The magneto-mechanical response of magnetostrictive composites for stress sensing applications

2017 ◽  
Vol 26 (6) ◽  
pp. 065007 ◽  
Author(s):  
Alexander Yoffe ◽  
Doron Shilo
2017 ◽  
Vol 10 (05) ◽  
pp. 1750060 ◽  
Author(s):  
Alexander Yoffe ◽  
Hadas Kaniel ◽  
Doron Shilo

Stress induced magnetic field changes in epoxy-based Terfenol-D composite materials offer a unique way for stress sensing by using a remote magnetic field sensor. In this paper, we report simultaneous measurements of the stress, strain and emitted magnetic field during compressive tests performed at different temperatures in the range of [Formula: see text]C–65[Formula: see text]C. The observed results are explained based on the physical processes that occur at different stresses and temperature ranges. Measurement results reveal a temperature range ([Formula: see text]C–45[Formula: see text]C) suitable for stress sensing applications, at which the reverse magnetostrictive response is almost temperature insensitive. At 65[Formula: see text]C, the epoxy demonstrated a significant softening due to the glass transition, indicating that a high glass transition temperature is an important desired property for the epoxy matrix.


1995 ◽  
Vol 78 (9) ◽  
pp. 2476-2480 ◽  
Author(s):  
Joseph S. Capurso ◽  
Aldo B. Alles ◽  
Walter A. Schulze

Author(s):  
Andrew W. McFarland ◽  
Jonathan S. Colton ◽  
Daniel Cox ◽  
Steven Y. Liang

Mechanical micro machining is an emerging technology with many potential benefits and equally great challenges. The push to develop processes and tools capable of micro scale fabrication is a result of the widespread drive to reduce part and feature size. One important factor that contributes to the ability to machine at the microscale level is the overall size of the machine tool due to the effects of thermal, static, and dynamic stabilities. This paper explores the technical feasibility of miniaturized machine tools capable of fabricating features and parts on the micro scale in terms of depth of cut and part form accuracy. It develops a machine tool and examines its capabilities through benchmarking tests and the making of precision dies for the injection molding of microcantilever parts. The design and configuration of a miniaturized vertical machining center of overall dimension less than 300 mm on a side is presented and the component specifications discussed. The six axis machine has linear positioning resolution of 4 nm by 10 nm by 10 nm, with accuracy on the order of 0.3 μm, in the height, feed, and cross feed directions. The work volume as defined by the ranges of axes travel are 4 mm by 25 mm by 25 mm in the height, feed, and cross feed and 20 degrees in the rotational space. To quantify the performance capability of the miniaturized machine tool as a system, a series of evaluation tests were implemented based on linear and arch trajectories over a range of feed speed and depth of cut conditions. Test results suggest that micro level form accuracy and sub-micron level finish are generally achievable for parts with moderate curvature and gradient in the geometry under selected machining parameters and conditions. An injection mold was made of steel with this machine and plastic microcantilevers fabricated. Plastic microcantilevers are appropriate for sensing applications such as surface probe microscopy. The microcantilevers, made from polystyrene, were 464 to 755 μm long, 130 μm wide and only 6–9 μm thick. They showed very good uniformity, reproducibility, and appropriate mechanical response for use as sensors in surface force microscopy.


Polymers ◽  
2020 ◽  
Vol 12 (5) ◽  
pp. 1164 ◽  
Author(s):  
Andrés Felipe Cruz-Pacheco ◽  
Leonel Paredes-Madrid ◽  
Jahir Orozco ◽  
Jairo Alberto Gómez-Cuaspud ◽  
Carlos R. Batista-Rodríguez ◽  
...  

Polyaniline (PANI) has recently gained great attention due to its outstanding electrical properties and ease of processability; these characteristics make it ideal for the manufacturing of polymer blends. In this study, the processing and piezoresistive characterization of polymer composites resulting from the blend of PANI with ultra-high molecular weight polyethylene (UHMWPE) in different weight percentages (wt %) is reported. The PANI/UHMWPE composites were uniformly homogenized by mechanical mixing and the pellets were manufactured by compression molding. A total of four pellets were manufactured, with PANI percentages of 20, 25, 30 and 35 wt %. Fourier-transform infrared (FTIR) spectroscopy, thermogravimetric analysis (TGA), differential thermal analysis (DTA), scanning electron microscopy (SEM) and energy-dispersive X-ray spectroscopy (EDS) were used to confirm the effective distribution of PANI and UHMWPE particles in the pellets. A piezoresistive characterization was performed on the basis of compressive forces at different voltages; it was found that the error metrics of hysteresis and drift were influenced by the operating voltage. In general, larger voltages lowered the error metrics, but a reduction in sensor sensitivity came along with voltage increments. In an attempt to explain such a phenomenon, the authors developed a microscopic model for the piezoresistive response of PANI composites, aiming towards a broader usage of PANI composites in strain/stress sensing applications as an alternative to carbonaceous materials.


2017 ◽  
Vol 733 ◽  
pp. 3-7 ◽  
Author(s):  
Afzaal Qamar ◽  
Dzung Viet Dao ◽  
Ji Sheng Han ◽  
Alan Iacopi ◽  
Toan Dinh ◽  
...  

This article reports the first results on stress induced pseudo-Hall effect in single crystal n-type 3C-SiC(100) grown by LPCVD process. After the growth process, Hall devices were fabricated by standard photolithography and dry etching processes. The bending beam method was employed to study the stress induced changes in the electrical response of the fabricated Hall devices. It has been observed that when stress is applied to the 3C-SiC(100) Hall devices, the offset voltage of the Hall devices varies linearly with the applied compressive and tensile stresses which is called, the pseudo-Hall effect. The variation of the offset voltage of these Hall devices is also proportional to the applied input current. This variation of the offset voltage with the applied compressive and tensile stresses shows that single crystal n-type 3C-SiC(100) can be used for stress sensing applications.


1988 ◽  
Vol 61 (2) ◽  
pp. 255-268 ◽  
Author(s):  
Ralph Nossal

Abstract Laser light sources currently are employed in numerous remote sensing applications. The following discussion concerns a particular application, namely, the use of laser light to probe the mechanical response of soft gels and, thereby, to measure the storage shear modulus and internal viscosity of a sample. The technique described in this paper was developed for biological investigations (e.g., the study of fibrin clots or cytoplasmic gels). However, it has much wider applicability and has been employed, for example, to study thermoreversible polysaccharide gels, as well as covalently crosslinked polyacrylamide networks. This paper in part is a survey of previous applications, and in part a report of new results. The initial sections contain discussions of the basis of the measurement and its use to ascertain the shear storage modulus. The later sections contain new material relating to detection of dissipative mechanisms which, when certain conditions are satisfied, can be described by a gel viscosity coefficient.


2018 ◽  
Vol 213 ◽  
pp. 11-14 ◽  
Author(s):  
Afzaal Qamar ◽  
Toan Dinh ◽  
Mohsen Jafari ◽  
Alan Iacopi ◽  
Sima Dimitrijev ◽  
...  

Author(s):  
Jason Clendenin ◽  
Husein Rokadia ◽  
Steve Tung ◽  
Konye Ogburia

This paper reports the development of a MEMS based aligned carbon nanotube, thermal surface shear stress sensor for micro shear stress sensing applications. This paper is focused on the theory of alignment of CNTs during sensing element fabrication as well as experimental and calibration results from sensor testing. It is found that CNTs can be routinely aligned between surface micromachined gold electrodes using AC dielectrophoresis to form shear stress sensing elements. In order to fabricate the sensing element, a 25 Vp-p electric field at 3 MHz was used to form a ~150 μm wide line of aligned CNTs. The measured resistance of the sensing element was 580 Ω. The fabricated CNT shear stress sensor has been tested by bonding a Plexiglas channel to the electrode chip in order to create a 2D internal flow. The CNT shear stress sensor was found to have an average TCR of −0.0112%/°C or −0.0691Ω/°C and a current to voltage ratio of 0.07 mA/V.


Author(s):  
Jason Clendenin ◽  
Yong Xu ◽  
Steve Tung

This paper reports the development of a novel method for determining the pressure sensitivity of two types of surface micromachined underwater shear stress sensor skins for micro shear stress sensing applications. The two types of sensors consisted of a thin-diaphragm sensor and a thick-diaphragm sensor. The focus is on the use of a combination of metrology and numerical simulation to theoretically determine the pressure sensitivity of the sensors and compare to experimental data. Using this combination, the nitride diaphragm deflection, the intrinsic stress of the diaphragm, and the piezoresistive gauge factor of the polysilicon sensing element were successfully determined. For the thin-diaphragm sensor, the tensile intrinsic stress and gauge factor were determined to be 28 MPa and 4, respectively. For the thick diaphragm sensor, the average tensile intrinsic stress and gauge factor were 48 MPa and 12, respectively. Using these numbers, the pressure sensitivity of the shear stress sensors was successfully modeled and verified against experimental results.


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