Static logic state analysis by TLS on powered logic circuits: Three case studies for suspected stuck-at failure modes

2016 ◽  
Vol 64 ◽  
pp. 306-309
Author(s):  
C. Helfmeier ◽  
E. Friess ◽  
J. Glueck
Keyword(s):  
Case Studies ◽  
Failure Modes ◽  
Logic Circuits ◽  
Logic State ◽  
Static Logic ◽  
State Analysis

Infrared Emission-based Static Logic State Imaging on Advanced Silicon Technologies

2002 ◽  
Author(s):  
Daniel R. Bockelman ◽  
Steven Chen ◽  
Borna Obradovic
Keyword(s):  
Integrated Circuits ◽  
Case Studies ◽  
Infrared Emission ◽  
Cmos Integrated Circuits ◽  
Non Invasive ◽  
Logic State ◽  
Reduced Complexity ◽  
Static Logic

Abstract A technique is presented for mapping the logic states of CMOS integrated circuits by observing their static infrared emission. Application of the technique is shown in two case studies. The technique has the advantages of being non-invasive, having high observability and reduced complexity compared with dynamic probing techniques.

Case Studies of Brittle Interfacial Failures in Area Array Solder Interconnects

2000 ◽  
Author(s):  
George M. Wenger ◽  
Richard J. Coyle ◽  
Patrick P. Solan ◽  
John K. Dorey ◽  
Courtney V. Dodd ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Case Studies ◽  
Failure Modes ◽  
Electroless Nickel ◽  
Electrical Performance ◽  
Printed Wiring Board ◽  
Solder Interconnects ◽  
Area Array ◽  
Surface Finishes ◽  
Soldering Reaction

Abstract A common pad finish on area array (BGA or CSP) packages and printed wiring board (PWB) substrates is Ni/Au, using either electrolytic or electroless deposition processes. Although both Ni/Au processes provide flat, solderable surface finishes, there are an increasing number of applications of the electroless nickel/immersion gold (ENi/IAu) surface finish in response to requirements for increased density and electrical performance. This increasing usage continues despite mounting evidence that Ni/Au causes or contributes to catastrophic, brittle, interfacial solder joint fractures. These brittle, interfacial fractures occur early in service or can be generated under a variety of laboratory testing conditions including thermal cycling (premature failures), isothermal aging (high temperature storage), and mechanical testing. There are major initiatives by electronics industry consortia as well as research by individual companies to eliminate these fracture phenomena. Despite these efforts, interfacial fractures associated with Ni/Au surface finishes continue to be reported and specific failure mechanisms and root cause of these failures remains under investigation. Failure analysis techniques and methodologies are crucial to advancing the understanding of these phenomena. In this study, the scope of the fracture problem is illustrated using three failure analysis case studies of brittle interfacial fractures in area array solder interconnects. Two distinct failure modes are associated with Ni/Au surface finishes. In both modes, the fracture surfaces appear to be relatively flat with little evidence of plastic deformation. Detailed metallography, scanning electron microscopy (SEM), energy dispersive x-ray analysis (EDX), and an understanding of the metallurgy of the soldering reaction are required to avoid misinterpreting the failure modes.

Case Studies in Atomic Force Probe Analysis

2006 ◽  
Author(s):  
Randal Mulder ◽  
Sam Subramanian ◽  
Tony Chrastecky
Keyword(s):  
Failure Analysis ◽  
Case Studies ◽  
Light Emission ◽  
Electrical Characterization ◽  
Logic Circuits ◽  
Contrast Imaging ◽  
Atomic Force ◽  
Measuring Surface ◽  
Analysis Environment

Abstract The use of atomic force probe (AFP) analysis in the analysis of semiconductor devices is expanding from its initial purpose of solely characterizing CMOS transistors at the contact level with a parametric analyzer. Other uses found for the AFP include the full electrical characterization of failing SRAM bit cells, current contrast imaging of SOI transistors, measuring surface roughness, the probing of metallization layers to measure leakages, and use with other tools, such as light emission, to quickly localize and identify defects in logic circuits. This paper presents several case studies in regards to these activities and their results. These case studies demonstrate the versatility of the AFP. The needs and demands of the failure analysis environment have quickly expanded its use. These expanded capabilities make the AFP more valuable for the failure analysis community.

Failure Modes, Reliability Analysis and Case Studies on the Integration of Copper and Low-K Technology

2004 ◽  
Author(s):  
Huixian Wu ◽  
James Cargo ◽  
Huixian Wu ◽  
Marvin White
Keyword(s):  
Failure Analysis ◽  
Case Studies ◽  
Cross Section ◽  
Focused Ion Beam ◽  
Failure Modes ◽  
Ion Beam ◽  
Copper Interconnects ◽  
Wet Chemical ◽  
Low K ◽  
Section Analysis

Abstract The integration of copper interconnects and low-K dielectrics will present novel failure modes and reliability issues to failure analysts. This paper discusses failure modes related to Cu/low-K technology. Here, physical failure analysis (FA) techniques including deprocessing and cross-section analysis have been developed. The deprocessing techniques include wet chemical etching, reactive ion etching, chemical mechanical polishing and a combination of these techniques. Case studies on different failure modes related to Cu/low k technology are discussed: copper voiding, copper extrusion; electromigration stress failure; dielectric cracks; delamination-interface adhesion; and FA on circuit-under-pad. For the cross-section analysis of copper/low-K samples, focused ion beam techniques have been developed. Scanning electron microscopy, EDX, and TEM analytical analysis have been used for failure analysis for Cu/low-K technology. Various failure modes and reliability issues have also been addressed.

VIKOR power law-based customer-oriented FMEA with complete unique risk priority numbers

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Randula L. Hettiarachchi ◽  
Pisut Koomsap ◽  
Panarpa Ardneam
Keyword(s):  
Case Studies ◽  
Power Law ◽  
Design Methodology ◽  
Service Sector ◽  
Failure Modes ◽  
Risk Priority Number ◽  
Effect Analysis ◽  
Content Type ◽  
Industrial Sectors ◽  
Inherent Problem

PurposeAn inherent problem on risk priority number (RPN) value duplication of traditional failure modes and effect analysis (FMEA) also exists in two customer-oriented FMEAs. One has no unique value, and another has 1% unique values out of 4,000 possible values. The RPN value duplication has motivated the development of a new customer-oriented FMEA presented in this paper to achieve practically all 4,000 unique values and delivering reliable prioritization.Design/methodology/approachThe drastic improvement is the result of power-law and VlseKriterijumska Optimizacija I Kompromisno Resenje (VIKOR). By having all three risk factors in a power-law form, all unique values can be obtained, and by applying VIKOR to these power-law terms, the prioritization is more practical and reliable.FindingsThe proposed VIKOR power law-based customer-oriented FMEA can achieve practically all 4,000 unique values and is tested with two case studies. The results are more logical than the results from the other two customer-oriented FMEAs.Research limitations/implicationsThe evaluation has been done on two case studies for the service sector. Therefore, additional case studies in other industrial sectors will be required to confirm the effectiveness of this new customer-oriented RPN calculation.Originality/valueAchieving all 1,000 unique values could only be done by having experts tabulate all possible combinations for the traditional FMEA. Therefore, achieving all 4,000 unique values will be much more challenging. A customer-oriented FMEA has been developed to achieve practically all 4,000 unique risk priority numbers, and that the prioritization is more practical and reliable. Furthermore, it has a connection to the traditional FMEA, which helps explain the traditional one from a broader perspective.

An explainable prediction framework for engineering problems: case studies in reinforced concrete members modeling

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Amirhessam Tahmassebi ◽  
Mehrtash Motamedi ◽  
Amir H. Alavi ◽  
Amir H. Gandomi
Keyword(s):  
Machine Learning ◽  
Case Studies ◽  
Failure Modes ◽  
Statistical Significance ◽  
Deep Understanding ◽  
Machine Learning Algorithms ◽  
Learning Models ◽  
Content Type ◽  
Engineering Problems ◽  
Machine Learning Models

PurposeEngineering design and operational decisions depend largely on deep understanding of applications that requires assumptions for simplification of the problems in order to find proper solutions. Cutting-edge machine learning algorithms can be used as one of the emerging tools to simplify this process. In this paper, we propose a novel scalable and interpretable machine learning framework to automate this process and fill the current gap.Design/methodology/approachThe essential principles of the proposed pipeline are mainly (1) scalability, (2) interpretibility and (3) robust probabilistic performance across engineering problems. The lack of interpretibility of complex machine learning models prevents their use in various problems including engineering computation assessments. Many consumers of machine learning models would not trust the results if they cannot understand the method. Thus, the SHapley Additive exPlanations (SHAP) approach is employed to interpret the developed machine learning models.FindingsThe proposed framework can be applied to a variety of engineering problems including seismic damage assessment of structures. The performance of the proposed framework is investigated using two case studies of failure identification in reinforcement concrete (RC) columns and shear walls. In addition, the reproducibility, reliability and generalizability of the results were validated and the results of the framework were compared to the benchmark studies. The results of the proposed framework outperformed the benchmark results with high statistical significance.Originality/valueAlthough, the current study reveals that the geometric input features and reinforcement indices are the most important variables in failure modes detection, better model can be achieved with employing more robust strategies to establish proper database to decrease the errors in some of the failure modes identification.

Static Logic Circuits

1992 ◽  
pp. 115-166
Author(s):  
John P. Uyemura
Keyword(s):  
Logic Circuits ◽  
Static Logic
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