Effects of Sputtering Power, Working Pressure, and Electric Bias on the Deposition Behavior of Ag Films during DC Magnetron Sputtering Considering the Generation of Charged Flux
Keyword(s):
2007 ◽
Vol 37
(6)
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pp. 393-395
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2017 ◽
Vol 4
(5)
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pp. 6466-6471
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Keyword(s):
2013 ◽
Vol 271
◽
pp. 216-222
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Keyword(s):
2009 ◽
Vol 23
(14)
◽
pp. 3147-3157
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Keyword(s):
2014 ◽
Vol 602-603
◽
pp. 966-969
Influence of Direct Current Magnetron Sputtering Parameters on Electrical Properties of Copper Films
2010 ◽
Vol 37-38
◽
pp. 540-543