Roles of CuO and Cu2O in graphene growth on a copper substrate

2021 ◽  
pp. 151812
Author(s):  
Xue Zhang ◽  
Xing Guo ◽  
Xiucai Sun ◽  
Zhen Su ◽  
Li Sun ◽  
...  
Keyword(s):  
Copper Substrate ◽  
Graphene Growth

Evolution of Cu Surface Morphology and its Effect on Graphene Synthesized by Chemical Vapor Deposition

2014 ◽  
Vol 95 ◽  
pp. 17-22 ◽  
Author(s):  
Ahmed Ibrahim ◽  
A. Owais ◽  
M. Atieh ◽  
R. Karnik ◽  
Tahar Laoui
Keyword(s):  
Chemical Vapor Deposition ◽  
Surface Morphology ◽  
Vapor Deposition ◽  
Substrate Surface ◽  
Copper Substrate ◽  
Chemical Vapor ◽  
Synthesis Process ◽  
Graphene Growth ◽  
Graphene Synthesis ◽  
Grown Graphene

Chemical Vapor Deposition (CVD) is generally utilized for producing large area, good quality graphene films on suitable substrates. Copper (Cu) substrate is used mainly as a substrate and catalyst during graphene synthesis process by CVD method. The purpose of the present work is to investigate the evolution of Cu surface morphology after graphene growth and its influence on grown graphene quality. In this study, graphene was grown using methane as the carbon source at temperature 1040 °C for 5 minutes. Scanning electron microscopy (SEM), Optical Microscopy (OM) and atomic force microscopy (AFM) were utilized to analyze the change of Cu surface morphology after graphene synthesis. Raman spectroscopy was used to characterize the characteristics of grown graphene. SEM and AFM results showed that copper substrate surface morphology was modified after graphene growth associated by formation of large size Cu particles located basically on the surface terraces, resulting in deposition of multilayer, very small graphene domains aligned linearly along rolling marks direction.

Direct Observation of Graphene Growth and Associated Copper Substrate Dynamics by in Situ Scanning Electron Microscopy

ACS Nano ◽  
2015 ◽  
Vol 9 (2) ◽  
pp. 1506-1519 ◽  
Author(s):  
Zhu-Jun Wang ◽  
Gisela Weinberg ◽  
Qiang Zhang ◽  
Thomas Lunkenbein ◽  
Achim Klein-Hoffmann ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Direct Observation ◽  
Copper Substrate ◽  
Graphene Growth ◽  
Scanning Electron

Effects of annealing on copper substrate surface morphology and graphene growth by chemical vapor deposition

Carbon ◽  
2015 ◽  
Vol 94 ◽  
pp. 369-377 ◽  
Author(s):  
Ahmed Ibrahim ◽  
Sultan Akhtar ◽  
Muataz Atieh ◽  
Rohit Karnik ◽  
Tahar Laoui
Keyword(s):  
Chemical Vapor Deposition ◽  
Surface Morphology ◽  
Vapor Deposition ◽  
Substrate Surface ◽  
Copper Substrate ◽  
Chemical Vapor ◽  
Graphene Growth

Fabrication of layer-by-layer graphene oxide thin film on copper substrate by electrophoretic deposition

2020 ◽  
Vol 59 (12) ◽  
pp. 125001
Author(s):  
Nan Ye ◽  
Satoka Ohnishi ◽  
Mitsuhiro Okada ◽  
Kazuto Hatakeyama ◽  
Kazuhiko Seki ◽  
...  
Keyword(s):  
Thin Film ◽  
Graphene Oxide ◽  
Electrophoretic Deposition ◽  
Copper Substrate ◽  
Oxide Thin Film ◽  
Layer By Layer ◽  
Layer Graphene

scholarly journals Graphene growth by metal etching on Ru(0001)

2009 ◽  
Vol 80 (23) ◽  
Author(s):  
E. Starodub ◽  
S. Maier ◽  
I. Stass ◽  
N. C. Bartelt ◽  
P. J. Feibelman ◽  
...  
Keyword(s):  
Graphene Growth ◽  
Metal Etching

Eliminating Whisker Growth by Indium Addition in Electroplated Sn on Copper Substrate

2016 ◽  
Vol 46 (7) ◽  
pp. 4062-4075 ◽  
Author(s):  
S. Das Mahapatra ◽  
B. S. Majumdar ◽  
I. Dutta ◽  
S. Bhassyvasantha
Keyword(s):  
Whisker Growth ◽  
Copper Substrate

scholarly journals Performance of Sn-3.0Ag-0.5Cu Composite Solder with Kaolin Geopolymer Ceramic Reinforcement on Microstructure and Mechanical Properties under Isothermal Ageing

Materials ◽  
2021 ◽  
Vol 14 (4) ◽  
pp. 776
Author(s):  
Nur Syahirah Mohamad Zaimi ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Andrei Victor Sandu ◽  
Mohd Mustafa Al Bakri Abdullah ◽  
Norainiza Saud ◽  
...  
Keyword(s):  
Shear Strength ◽  
Composite Solder ◽  
Printed Circuit Board ◽  
Microwave Sintering ◽  
Copper Substrate ◽  
Bulk Diffusion ◽  
Circuit Board ◽  
Sac305 Solder ◽  
Lap Shear ◽  
Isothermal Ageing

This paper elucidates the effect of isothermal ageing at temperature of 85 °C, 125 °C and 150 °C for 100, 500 and 1000 h on Sn-3.0Ag-0.5Cu (SAC305) lead-free solder with the addition of 1 wt% kaolin geopolymer ceramic (KGC) reinforcement particles. SAC305-KGC composite solders were fabricated through powder metallurgy using a hybrid microwave sintering method and reflowed on copper substrate printed circuit board with an organic solderability preservative surface finish. The results revealed that, the addition of KGC was beneficial in improving the total thickness of interfacial intermetallic compound (IMC) layer. At higher isothermal ageing of 150 °C and 1000 h, the IMC layer in SAC305-KGC composite solder was towards a planar-type morphology. Moreover, the growth of total interfacial IMC layer and Cu3Sn layer during isothermal ageing was found to be controlled by bulk diffusion and grain-boundary process, respectively. The activation energy possessed by SAC305-KGC composite solder for total interfacial IMC layer and Cu3Sn IMC was 74 kJ/mol and 104 kJ/mol, respectively. Based on a lap shear test, the shear strength of SAC305-KGC composite solder exhibited higher shear strength than non-reinforced SAC305 solder. Meanwhile, the solder joints failure mode after shear testing was a combination of brittle and ductile modes at higher ageing temperature and time for SAC305-KGC composite solder.

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