Nickel Oxide-based Flexible Thin-Film NTC Thermistors by using reverse offset printing

Abstract In recent years, the use of printing methods to fabricate electronic devices (printed electronics) has attracted attention because of their low cost and low environmental impact. Printing technology enables the high-throughput fabrication of electrical circuits on film substrates, providing inexpensive personal healthcare devices to monitor health status in real-time. Temperature detection is one of the central concerns as a fundamental physical quantity in various fields. In 2013, a highly sensitive flexible thermistor was reported by formulating aqueous inks of nickel oxide nanoparticles for inkjet printing. However, the calcinating of the nickel oxide (NiO) layer required a high-temperature process of more than 200°C, which required expensive polyimide films with high heat resistance. It is necessary to promote further the development of low-temperature processes for printed thermistors to realize flexible NTC thermistors at low cost using printed electronics technology. In screen printing and inkjet printing, the definition of the ink pattern applied on the substrate changes due to spreading and coffee distortion phenomena, and the thickness between sensors becomes non-uniform, which is a structural consistency problem that can lead to variations in sensing performance. This study developed a printing and low-temperature calcinating method of NTC thermistors with a temperature-sensitive layer of nickel oxide by using reverse offset printing. The NTC thermistors were fabricated by printing a comb-like pattern of silver nanoparticles and a thin nickel oxide film on a glass substrate. In addition, the low-temperature formation of a nickel oxide layer by oxygen plasma treatment was investigated, and XPS was used to carry out compositional analysis of the surface. Together with the plasma-assisted calcinating, a flexible NTC thermistor formed on polyethylene terephthalate (PEN) film is demonstrated.

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Nanocomposite of nickel oxide nanoparticles and polyethylene oxide as printable hole transport layer for organic solar cells

Sustainable Energy & Fuels ◽

10.1039/c9se00216b ◽

2019 ◽

Vol 3 (6) ◽

pp. 1418-1426 ◽

Cited By ~ 7

Author(s):

Marta Ruscello ◽

Tanmoy Sarkar ◽

Artem Levitsky ◽

Giovanni Maria Matrone ◽

Nikolaos Droseros ◽

...

Keyword(s):

Solar Cells ◽

Low Temperature ◽

Nickel Oxide ◽

Polyethylene Oxide ◽

Organic Solar Cells ◽

Hole Transport ◽

Transport Layer ◽

Hole Transport Layer ◽

Oxide Nanoparticles ◽

Nickel Oxide Nanoparticles

Low temperature NiOx is achieved using PEO as sacrificial ink additive to make hole transport layer for solar cells.

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Characterization of Nickel Oxide Nanoparticles Synthesized under Low Temperature

Micromachines ◽

10.3390/mi12101168 ◽

2021 ◽

Vol 12 (10) ◽

pp. 1168

Author(s):

Sung-Jei Hong ◽

Hyuk-Jun Mun ◽

Byeong-Jun Kim ◽

Young-Sung Kim

Keyword(s):

Low Temperature ◽

Nickel Oxide ◽

Oxide Nanoparticles ◽

X Ray Diffraction ◽

Nickel Oxide Nanoparticles ◽

Temperature Method ◽

Bet Specific Surface Area ◽

Heat Treated ◽

Nio Nps ◽

Xrd Patterns

In this study, ultrafine nickel oxide nanoparticles (NiO NPs) were well synthesized using a simple wet chemical method under low temperature, 300 °C. An Ni(OH)2 precursor was well precipitated by dropping NH4OH into an Ni(Ac)2 solution. TG-DTA showed that the weight of the precipitate decreases until 300 °C; therefore, the precursor was heat-treated at 300 °C. X-ray diffraction (XRD) patterns indicated that hexagonal-structured NiO NPs with (200) preferred orientation was synthesized. In addition, BET specific surface area (SSA) and HRTEM analyses revealed that spherical NiO NPs were formed with SSA and particle size of 60.14 m2/g and ca. 5–15 nm by using the low temperature method. FT-IR spectra of the NiO NPs showed only a sharp vibrating absorption peak at around 550 cm−1 owing to the Ni-O bond. Additionally, in UV-vis absorption spectra, the wavelength for absorption edge and energy band gap of the ultrafine NiO NPs was 290 nm and 3.44 eV.

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Fabrication of a Silver-Based Thermistor on Flexible, Temperature-Sensitive Substrates Using a Low-Temperature Inkjet Printing Technique

IEEE Sensors Letters ◽

10.1109/lsens.2019.2893741 ◽

2019 ◽

Vol 3 (2) ◽

pp. 1-4 ◽

Cited By ~ 4

Author(s):

Yongkun Sui ◽

Loren P. Kreider ◽

Kath M. Bogie ◽

Christian A. Zorman

Keyword(s):

Low Temperature ◽

Inkjet Printing ◽

Temperature Sensitive ◽

Printing Technique

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Design of a new low cost natural phosphate doped by nickel oxide nanoparticles for capacitive adsorption of reactive red 141 azo dye

Environmental Research ◽

10.1016/j.envres.2020.109322 ◽

2020 ◽

Vol 184 ◽

pp. 109322 ◽

Cited By ~ 4

Author(s):

H. Hafdi ◽

M. Joudi ◽

J. Mouldar ◽

B. Hatimi ◽

H. Nasrellah ◽

...

Keyword(s):

Nickel Oxide ◽

Azo Dye ◽

Low Cost ◽

Oxide Nanoparticles ◽

Nickel Oxide Nanoparticles ◽

Natural Phosphate

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Inkjet Printing of Polyacrylic Acid-Coated Silver Nanoparticle Ink onto Paper with Sub-100 Micron Pixel Size

Materials ◽

10.3390/ma12142277 ◽

2019 ◽

Vol 12 (14) ◽

pp. 2277 ◽

Cited By ~ 1

Author(s):

Mavuri ◽

Mayes ◽

Alexander

Keyword(s):

High Resolution ◽

Silver Nanoparticle ◽

Inkjet Printing ◽

Polyacrylic Acid ◽

Room Temperature ◽

Printed Electronics ◽

Low Cost ◽

Electrical Performance ◽

Print Quality ◽

Single Pass

Printed electronics (PE) technology shows huge promise for the realisation of low-cost and flexible electronics, with the ability to pattern heat- or pressure-sensitive materials. In future developments of the PE market, the ability to produce highly conductive, high-resolution patterns using low-cost and roll-to-roll processes, such as inkjet printing, is a critical technology component for the fabrication of printed electronics and displays. Here, we demonstrate inkjet printing of polyacrylic acid (PAA) capped silver nanoparticle dispersions onto paper for high-conductivity electronic interconnects. We characterise the resulting print quality, feature geometry and electrical performance of inkjet patterned features and demonstrate the high-resolution printing, sub-100 micron feature size, of silver nanoparticle materials onto flexible paper substrate. Printed onto photo-paper, these materials then undergo chemically triggered sintering on exposure to chloride contained in the paper. We investigated the effect of substrate temperature on the properties of printed silver material from room temperature to 50 °C. At room temperature, the resistivity of single layer printed features, of average thickness of 500 nm and width 85 µm, was found to be 2.17 × 10−7 Ω·m or 13 times resistivity of bulk silver (RBS). The resistivity initially decreased with an increase in material thickness, when achieved by overprinting successive layers or by decreasing print pitch, and a resistivity of around 10 times RBS was observed after overprinting two times at pitch 75 µm and with single pass print pitch of between 60 and 80 µm, resulting in line thickness up to 920 nm. On further increases in thickness the resistivity increased and reached 27 times RBS at print pitch of 15 µm. On moderate heating of the substrate to 50 °C, more compact silver nanoparticle films were formed, reducing thickness to 200 nm from a single pass print, and lower material resistivity approaching five times RBS was achieved.

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Inkjet-Printing of Methylammonium Lead Trihalide Perovskite as Active Layers for Optoelectronic Devices

MRS Advances ◽

10.1557/adv.2018.172 ◽

2018 ◽

Vol 3 (32) ◽

pp. 1837-1842 ◽

Cited By ~ 5

Author(s):

Charles Trudeau ◽

Martin Bolduc ◽

Patrick Beaupré ◽

Jaime Benavides-Guerrero ◽

Bruno Tremblay ◽

...

Keyword(s):

Flexible Electronics ◽

Inkjet Printing ◽

Printed Electronics ◽

Low Cost ◽

Hole Transport ◽

Ambient Atmosphere ◽

Large Area ◽

Device Architecture ◽

Active Layers ◽

Metal Organic

ABSTRACTNew routes in additive devices fabrication techniques and advances in printable materials are required to meet the ever increasing demands for low-cost and large-area flexible electronics. In particular, perovskite-based materials have gained an appeal due to their unique optoelectronics and ferroelectrics properties, which may replace p-n junction in semiconductor devices. Metal-organic methylammonium lead trihalide perovskite formulations have been extensively studied in the last few years as promising materials for use in printed electronics, which do not require high temperatures or vacuum environment, contrary to conventional semiconductor fabrication techniques. In this work, digital inkjet-printing in ambient atmosphere is proposed as a deposition pathway for the fabrication of perovskite active layers in photodetector and thin-film photovoltaic device architectures. The device architecture containing a printed perovskite active layer sandwiched between TiO2 and Spiro-OMeTAD as electron and hole transport layers, respectively, as well as layer-on-layer fabrication and responsivity spectra of the perovskite-based device are presented.

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Direct Patterning by Inkjet Printing 3-Mercaptopropionic Capped Nano Silver Suspension

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.409.508 ◽

2011 ◽

Vol 409 ◽

pp. 508-513

Author(s):

Yu Feng Liu ◽

Weng Sing Hwang ◽

Yen Fang Pai ◽

Ming Hsu Tsai

Keyword(s):

Inkjet Printing ◽

Printed Electronics ◽

Low Cost ◽

Specific Area ◽

Direct Patterning ◽

Printing Technique ◽

Fast Processing ◽

One Step ◽

Circuit Components ◽

Printed Patterns

All-printed electronics as a mean of fast processing and achieving ultra-low-cost electronic devices has attracted great interest in recent years. Inkjet printing has excelled as the most promising technique by which the circuit components can be directly drawn on the specific area in one step. Furthermore, the low temperature reduction processes can be achieved by exploit the low-melting point characteristic of nanometallic particles. The inkjet printing technique to deposit silver nanoparticles (3.39±1.21 nm) capped by saturated 3-Mercaptopropionic acid onto silicon substrate was studied. The silver patterns were tested for its functionality as circuit components like conductor, resistor and capacitor. All components can be produced simply by thermal annealing of an inkjet printed patterns under an atmosphere of 90% N2-10% H2 at 300°C for 1 hr.

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Silver Nanoparticles Based Ink with Moderate Sintering in Flexible and Printed Electronics

International Journal of Molecular Sciences ◽

10.3390/ijms20092124 ◽

2019 ◽

Vol 20 (9) ◽

pp. 2124 ◽

Cited By ~ 13

Author(s):

Lixin Mo ◽

Zhenxin Guo ◽

Li Yang ◽

Qingqing Zhang ◽

Yi Fang ◽

...

Keyword(s):

Silver Nanoparticles ◽

Radio Frequency Identification ◽

Printed Electronics ◽

Low Cost ◽

Substrate Surface ◽

Microwave Sintering ◽

Stretchable Electronics ◽

Temperature Sensitive ◽

Large Area ◽

Ag Nps

Printed electronics on flexible substrates has attracted tremendous research interest research thanks its low cost, large area production capability and environmentally friendly advantages. Optimal characteristics of silver nanoparticles (Ag NPs) based inks are crucial for ink rheology, printing, post-print treatment, and performance of the printed electronics devices. In this review, the methods and mechanisms for obtaining Ag NPs based inks that are highly conductive under moderate sintering conditions are summarized. These characteristics are particularly important when printed on temperature sensitive substrates that cannot withstand sintering of high temperature. Strategies to tailor the protective agents capping on the surface of Ag NPs, in order to optimize the sizes and shapes of Ag NPs as well as to modify the substrate surface, are presented. Different (emerging) sintering technologies are also discussed, including photonic sintering, electrical sintering, plasma sintering, microwave sintering, etc. Finally, applications of the Ag NPs based ink in transparent conductive film (TCF), thin film transistor (TFT), biosensor, radio frequency identification (RFID) antenna, stretchable electronics and their perspectives on flexible and printed electronics are presented.

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Print-Consistency and Process-Interaction for Inkjet-Printed Copper on Flexible Substrate

10.1115/ipack2021-74063 ◽

2021 ◽

Author(s):

Pradeep Lall ◽

Kartik Goyal ◽

Kyle Schulze ◽

Curtis Hill

Keyword(s):

Mechanical Properties ◽

Inkjet Printing ◽

Printed Electronics ◽

Low Cost ◽

Flexible Substrate ◽

Large Area ◽

Commercial Off The Shelf ◽

Traditional Manufacturing ◽

Print Process ◽

Photonic Sintering

Abstract Printed electronics is a fastest growing and emerging technology that have shown much potential in several industries including automotive, wearables, healthcare, and aerospace. Its applications can be found not only in flexible but also in large area electronics. The technology provides an effective and convenient method to additively deposit conductive and insulating materials on any type of substrate. Comparing with traditional manufacturing processes, which involves chemical etching, this technology also comes to be relatively environmental friendly. Despite its status, it is not without its challenges. Starting from the material being compatible in the printer equipment to the point of achieving fine resolutions, and with excellent properties are some of the challenges that printed electronics face. Among the myriad of printing technologies such as Aerosol Jet, micro-dispensing, gravure printing, screen printing, Inkjet printing, Inkjet has gained much attention due to its low-cost, low material consumption, and roll-to-roll capability for mass manufacturing. The technology has been widely used in home and office, but recently gained interest in printed electronics in a research and development setting. Conductive materials used in Inkjet printing generally comprises of metal Nanoparticles that need to be thermally sintered for it to be conductive. The preferred metal of choice has been mostly silver due to its excellent electrical properties and ease in sintering. However, silver comes to be expensive than its counterpart copper. Since copper is prone to oxidation, much focus has been given towards photonic sintering that involves sudden burst of pulsed light at certain energy to sinter the copper Nanoparticles. With this technique, only the printed material gets sintered in a matter of seconds without having a great impact on its substrate, due to which it is also preferred in low temperature applications. With all the knowledge, there is still a large gap in the process side with copper where it is important to look how the print process affects the resolution of the print along with the effect of post-print processes on electrical and mechanical properties. In this paper, a copper Inkjet ink is utilized for understanding the effect of Inkjet print parameters on the ejected droplet and its resolution. Post-print process is also quantified using a photonic sintering equipment for excellent electrical and mechanical properties. To demonstrate the complete process, commercial-off-the-shelf components will also be mounted on the additively printed pads via Inkjet. Statistically, control charting technique will be utilized to understand the capability of the Inkjet process.

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