speed ◽  
Grinding Wheel ◽  
High Surface Quality ◽  
Creep Feed

Ni3Al based superalloy is a kind of intermetallics, it is a relatively new superalloy, its superior high temperature characteristic makes it the fifth generation aero-engine turbine blade material. The machinability of Ni3Al based superalloy is poor, and its process parameters have significant influence on grinding force and surface integrity. The creep feed grinding experiments of Ni3Al based superalloy IC10 were carried out with different process parameters. The experimental results show that the workpiece speed has the greatest effect on grinding force, surface roughness and 3D surface topography, followed by grinding depth, the wheel speed has the smallest influence. Grinding force is positively correlated with grinding depth and workpiece speed, and negatively correlated with grinding wheel speed. Similarly, surface roughness is positively correlated with grinding depth and workpiece speed, and negatively correlated with grinding wheel speed. The higher the workpiece speed, the deeper the grooves and the higher the peaks of the surface topography. In order to maintain high surface quality, small workpiece speed and grinding depth should be chosen during grinding process.

Nano-Precision Synergistic Finishing Process Integrated ELID-Grinding and MRF

2009 ◽  
Vol 69-70 ◽  
pp. 49-53
Author(s):  
Shao Hui Yin ◽  
Hitoshi Ohmori ◽  
Wei Min Lin ◽  
Yoshihiro Uehara ◽  
Feng Jun Chen ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Optical Materials ◽  
High Efficiency ◽  
High Surface ◽  
Grinding Wheel ◽  
Form Accuracy ◽  
High Surface Quality ◽  
Elid Grinding ◽  
Finishing Process ◽  
Magneto Rheological

ELID (electrolytic in-process dressing) grinding was proposed by one of the authors for automatic dressing the grinding wheel while performing grinding for a long time. It offers a high effective way and has been widely used for grinding hard and brittle optical materials. However, those surfaces produced by fixed abrasive grinding are characterized by considerable sub-surface damage, micro-crack. Magneto-rheological finishing (MRF) is a novel precision finishing process for deterministic form correction and polishing of optical materials by utilizing magneto-rheological fluid. In this paper, an ultra-precision synergistic finishing process integrated MRF and ELID grinding is proposed for shorten total finishing time and improve finishing quality. A lot of nano-precision experiments have been carried out to grind and finish some optical materials such as silicon, silicon carbide, etc. ELID grinding is employed to obtain high efficiency and high surface quality, and then, MRF is employed to improve further surface roughness and form accuracy. In general, form accuracy of ~ λ/20 nm peak-to-valley (P-V) and surface roughness less than 10 Angstrom are produced in high efficiency.

Research on Temperature Field of Nano-Composite Ceramics by Multi-Ultrasonic Grinding

2012 ◽  
Vol 522 ◽  
pp. 26-30 ◽  
Author(s):  
Jin Xue Xue ◽  
Bo Zhao
Keyword(s):  
Temperature Field ◽  
Surface Temperature ◽  
High Surface ◽  
Grinding Wheel ◽  
Grinding Temperature ◽  
Workpiece Surface ◽  
Grinding Parameters ◽  
Ultrasonic Grinding ◽  
Orthogonal Experiments ◽  
Grinding Temperature Field

In processing of structure ceramics materials with diamond grinding wheel, grinding heat is one of vital factors influencing workpiece surface quality. Grinding parameters have important influences on workpiece surface temperature distribution. Contrast experiments on grinding temperature field of ZrO2 in common and ultrasonic grinding were carried out in the paper by manual thermocouple method. The relationship between grinding parameters and temperature were researched theoretically and experimentally. The results show that the farther the distance from grinding surface, the smaller the peak value of temperature is. With the increases of grinding depth, grinding speed and feedrate, the surface temperature will heightens accordingly. It was proved that grinding depth is the most vital factor influencing grinding temperature field through orthogonal experiments. Furthermore, comparing with high surface layer temperature which often results in grinding burn in traditional grinding, ultrasonic grinding can reduce grinding temperature effectively.

scholarly journals Effect of Optical and Morphological Control of Single-Structured LEC Device

Micromachines ◽  
2021 ◽  
Vol 12 (7) ◽  
pp. 843
Author(s):  
Woo Jin Jeong ◽  
Jong Ik Lee ◽  
Hee Jung Kwak ◽  
Jae Min Jeon ◽  
Dong Yeol Shin ◽  
...  
Keyword(s):  
Heat Treatment ◽  
Surface Roughness ◽  
Surface Properties ◽  
High Efficiency ◽  
High Surface ◽  
Reduction Rate ◽  
Operating Characteristics ◽  
Emission Layer ◽  
Light Emitting ◽  
Stable Operating

We investigated the performance of single-structured light-emitting electrochemical cell (LEC) devices with Ru(bpy)3(PF6)2 polymer composite as an emission layer by controlling thickness and heat treatment. When the thickness was smaller than 120–150 nm, the device performance decreased because of the low optical properties and non-dense surface properties. On the other hand, when the thickness was over than 150 nm, the device had too high surface roughness, resulting in high-efficiency roll-off and poor device stability. With 150 nm thickness, the absorbance increased, and the surface roughness was low and dense, resulting in increased device characteristics and better stability. The heat treatment effect further improved the surface properties, thus improving the device characteristics. In particular, the external quantum efficiency (EQE) reduction rate was shallow at 100 °C, which indicates that the LEC device has stable operating characteristics. The LEC device exhibited a maximum luminance of 3532 cd/m2 and an EQE of 1.14% under 150 nm thickness and 100 °C heat treatment.

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