Kinetics of the Hydrogen–Oxygen–Methane System. I. Inhibition of the Second Explosion Limit

1955 ◽  
Vol 59 (8) ◽  
pp. 721-727 ◽  
Author(s):  
Arthur Levy
Keyword(s):  

The addition of molecular oxygen was found to increase the rate of rem oval of hydrogen atoms in a flow system at and below room temperature. Kinetic studies of this process using argon carrier showed that the rate-determining step is the third-order reaction H + O2 + Ar = HO 2 + Ar. (2) Atomic oxygen in small concentrations is produced in the system. Product analysis and measurements of oxygen atom concentrations indicated that the principal reactions removing HO 2 under these conditions are H+HO 2 = H 2 +O 2 , (12a) H+HO 2 = OH+OH, (12b) H+HO 2 = H 2 O+O 2 , (12c) A value for k 2 of 2.2 x 10 -32 cm 6 molecule -2 s -1 was determined at 293 °K. Reaction (2) was found to have a small negative temperature coefficient. These data and values of k 2 from explosion limit studies can be represented by the expression k 2 = 1.3 x 10 -33 exp (+ 1600 + 700/ RT ) cm 6 molecule -2 s -1 in the range 250 to 800 °K. The third-body efficiencies in reaction (2) at 293 °K of He and H 2 O relative to Ar are similar to those obtained from data on the second explosion limit at higher temperatures.


The explosion-limit equation is considered term by term for the evaluation of the various constants and a comparison of the experimental figures with theoretical expectations. In general, the agreement is found to be satisfactory and the equation adequate in describing the whole observed region of spontaneous ignition. Certain features of the reaction about which there still exists some uncertainty are re-examined in the light of the present work. The aspects considered are those of vessel-size effects, the overall reaction mechanism, activation energy of the branching process, surface chain-breaking efficiencies, effects of inert gases and the action of sensitizers.


Gaseous oxidation phenomena show a great variety, since actions may take place both on the vessel wall and homogeneously, and reaction chains which may thus be set up are broken either in the gas phase or at the wall according to circumstances. With the object of extending the picture of these reactions, we have studied the oxidation of cyanogen, which, in several respects, exhibits a kind of behaviour quite different from that met with in the oxdiation of hydrogen, phosphine and various hydrocarbons. There is evidence of the formation on the vessel wall of activated carbon monoxide molecules, some of which are oxidised immediately to carbon dioxide, and the remainder of which are deactivated. The further oxidation of normal carbon monoxide is inhibited in a remarkable way by cyanogen. An explosion limit exists, but appears to be of a rather special kind, unlike the limits found in the oxidation of hydrogen, and phosphine, and depending on certain particular adsorption relationships.


1984 ◽  
Vol 16 (7) ◽  
pp. 817-834 ◽  
Author(s):  
E. N. Aleksandrov ◽  
V. S. Arutyunov ◽  
I. V. Dubrovina ◽  
S. N. Kozlov

Author(s):  
J. F. DeNatale ◽  
D. G. Howitt

The electron irradiation of silicate glasses containing metal cations produces various types of phase separation and decomposition which includes oxygen bubble formation at intermediate temperatures figure I. The kinetics of bubble formation are too rapid to be accounted for by oxygen diffusion but the behavior is consistent with a cation diffusion mechanism if the amount of oxygen in the bubble is not significantly different from that in the same volume of silicate glass. The formation of oxygen bubbles is often accompanied by precipitation of crystalline phases and/or amorphous phase decomposition in the regions between the bubbles and the detection of differences in oxygen concentration between the bubble and matrix by electron energy loss spectroscopy cannot be discerned (figure 2) even when the bubble occupies the majority of the foil depth.The oxygen bubbles are stable, even in the thin foils, months after irradiation and if van der Waals behavior of the interior gas is assumed an oxygen pressure of about 4000 atmospheres must be sustained for a 100 bubble if the surface tension with the glass matrix is to balance against it at intermediate temperatures.


Author(s):  
R. J. Lauf

Fuel particles for the High-Temperature Gas-Cooled Reactor (HTGR) contain a layer of pyrolytic silicon carbide to act as a miniature pressure vessel and primary fission product barrier. Optimization of the SiC with respect to fuel performance involves four areas of study: (a) characterization of as-deposited SiC coatings; (b) thermodynamics and kinetics of chemical reactions between SiC and fission products; (c) irradiation behavior of SiC in the absence of fission products; and (d) combined effects of irradiation and fission products. This paper reports the behavior of SiC deposited on inert microspheres and irradiated to fast neutron fluences typical of HTGR fuel at end-of-life.


Author(s):  
Shiro Fujishiro ◽  
Harold L. Gegel

Ordered-alpha titanium alloys having a DO19 type structure have good potential for high temperature (600°C) applications, due to the thermal stability of the ordered phase and the inherent resistance to recrystallization of these alloys. Five different Ti-Al-Ga alloys consisting of equal atomic percents of aluminum and gallium solute additions up to the stoichiometric composition, Ti3(Al, Ga), were used to study the growth kinetics of the ordered phase and the nature of its interface.The alloys were homogenized in the beta region in a vacuum of about 5×10-7 torr, furnace cooled; reheated in air to 50°C below the alpha transus for hot working. The alloys were subsequently acid cleaned, annealed in vacuo, and cold rolled to about. 050 inch prior to additional homogenization


Author(s):  
L. J. Chen ◽  
L. S. Hung ◽  
J. W. Mayer

When an energetic ion penetrates through an interface between a thin film (of species A) and a substrate (of species B), ion induced atomic mixing may result in an intermixed region (which contains A and B) near the interface. Most ion beam mixing experiments have been directed toward metal-silicon systems, silicide phases are generally obtained, and they are the same as those formed by thermal treatment.Recent emergence of silicide compound as contact material in silicon microelectronic devices is mainly due to the superiority of the silicide-silicon interface in terms of uniformity and thermal stability. It is of great interest to understand the kinetics of the interfacial reactions to provide insights into the nature of ion beam-solid interactions as well as to explore its practical applications in device technology.About 500 Å thick molybdenum was chemical vapor deposited in hydrogen ambient on (001) n-type silicon wafer with substrate temperature maintained at 650-700°C. Samples were supplied by D. M. Brown of General Electric Research & Development Laboratory, Schenectady, NY.


Author(s):  
J. Drucker ◽  
R. Sharma ◽  
J. Kouvetakis ◽  
K.H.J. Weiss

Patterning of metals is a key element in the fabrication of integrated microelectronics. For circuit repair and engineering changes constructive lithography, writing techniques, based on electron, ion or photon beam-induced decomposition of precursor molecule and its deposition on top of a structure have gained wide acceptance Recently, scanning probe techniques have been used for line drawing and wire growth of W on a silicon substrate for quantum effect devices. The kinetics of electron beam induced W deposition from WF6 gas has been studied by adsorbing the gas on SiO2 surface and measuring the growth in a TEM for various exposure times. Our environmental cell allows us to control not only electron exposure time but also the gas pressure flow and the temperature. We have studied the growth kinetics of Au Chemical vapor deposition (CVD), in situ, at different temperatures with/without the electron beam on highly clean Si surfaces in an environmental cell fitted inside a TEM column.


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