Absence of single critical dose for the amorphization of quartz under ion irradiation

AbstractThe critical dose for formation of an amorphous layer of Al2O3 by ion irradiation at 77 K has been determined. It is found to lie between 2 and 3 × 1015/cm2 if the sample is irradiated near the <0001> axis of the substrate and is found to lie in the neighborhood of 2 × 1016/cm2 if the irradiation is near the <1210> axis. The amorphous layers are found to recrystallize epitaxially if annealed at 1190 degrees C and to form a metastable microstructure upon annealing at 800 degrees C.

Download Full-text

Effect of Stress and Impurities on Preferential Amorphization on Grain Boundaries in Polycrystalline Silicon

MRS Proceedings ◽

10.1557/proc-540-37 ◽

1998 ◽

Vol 540 ◽

Author(s):

Mitsuhiro Takeda ◽

Somei Ohnuki ◽

Seiichi Watanabe ◽

Hiroaki Abe ◽

Hiroshi Naramoto ◽

...

Keyword(s):

Growth Rate ◽

Grain Boundaries ◽

Ion Irradiation ◽

In Situ Observation ◽

Constant Growth Rate ◽

Second Stage ◽

Critical Dose ◽

Increasing Temperature ◽

Constant Growth

AbstractClarifying the local amorphization on the grain boundaries, the in-situ observation during ion-irradiation was carried out for poly-crystalline Si film. The critical dose of amorphous formation increased exponentially with increasing temperature, where the local amorphization was developed at middle temperature. The critical dose was affected by the doped impurity and the grain size. The preferential amorphization on and near grain boundaries had two processes; first stage with rapid growth rate and second stage with almost constant growth rate. The importance of stress was demonstrated from the acceleration due to the stress on the first stage of amorphization.

Download Full-text

Threshold Irradiation Dose for Amorphization of Silicon Carbide

MRS Proceedings ◽

10.1557/proc-439-595 ◽

1996 ◽

Vol 439 ◽

Cited By ~ 11

Author(s):

L. L. Snead ◽

S. J. Zinkle

Keyword(s):

Silicon Carbide ◽

Ion Irradiation ◽

Major Axis ◽

Published Data ◽

Temperature Threshold ◽

Temperature Dependent ◽

Tem Analysis ◽

Critical Dose ◽

Silicon Ions ◽

The Difference

AbstractThe amorphization of silicon carbide due to ion and electron irradiation is reviewed with emphasis on the temperature dependent critical dose for amorphization. The effect of ion mass and energy on the threshold dose for amorphization is summarized showing only a weak dependence near room temperature. Results are presented for 0.56 MeV silicon ions implanted into single crystal 6H-SiC as a function of temperature and ion dose. From this, the critical dose for amorphization is found as a function of temperature at depths well separated from the implanted ion region. Results are compared with published data generated using electron and xenon irradiating species. High resolution TEM analysis is presented for the Si ion series showing the evolution of elongated amorphous islands oriented such that their major axis is parallel to the free surface. This suggests that surface or strain effects may be influencing the apparent amorphization threshold. Finally, a model for the temperature threshold for amorphization is described using the Si ion irradiation flux and the fitted interstitial migration energy which was found to be ∼0.56 eV. This model successfully explains the difference in the temperature-dependent amorphization behavior of SiC irradiated with 0.56 MeV silicon ions at 1×10-3 dpa/s and with fission neutrons irradiated at 1×10-6 dpa/s irradiated to 1 5 dpa in the temperature range of ∼340 ±10K.

Download Full-text

Effets of surfaces on precipitate morphology in irradiated thin foils

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100110416 ◽

1978 ◽

Vol 36 (1) ◽

pp. 654-655

Author(s):

D.I. Potter ◽

A. Taylor

Keyword(s):

Ion Irradiation ◽

Dark Field Image ◽

Thin Foil ◽

Dark Field ◽

Al Alloy ◽

Bright Field Image ◽

Dislocation Loops ◽

Precipitate Morphology ◽

Thin Foils

Thermal aging of Ni-12.8 at. % A1 and Ni-12.7 at. % Si produces spatially homogeneous dispersions of cuboidal γ'-Ni3Al or Ni3Si precipitate particles arrayed in the Ni solid solution. We have used 3.5-MeV 58Ni+ ion irradiation to examine the effect of irradiation during precipitation on precipitate morphology and distribution. The nearness of free surfaces produced unusual morphologies in foils thinned prior to irradiation. These thin-foil effects will be important during in-situ investigations of precipitation in the HVEM. The thin foil results can be interpreted in terms of observations from bulk irradiations which are described first.Figure 1a is a dark field image of the γ' precipitate 5000 Å beneath the surface(∿1200 Å short of peak damage) of the Ni-Al alloy irradiated in bulk form. The inhomogeneous spatial distribution of γ' results from the presence of voids and dislocation loops which can be seen in the bright field image of the same area, Fig. 1b.

Download Full-text

Xenon ion irradiation of superconducting YBa2Cu3O7 thin films

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100173595 ◽

1990 ◽

Vol 48 (4) ◽

pp. 92-93

Author(s):

H. Watanabe ◽

B. Kabius ◽

B. Roas ◽

K. Urban

Keyword(s):

Defect Formation ◽

Ion Irradiation ◽

High Resolution Electron Microscopy ◽

Structural Disorder ◽

Flux Lines ◽

Pinning Effect ◽

Magnetic Flux Lines ◽

Resolution Electron ◽

Radiation Induced ◽

Induced Defects

Recently it was reported that the critical current density(Jc) of YBa2Cu2O7, in the presence of magnetic field, is enhanced by ion irradiation. The enhancement is thought to be due to the pinning of the magnetic flux lines by radiation-induced defects or by structural disorder. The aim of the present study was to understand the fundamental mechanisms of the defect formation in association with the pinning effect in YBa2Cu3O7 by means of high-resolution electron microscopy(HRTEM).The YBa2Cu3O7 specimens were prepared by laser ablation in an insitu process. During deposition, a substrate temperature and oxygen atmosphere were kept at about 1073 K and 0.4 mbar, respectively. In this way high quality epitaxially films can be obtained with the caxis parallel to the <100 > SrTiO3 substrate normal. The specimens were irradiated at a temperature of 77 K with 173 MeV Xe ions up to a dose of 3.0 × 1016 m−2.

Download Full-text

Structural relationships in the synthesis of cubic boron nitride thin films by ion-assisted deposition

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s042482010017092x ◽

1994 ◽

Vol 52 ◽

pp. 638-639

Author(s):

D. L. Medlin ◽

T. A. Friedmann ◽

P. B. Mirkarimi ◽

M. J. Mills ◽

K. F. McCarty

Keyword(s):

Boron Nitride ◽

Ion Irradiation ◽

Cubic Boron Nitride ◽

Film Stress ◽

Bonded Phases ◽

Structural Relationships ◽

Precursor Material ◽

Pressure Synthesis ◽

Microstructure Of The Material

The allotropes of boron nitride include two sp2-bonded phases with hexagonal and rhombohedral structures (hBN and rBN) and two sp3-bonded phases with cubic (zincblende) and hexagonal (wurtzitic) structures (cBN and wBN) (Fig. 1). Although cBN is synthesized in bulk form by conversion of hBN at high temperatures and pressures, low-pressure synthesis of cBN as a thin film is more difficult and succeeds only when the growing film is simultaneously irradiated with a high flux of ions. Only sp2-bonded material, which generally has a disordered, turbostratic microstructure (tBN), will form in the absence of ion-irradiation. The mechanistic role of the irradiation is not well understood, but recent work suggests that ion-induced compressive film stress may induce the transformation to cBN.Typically, BN films are deposited at temperatures less than 1000°C, a regime for which the structure of the sp2-bonded precursor material dictates the phase and microstructure of the material that forms from conventional (bulk) high pressure treatment.

Download Full-text

Electron and ion irradiation-induced dissolution of mechanical twins in the intermetalic U3Si: An in situ HVEM study

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100155232 ◽

1989 ◽

Vol 47 ◽

pp. 652-653

Author(s):

Charles W. Allen ◽

Robert C. Birtcher

Keyword(s):

Elevated Temperatures ◽

Ion Irradiation ◽

Ion Beam ◽

National Laboratory ◽

Argonne National Laboratory ◽

Heavy Ion ◽

High Energy ◽

Mechanical Twinning ◽

In Situ Experiments

The uranium silicides, including U3Si, are under study as candidate low enrichment nuclear fuels. Ion beam simulations of the in-reactor behavior of such materials are performed because a similar damage structure can be produced in hours by energetic heavy ions which requires years in actual reactor tests. This contribution treats one aspect of the microstructural behavior of U3Si under high energy electron irradiation and low dose energetic heavy ion irradiation and is based on in situ experiments, performed at the HVEM-Tandem User Facility at Argonne National Laboratory. This Facility interfaces a 2 MV Tandem ion accelerator and a 0.6 MV ion implanter to a 1.2 MeV AEI high voltage electron microscope, which allows a wide variety of in situ ion beam experiments to be performed with simultaneous irradiation and electron microscopy or diffraction.At elevated temperatures, U3Si exhibits the ordered AuCu3 structure. On cooling below 1058 K, the intermetallic transforms, evidently martensitically, to a body-centered tetragonal structure (alternatively, the structure may be described as face-centered tetragonal, which would be fcc except for a 1 pet tetragonal distortion). Mechanical twinning accompanies the transformation; however, diferences between electron diffraction patterns from twinned and non-twinned martensite plates could not be distinguished.

Download Full-text

Transmission Electron Microscopy characterization of epitaxial III-V semiconductor thin films grown on Si(100) by ion-assisted deposition

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100176563 ◽

1990 ◽

Vol 48 (4) ◽

pp. 686-687

Author(s):

L. Hultman ◽

C.-H. Choi ◽

R. Kaspi ◽

R. Ai ◽

S.A. Barnett

Keyword(s):

Electron Microscopy ◽

Transmission Electron Microscopy ◽

Ion Irradiation ◽

High Energy ◽

Nucleation Mechanism ◽

Layer By Layer ◽

Extended Defect ◽

Island Formation ◽

Si Substrates ◽

Transmission Electron

III-V semiconductor films nucleate by the Stranski-Krastanov (SK) mechanism on Si substrates. Many of the extended defects present in the films are believed to result from the island formation and coalescence stage of SK growth. We have recently shown that low (-30 eV) energy, high flux (4 ions per deposited atom), Ar ion irradiation during nucleation of III-V semiconductors on Si substrates prolongs the 1ayer-by-layer stage of SK nucleation, leading to a decrease in extended defect densities. Furthermore, the epitaxial temperature was reduced by >100°C due to ion irradiation. The effect of ion bombardment on the nucleation mechanism was explained as being due to ion-induced dissociation of three-dimensional islands and ion-enhanced surface diffusion.For the case of InAs grown at 380°C on Si(100) (11% lattice mismatch), where island formation is expected after ≤ 1 monolayer (ML) during molecular beam epitaxy (MBE), in-situ reflection high-energy electron diffraction (RHEED) showed that 28 eV Ar ion irradiation prolonged the layer-by-layer stage of SK nucleation up to 10 ML. Otherion energies maintained layer-by-layer growth to lesser thicknesses. The ion-induced change in nucleation mechanism resulted in smoother surfaces and improved the crystalline perfection of thicker films as shown by transmission electron microscopy and X-ray rocking curve studies.

Download Full-text