Characterization based analysis on TiAl3 intermetallic phase layer growth phenomenon and kinetics in diffusion bonded Ti/TiAl3/Al laminates

2021 ◽  
Vol 174 ◽  
pp. 110981
Author(s):  
N. Thiyaneshwaran ◽  
K. Sivaprasad ◽  
B. Ravisankar
Keyword(s):  
Intermetallic Phase ◽  
Layer Growth ◽  
Phase Layer ◽  
Growth Phenomenon

The effect of silicon on the structure and properties of hot-dip aluminium-based coatings

2019 ◽  
Vol 24 (2) ◽  
pp. 16-21
Author(s):  
Andrii Zinchuk ◽  
Oskar Moraczyński ◽  
Barbara Kucharska
Keyword(s):  
Automotive Industry ◽  
Coating Layer ◽  
Steel Substrate ◽  
Intermetallic Phase ◽  
Aluminum Coating ◽  
Structure And Properties ◽  
Phase Layer ◽  
Continuous Increase ◽  
Aluminum Coatings ◽  
Intermediate Phases

The continuous increase in demand for aluminum coatings for the automotive industry is associated with the need to improve their quality in terms of protective and mechanical properties. The aluminum coatings produced hot-dip, on the border with the steel substrate formed intermediate phases FeAl3, and Fe2Al5, which reduce the corrosion resistance and limit the possibility of forming a coated article. The paper determines the effect of the addition of 7% Si to an aluminum coating (690°C/60 s) on the microstructure thickness and type of intermediate phases as well as hardness and surface features. It has been shown that the addition of Si results in a 40 % increase in the hardness of the coating and reduce the surface roughness. In addition, is limited interdiffusion of Al and Fe, as a result of which an intermetallic phase layer is formed, Al7-9Fe2Si enriched phase, 4 times thinner than a coating without the addition of Si, while maintaining the thickness of the outer coating layer.

Analysis of Morphology and Growth Kinetics of Zn-Mn and Zn-0.2wt.%Al-Mn Hot-Dip Galvanizing Coatings

2011 ◽  
Vol 291-294 ◽  
pp. 233-236
Author(s):  
Jian Hua Wang ◽  
Zi Shi Wu ◽  
Xu Ping Su ◽  
Chang Jun Wu ◽  
Ya Liu ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Growth Kinetics ◽  
Immersion Time ◽  
Intermetallic Phase ◽  
Phase Changes ◽  
Zinc Bath ◽  
Phase Layer ◽  
Δ Phase ◽  
Kinetics Of ◽  
Scanning Electron

The influence of manganese in Zn-Mn and Zn-0.2wt.%Al-Mn bath on the morphology and growth kinetics of the galvanizing coatings has been studied using scanning electron microscopy equipped with energy dispersive spectroscopy. When galvanized in zinc bath, the coating consists mainly h and ζphase. When manganese is added in zinc bath, the morphology of ζ phase changes from fragmental to compact. Manganese favors the formation of the δ phase and inhibits the growth of the ζ phase.When galvanized in Zn-0.2wt.%Al bath, the coating consists only δ and h phase. With the addition of manganese in Zn-0.2wt.%Al bath, the morphology of δ phase changes from fragmental to compact The thickness of the Fe-Zn intermetallic phase layer in coatings decreases obviously when manganese is added into zinc and Zn-0.2wt.%Al bath, and the thickness increases slowly with the increase of immersion time.

A Comparison of the Solderability of Wrought and Plated Nickel Surfaces: The Selection of a Reliable Pin for Second Level Packaging

1990 ◽  
Vol 112 (3) ◽  
pp. 223-233 ◽  
Author(s):  
C. G. Woychik ◽  
A. K. Trivedi
Keyword(s):  
Intermetallic Layer ◽  
Intermetallic Phase ◽  
Nickel Layer ◽  
Nickel Surface ◽  
Gold Plating ◽  
Phase Layer ◽  
The Poor ◽  
Nominal Thickness ◽  
Technology Corporation ◽  
Carpenter Technology Corporation

The solderability of a wrought nickel pin directly overplated with gold and that of a wrought kovar (tradename of an Fe-Ni-Co alloy manufactured by Carpenter Technology Corporation) pin plated with thick nickel and then overplated with gold was evaluated. The kovar pin was determined to exhibit very high solderability whereas the nickel pin was found to have extremely poor solderability. The poor solderability of the nickel pin as compared with the kovar pin is attributed to the contamination of the nickel surface prior to gold plating. A primary cause of the poor wetability of the nickel pin was due to embedded alumina particles on the surface of the pin (this occurs during the tumbling operation to remove any metallic slivers) prior to gold plating. The high solderability of the kovar is related to the clean nickel plating prior to overplating with gold. The cleanliness of the nickel layer was found to strongly influence the formation of the Ni-Sn intermetallic phase layer, having a nominal thickness of 42 μin (1.1 μm) after the kovar pin was tinned with eutectic Sn-Pb solder. For the tinned wrought nickel pin, a thin but continuous Ni-Sn intermetallic layer was also present; however, the nominal thickness of this layer was only 15 μin (0.38 μm). This large variation in solderability of both types of pins is attributed to differences in the intermetallic phase layer.

Kinetics of two-phase layer growth during reactive diffusion

1999 ◽  
Vol 270 (2) ◽  
pp. 231-236 ◽  
Author(s):  
Y Paransky ◽  
L Klinger ◽  
I Gotman
Keyword(s):  
Layer Growth ◽  
Reactive Diffusion ◽  
Two Phase ◽  
Phase Layer ◽  
Kinetics Of

GROWTH KINETICS OF Cu(Al) SOLID SOLUTION IN Al/Cu DIFFUSION COUPLES

2004 ◽  
Vol 11 (03) ◽  
pp. 337-340 ◽  
Author(s):  
E. B. HANNECH ◽  
N. LAMOUDI ◽  
A. GASMI
Keyword(s):  
Solid Solution ◽  
Growth Kinetics ◽  
Early Stage ◽  
Pure Aluminum ◽  
Layer Growth ◽  
Solid Solution Phase ◽  
Diffusion Couples ◽  
Phase Layer ◽  
Initial Stage ◽  
Kinetics Of

The growth kinetics of the solid solution phase of aluminum in copper in diffusion couples of pure aluminum and copper has been investigated at 425°C using a scanning electron microscope. In the initial stage, the phase layer growth was found to obey the parabolic law, indicating that the rate-controlling process is diffusion. At longer times, the growth rate deviates from the kt-1/2 behavior of the early stage.

Kinetics of phase layer growth during aluminide coating of nickel

1975 ◽  
Vol 6 (3) ◽  
pp. 431-440 ◽  
Author(s):  
A. J. Hickl ◽  
R. W. Heckel
Keyword(s):  
Aluminide Coating ◽  
Layer Growth ◽  
Phase Layer ◽  
Kinetics Of

scholarly journals Relationship between Al-Ni intermetallic Phases and Bond Strength in Roll Bonded Steel-Aluminum Composites with Nickel Interlayers

Metals ◽  
2019 ◽  
Vol 9 (8) ◽  
pp. 827 ◽  
Author(s):  
Arbo ◽  
Bergh ◽  
Holmedal ◽  
Vullum ◽  
Westermann
Keyword(s):  
Bond Strength ◽  
Intermetallic Phase ◽  
Kirkendall Effect ◽  
Heat Treatments ◽  
Aluminum Composites ◽  
Phase Layer ◽  
Metallurgical Bonding ◽  
High Bond ◽  
Increasing Temperature ◽  
Rolling Heat

In this work, the interface characteristics and resulting bond strength were investigated for roll bonded steel-aluminum composites with nickel interlayers, both after rolling and after post-rolling heat treatments at 400 °C–550 °C. After rolling, only mechanical interlocking was achieved between the steel and nickel layers, which resulted in delamination. Post-rolling heat treatments resulted in sufficient metallurgical bonding between the steel and nickel layers, and a significant increase in the bond strength. An intermetallic phase layer formed during the heat treatments, which below 500 °C consisted of Al3Ni and above, Al3Ni and Al3Ni2. With increasing temperature and time, the Al3Ni2 phase consumed the Al3Ni layer, voids developed along the Al3Ni2-aluminum interface, and a duplex morphology developed inside the Al3Ni2 layer, in accordance with the Kirkendall effect. The highest bond strength was obtained for the composites that only had an Al3Ni layer along the interface, and the optimal thickness was found to be 3–5 µm. The bond strength decreased with increasing temperature and time, due to increasing Al-Ni layer thickness, an increase in the fraction of Al3Ni2 relative to Al3Ni, and the development of voids. The results show that nickel can be used as an interlayer in steel-aluminum joints, and a high bond strength can be obtained through post-rolling heat treatments.

A Solvent for Liquid-Phase Layer Growth on BaF2 Substrates

1993 ◽  
Vol 28 (4) ◽  
pp. 463-468
Author(s):  
E. P. Trifonova ◽  
D. B. Kushev ◽  
K. Duharska
Keyword(s):  
Liquid Phase ◽  
Layer Growth ◽  
Phase Layer
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