scholarly journals Development and characterization of Nb3Sn/Al2O3 superconducting multilayers for particle accelerators

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Chris Sundahl ◽  
Junki Makita ◽  
Paul B. Welander ◽  
Yi-Feng Su ◽  
Fumitake Kametani ◽  
...  
Keyword(s):  
High Performance ◽  
High Energy ◽  
Particle Accelerators ◽  
Quality Factors ◽  
Critical Fields ◽  
Linear Accelerators ◽  
Cross Sectional ◽  
Low Field ◽  
Superconducting Radio Frequency

AbstractSuperconducting radio-frequency (SRF) resonator cavities provide extremely high quality factors > 1010 at 1–2 GHz and 2 K in large linear accelerators of high-energy particles. The maximum accelerating field of SRF cavities is limited by penetration of vortices into the superconductor. Present state-of-the-art Nb cavities can withstand up to 50 MV/m accelerating gradients and magnetic fields of 200–240 mT which destroy the low-dissipative Meissner state. Achieving higher accelerating gradients requires superconductors with higher thermodynamic critical fields, of which Nb3Sn has emerged as a leading material for the next generation accelerators. To overcome the problem of low vortex penetration field in Nb3Sn, it has been proposed to coat Nb cavities with thin film Nb3Sn multilayers with dielectric interlayers. Here, we report the growth and multi-technique characterization of stoichiometric Nb3Sn/Al2O3 multilayers with good superconducting and RF properties. We developed an adsorption-controlled growth process by co-sputtering Nb and Sn at high temperatures with a high overpressure of Sn. The cross-sectional scanning electron transmission microscope images show no interdiffusion between Al2O3 and Nb3Sn. Low-field RF measurements suggest that our multilayers have quality factor comparable with cavity-grade Nb at 4.2 K. These results provide a materials platform for the development and optimization of high-performance SIS multilayers which could overcome the intrinsic limits of the Nb cavity technology.

scholarly journals Development and Characterization of Nb3Sn/Al2O3 Superconducting Multilayers for High-performance Radio-Frequency Applications

2021 ◽  
Author(s):  
Chris Sundahl ◽  
Junki Makita ◽  
Paul Welander ◽  
Yi-Feng Su ◽  
Fumitake Kametani ◽  
...  
Keyword(s):  
Radio Frequency ◽  
High Performance ◽  
High Energy ◽  
Quality Factors ◽  
Critical Fields ◽  
Linear Accelerators ◽  
Cross Sectional ◽  
Low Field ◽  
Superconducting Radio Frequency

Abstract Superconducting radio-frequency (SRF) resonator cavities provide extremely high quality factors > 1010 at 1-2 GHz and 2K in large linear accelerators of high-energy particles. The maximum accelerating field of SRF cavities is limited by penetration of vortices into the superconductor. Present state-of-the-art Nb cavities can withstand up to 50 MV/m accelerating gradients and magnetic fields of 200-240 mT which destroy the low-dissipative Meissner state. Achieving higher accelerating gradients requires superconductors with higher thermodynamic critical fields, of which Nb3Sn has emerged as a leading material for the next generation accelerators. To overcome the problem of low vortex penetration field in Nb3Sn, it has been proposed to coat Nb cavities with thin film Nb3Sn multilayers with dielectric interlayers. Here, we report the growth and multi-technique characterization of stoichiometric Nb3Sn/Al2O3 multilayers with good superconducting and RF properties. We developed an adsorption-controlled growth process by co-sputtering Nb and Sn at high temperatures with a high overpressure of Sn. The cross-sectional scanning electron transmission microscope images show no interdiffusion between Al2O3 and Nb3Sn. Low-field RF measurements suggest that our multilayers have quality factor comparable with cavity-grade Nb at 4.2 K. These results provide a materials platform for the development and optimization of high-performance SIS multilayers which could overcome the intrinsic limits of the Nb cavity technology.

Development of High-Performance GaAs Solar Cells on Large-Grain Polycrystalline Ge Substrates

1995 ◽  
Vol 403 ◽  
Author(s):  
R. Venkatasubramanian ◽  
B. O'Quinn ◽  
J. S. Hills ◽  
M. L. Timmons ◽  
D. P. Malta
Keyword(s):  
Solar Cells ◽  
High Performance ◽  
Carrier Lifetime ◽  
Minority Carrier ◽  
Minority Carrier Lifetime ◽  
Cross Sectional ◽  
Plan View ◽  
Electron Beam Induced Current ◽  
Induced Defects

AbstractThe characterization of MOCVD-grown GaAs-AlGaAs materials and GaAs p+n junctions on poly-Ge substrates is presented. Minority carrier lifetime in GaAs-AIGaAs double-hetero (DH) structures grown on these substrates and the variation of lifetimes across different grainstructures are discussed. Minority-carrier diffusion lengths in polycrystalline GaAs p+-n junctions were evaluated by cross-sectional electron-beam induced current (EBIC) scans. The junctions were also studied by plan-view EBIC imaging. Optimization studies of GaAs solar cell on poly-Ge are discussed briefly. The effect of various polycrystalline substrate-induced defects on performance of GaAs solar cells are presented.

scholarly journals Dual-energy CT characterization of winter sports injuries

2020 ◽  
Vol 93 (1106) ◽  
pp. 20190620
Author(s):  
Jonathan Hickle ◽  
Frances Walstra ◽  
Peter Duggan ◽  
Hugue Ouellette ◽  
Peter Munk ◽  
...  
Keyword(s):  
High Speed ◽  
Sports Injuries ◽  
Imaging Modality ◽  
High Energy ◽  
Dual Energy ◽  
Dual Energy Ct ◽  
Cross Sectional ◽  
Winter Sports ◽  
Conventional Ct

CT is a readily available imaging modality for cross-sectional characterization of acute musculoskeletal injuries in trauma. Dual-energy CT provides several additional benefits over conventional CT, namely assessment for bone marrow edema, metal artifact reduction, and enhanced assessment of ligamentous injuries. Winter sports such as skiing, snowboarding, and skating can result in high speed and high energy injury mechanisms; dual-energy CT is well suited for the characterization of those injuries.

characterization of amorphization in Ni-Ti multilayers

1988 ◽  
Vol 46 ◽  
pp. 452-453
Author(s):  
K. B. Alexander ◽  
F. J. Walker ◽  
R. A. McKee ◽  
F. A. List
Keyword(s):  
Amorphous Film ◽  
High Energy ◽  
Film Deposition ◽  
Cross Sectional ◽  
Transmission Electron ◽  
20 Nm ◽  
Elemental Layer ◽  
Deposited Films

The formation of amorphous alloys through the solid-state reaction of crystalline multilayers has recently been studied by several groups. In each of these studies, the multilayers were entirely amorphous when there were less than 4-10 planes in each layer. Layer thicknesses larger than this resulted in crystalline layers, presumably separated by an amorphous film approximately 4-10 layers thick. Our intent was to measure the thickness of the amorphous film in Ni-Ti multilayer specimens with a wavelength (thickness of Ni + Ti layers) of 20 nm, or approximately 40 planes per elemental layer. In situ Reflection High Energy Electron Diffraction (RHEED) was performed during the film deposition and transmission electron microscopy of cross-sectional specimens was used to examine the as-deposited films.Nickel and titanium layers were sequentially deposited onto a 50 nm amorphous Ni-Ti codeposit on an unheated (001) silicon substrate in the ORNL Molecular Beam Epitaxy (MBE) facility with a vacuum < 10-9 torr.

Microstructure of silicon implanted with MeV gold ions

1991 ◽  
Vol 49 ◽  
pp. 876-877
Author(s):  
M.J. Kim ◽  
M. Catalano ◽  
T.P. Sjoreen ◽  
R.W. Carpenter
Keyword(s):  
Single Crystal ◽  
Ion Irradiation ◽  
Microstructural Characterization ◽  
High Energy ◽  
Ion Milling ◽  
Cross Sectional ◽  
Microstructural Investigation ◽  
Annealing Behavior ◽  
Different Doses

High-energy implantation of silicon is of great interest in recent years for microelectronics due to the formation of a buried damage or dopant layer away from the active region of the device. The damage nucleation and growth behavior is known to vary significantly along the ion's track for MeV irradiation. In this paper, a detailed characterization of the damage morphology produced by MeV gold ions for different doses into single crystal Si, as well as the associated annealing behavior, is presented.Single crystal n-type Czochralski silicon {001} wafers were implanted with Au++ ions from doses of 1x1015 to 3x1016 cm-2 at 2-3 MeV. Specimen temperatures for all implantations were 20 or 300°C. A measurement with an infrared pyrometer of the implanted surface indicated a slight temperature rise during ion irradiation. The compositional and damage profiles were determined by Rutherford backscattering/channeling spectroscopy (RBS). Cross-sectional TEM samples for microstructural characterization were prepared by mechanical polishing and ion milling. A Philips 400ST/FEG analytical microscope was used for nanoprobe experiments, at 100 kV. Microstructural investigation was performed using ISI-002B and JEM-2000FX microscopes, at 200 kV.

Microstructural characterization of CoPtCr/Cr thin film disks by cross-section TEM and elongated probe micro-diffraction

1991 ◽  
Vol 49 ◽  
pp. 762-763
Author(s):  
M.A. Parker ◽  
K.E. Johnson ◽  
C. Hwang ◽  
A. Bermea
Keyword(s):  
Magnetic Recording ◽  
Electron Probe ◽  
Microstructural Characterization ◽  
Crystallographic Structure ◽  
Recording Media ◽  
Layer By Layer ◽  
Cross Sectional ◽  
New Techniques ◽  
Polished Side

We have reported the dependence of the magnetic and recording properties of CoPtCr recording media on the thickness of the Cr underlayer. It was inferred from XRD data that grain-to-grain epitaxy of the Cr with the CoPtCr was responsible for the interaction observed between these layers. However, no cross-sectional TEM (XTEM) work was performed to confirm this inference. In this paper, we report the application of new techniques for preparing XTEM specimens from actual magnetic recording disks, and for layer-by-layer micro-diffraction with an electron probe elongated parallel to the surface of the deposited structure which elucidate the effect of the crystallographic structure of the Cr on that of the CoPtCr.XTEM specimens were prepared from magnetic recording disks by modifying a technique used to prepare semiconductor specimens. After 3mm disks were prepared per the standard XTEM procedure, these disks were then lapped using a tripod polishing device. A grid with a single 1mmx2mm hole was then glued with M-bond 610 to the polished side of the disk.

TEM characterization of silicon epitaxial layer grown on Si-TaS2, eutectic composites

1991 ◽  
Vol 49 ◽  
pp. 802-803
Author(s):  
C.M. Sung ◽  
M. Levinson ◽  
M. Tabasky ◽  
K. Ostreicher ◽  
B.M. Ditchek
Keyword(s):  
Substrate Surface ◽  
Bulk Sample ◽  
Surface Cleaning ◽  
Native Oxide ◽  
Czochralski Growth ◽  
Ion Milling ◽  
Cross Sectional ◽  
Cleaning Methods ◽  
Field Emission Cathodes

Directionally solidified Si/TaSi2 eutectic composites for the development of electronic devices (e.g. photodiodes and field-emission cathodes) were made using a Czochralski growth technique. High quality epitaxial growth of silicon on the eutectic composite substrates requires a clean silicon substrate surface prior to the growth process. Hence a preepitaxial surface cleaning step is highly desirable. The purpose of this paper is to investigate the effect of surface cleaning methods on the epilayer/substrate interface and the characterization of silicon epilayers grown on Si/TaSi2 substrates by TEM.Wafers were cut normal to the <111> growth axis of the silicon matrix from an approximately 1 cm diameter Si/TaSi2 composite boule. Four pre-treatments were employed to remove native oxide and other contaminants: 1) No treatment, 2) HF only; 3) HC1 only; and 4) both HF and HCl. The cross-sectional specimens for TEM study were prepared by cutting the bulk sample into sheets perpendicular to the TaSi2 fiber axes. The material was then prepared in the usual manner to produce samples having a thickness of 10μm. The final step was ion milling in Ar+ until breakthrough occurred. The TEM samples were then analyzed at 120 keV using the Philips EM400T.

Sign in / Sign up

Export Citation Format

Share Document