An investigation on function of current type on solder joint degradation in electronic packages

2020 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Wenhui Cai ◽  
Fei Huang ◽  
Kai Liu ◽  
Mohammed Alaazim
Keyword(s):  
Solder Joint ◽  
Design Methodology ◽  
Solder Joints ◽  
Electronic Devices ◽  
Electronic Packages ◽  
Current Waveform ◽  
Electronic Package ◽  
Content Type ◽  
Power Semiconductor ◽  
Stress Fluctuation

Purpose As in real applications several alternating current (AC) currents may be injected to the electronic devices, this study aims to analyze their effects on the lifetime of the solder joints and, consequently, shed the light on these effects at the design phase for other researchers to consider. Design/methodology/approach In this paper, the authors investigated on current waveform shapes on the performance and reliability of the solder joints in electronic package. Three common and extensively used current shapes in several simulations and experiments were selected to study their effects on the solder joint performance. Findings The results demonstrate a sever thermal swing and stress fluctuation in the solder joint induced in the case of triangle current type because the critical states lack any relaxation time. In fact, the stress intensification in the solder under application of the triangle current type has been shown to contribute to increasing brittle intermetallic compounds. An accelerated increase of on-state voltage of power semiconductor was also observed in under application of the triangle current type. Originality/value The originality of this paper is confirmed.

The size effect on intermetallic microstructure evolution of critical solder joints for flip chip assemblies

2015 ◽  
Vol 27 (4) ◽  
pp. 178-184 ◽  
Author(s):  
Ye Tian ◽  
Justin Chow ◽  
Xi Liu ◽  
Suresh K. Sitaraman
Keyword(s):  
Solder Joint ◽  
Design Methodology ◽  
Growth Process ◽  
Flip Chip ◽  
Solder Bump ◽  
Solder Joints ◽  
Solder Matrix ◽  
Industrial Practice ◽  
Content Type ◽  
Flip Chips

Purpose – The purpose of this paper is to study the intermetallic compound (IMC) thickness, composition and morphology in 100-μm pitch and 200-μm pitch Sn–Ag–Cu (SAC305) flip-chip assemblies after bump reflow and assembly reflow. In particular, emphasis is placed on the effect of solder joint size on the interfacial IMCs between metal pads and solder matrix. Design/methodology/approach – This work uses 100-μm pitch and 200-μm pitch silicon flip chips with nickel (Ni) pads and stand-off height of approximately 45 and 90 μm, respectively, assembled on substrates with copper (Cu) pads. The IMCs evolution in solder joints was investigated during reflow by using 100- and 200-μm pitch flip-chip assemblies. Findings – After bump reflow, the joints size controls the IMC composition and dominant IMC type as well as IMC thickness and also influences the dominant IMC morphology. After assembly reflow, the cross-reaction of the pad metallurgies promotes the dominant IMC transformation and shape coarsened on the Ni pad interface for smaller joints and promotes a great number of new dominate IMC growth on the Ni pad interface in larger joints. On the Cu pad interface, many small voids formed in the IMC in larger joints, but were not observed in smaller joints, combined with the drawing of the IMC growth process. Originality/value – With continued advances in microelectronics, it is anticipated that next-generation microelectronic assemblies will require a reduction of the flip-chip solder bump pitch to 100 μm or less from the current industrial practice of 130 to150 μm. This work shows that as the packaging size reduced with the solder joint interconnection, the solder size becomes an important factor in the intermetallic composition as well as morphology and thickness after reflow.

Effects of Sn-Ag-x leveling layers on the microstructure and mechanical properties of SnBi low-temperature solder joints

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Yang Liu ◽  
Yuxiong Xue ◽  
Min Zhou ◽  
Rongxing Cao ◽  
Xianghua Zeng ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Shear Strength ◽  
Low Temperature ◽  
Solder Joint ◽  
Design Methodology ◽  
Solder Joints ◽  
Fracture Morphology ◽  
Content Type ◽  
Before And After ◽  
Mechanical Performances

Purpose The purpose of this paper is to investigate the effects of Sn-Ag-x leveling layers on the mechanical properties of SnBi solder joints. Four Sn-Ag-x (Sn-3.0Ag-0.5Cu, Sn-0.3Ag-0.7Cu, Sn-0.3Ag-0.7Cu-0.5 Bi-0.05Ni and Sn-3.0Ag-3.0 Bi-3.0In) leveling layers were coated on Cu pads to prepare SnBi/Sn-Ag-x/Cu solder joints. The microstructure, hardness, shear strength and fracture morphology of solder joints before and after aging were studied. Design/methodology/approach The interfacial brittleness of the SnBi low-temperature solder joint is a key problem affecting its reliability. The purpose of this study is to improve the mechanical properties of the SnBi solder joint. Findings Owing to the addition of the leveling layers, the grain size of the ß-Sn phase in the SnBi/Sn-Ag-x/Cu solder joint is significantly larger than that in the SnBi/Cu eutectic solder joint. Meanwhile, the hardness of the solder bulk in the SnBi/Cu solder joint shows a decrease trend because of the addition of the leveling layers. The SnBi/Cu solder joint shows obvious strength drop and interfacial brittle fracture after aging. Through the addition of the Sn-Ag-x layers, the brittle failure caused by aging is effectively suppressed. In addition, the Sn-Ag-x leveling layers improve the shear strength of the SnBi/Cu solder joint after aging. Among them, the SnBi/SACBN/Cu solder joint shows the highest shear strength. Originality/value This work suppresses the interfacial brittleness of the SnBi/Cu solder joint after isothermal aging by adding Sn-Ag-x leveling layers on the Cu pads. It provides a way to improve the mechanical performances of the SnBi solder joint.

Geometric size effect on IMC growth and elements diffusion in Cu/Sn/Cu solder joints

2017 ◽  
Vol 29 (2) ◽  
pp. 85-91 ◽  
Author(s):  
Yan Zhu ◽  
Fenglian Sun
Keyword(s):  
Solder Joint ◽  
Isothermal Aging ◽  
Design Methodology ◽  
Solder Joints ◽  
Control Element ◽  
Correlation Model ◽  
Reflow Process ◽  
Content Type ◽  
Root Cause ◽  
Geometric Size

Purpose The purpose of this paper is to investigate the effect of geometric size on intermetallic compound (IMC) growth and elements diffusion of Cu/Sn/Cu solder joint and establish the correlation model between the thickness of the IMC layer and size of the solder joint on the dozens of microns scale. Design/methodology/approach The sandwich-structured Cu/Sn/Cu solder joints with different gaps between two copper-clad plates (δ) are fabricated using a reflow process. The microstructure and composition of solder joints are observed and analyzed by scanning electron microscopy. Findings After reflow, the thickness of the IMC and Cu concentration in solder layers increase with the reduction of δ from 50, 40, 30, 20 to 10 μm. During isothermal aging, the thickness of the IMC fails to increase according to the traditional parabolic rule due to changes in Cu concentration. The reduction of δ is the root cause of changes in Cu concentration and the growth rule of the IMC layer. A correlation model between the thickness of the IMC layer and δ is established. It is found that the thickness of the IMC layer is the function of aging time and δ. With δ reducing, the main control element of IMC growth transfers from Cu to Sn. Originality/value This paper shows the changes of IMC thickness and elements concentration with the reduction of the size of solder joints on the dozens of microns scale. A correlation model is established to calculate the thickness of the IMC layer during aging.

A computational method for evaluating the damage in a solder joint of an electronic package subjected to thermal loads

2014 ◽  
Vol 31 (3) ◽  
pp. 467-489 ◽  
Author(s):  
Jonas Johansson ◽  
Ilja Belov ◽  
Erland Johnson ◽  
Peter Leisner
Keyword(s):  
Finite Element ◽  
Solder Joint ◽  
Fe Simulation ◽  
Operating Temperature ◽  
Reliability Assessment ◽  
Response Surfaces ◽  
Computational Method ◽  
Electronic Packages ◽  
Electronic Package ◽  
Content Type

Purpose – The purpose of this paper is to introduce a novel computational method to evaluate damage accumulation in a solder joint of an electronic package, when exposed to operating temperature environment. A procedure to implement the method is suggested, and a discussion of the method and its possible applications is provided in the paper. Design/methodology/approach – Methodologically, interpolated response surfaces based on specially designed finite element (FE) simulation runs, are employed to compute a damage metric at regular time intervals of an operating temperature profile. The developed method has been evaluated on a finite-element model of a lead-free PBGA256 package, and accumulated creep strain energy density has been chosen as damage metric. Findings – The method has proven to be two orders of magnitude more computationally efficient compared to FE simulation. A general agreement within 3 percent has been found between the results predicted with the new method, and FE simulations when tested on a number of temperature profiles from an avionic application. The solder joint temperature ranges between +25 and +75°C. Practical implications – The method can be implemented as part of reliability assessment of electronic packages in the design phase. Originality/value – The method enables increased accuracy in thermal fatigue life prediction of solder joints. Combined with other failure mechanisms, it may contribute to the accuracy of reliability assessment of electronic packages.

Accurate composition dependent thermo mechanical lifetime estimation of hour glass type solder joint in electronic assemblies

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Leonid Anatolevich Olenev ◽  
Rafina Rafkatovna Zakieva ◽  
Nina Nikolaevna Smirnova ◽  
Rustem Adamovich Shichiyakh ◽  
Kirill Aleksandrovich Ershov ◽  
...  
Keyword(s):  
Finite Element ◽  
Chemical Composition ◽  
Solder Joint ◽  
Design Methodology ◽  
Lifetime Estimation ◽  
Creep Tests ◽  
Content Type ◽  
Element Simulation ◽  
Glass Type ◽  
Electronic Assemblies

Purpose This study aims to present a more accurate lifetime prediction model considering solder chemical composition. Design/methodology/approach Thermal cycling and standard creep tests as well as finite element simulation were used. Findings The study found lower error in the solder joint lifetime evaluation. The higher the Ag content is, the higher the lifetime is achieved. Originality/value It is confirmed.

Effect of intermetallic compound layer thickness on the shear strength of 1206 chip resistor solder joint

2015 ◽  
Vol 27 (1) ◽  
pp. 52-58 ◽  
Author(s):  
Peter K. Bernasko ◽  
Sabuj Mallik ◽  
G. Takyi
Keyword(s):  
Shear Strength ◽  
Intermetallic Compound ◽  
Solder Joint ◽  
Layer Thickness ◽  
Solder Joints ◽  
Ageing Time ◽  
Circuit Board ◽  
Intermetallic Compound Layer ◽  
Content Type ◽  
Surface Mount

Purpose – The purpose of this paper is to study the effect of intermetallic compound (IMC) layer thickness on the shear strength of surface-mount component 1206 chip resistor solder joints. Design/methodology/approach – To evaluate the shear strength and IMC thickness of the 1206 chip resistor solder joints, the test vehicles were conventionally reflowed for 480 seconds at a peak temperature of 240°C at different isothermal ageing times of 100, 200 and 300 hours. A cross-sectional study was conducted on the reflowed and aged 1206 chip resistor solder joints. The shear strength of the solder joints aged at 100, 200 and 300 hours was measured using a shear tester (Dage-4000PXY bond tester). Findings – It was found that the growth of IMC layer thickness increases as the ageing time increases at a constant temperature of 175°C, which resulted in a reduction of solder joint strength due to its brittle nature. It was also found that the shear strength of the reflowed 1206 chip resistor solder joint was higher than the aged joints. Moreover, it was revealed that the shear strength of the 1206 resistor solder joints aged at 100, 200 and 300 hours was influenced by the ageing reaction times. The results also indicate that an increase in ageing time and temperature does not have much influence on the formation and growth of Kirkendall voids. Research limitations/implications – A proper correlation between shear strength and fracture mode is required. Practical implications – The IMC thickness can be used to predict the shear strength of the component/printed circuit board pad solder joint. Originality/value – The shear strength of the 1206 chip resistor solder joint is a function of ageing time and temperature (°C). Therefore, it is vital to consider the shear strength of the surface-mount chip component in high-temperature electronics.

A study on the effects of electrical and thermal stresses on void formation and migration lifetime of Sn3.0Ag0.5Cu solder joints

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Yanruoyue Li ◽  
Guicui Fu ◽  
Bo Wan ◽  
Zhaoxi Wu ◽  
Xiaojun Yan ◽  
...  
Keyword(s):  
Solder Joint ◽  
Thermal Stresses ◽  
Solder Joints ◽  
Void Formation ◽  
Model Parameters ◽  
Time To Failure ◽  
Current Crowding ◽  
Theoretical Derivation ◽  
Content Type ◽  
And Migration

Purpose The purpose of this study is to investigate the effect of electrical and thermal stresses on the void formation of the Sn3.0Ag0.5Cu (SAC305) lead-free ball grid array (BGA) solder joints and to propose a modified mean-time-to-failure (MTTF) equation when joints are subjected to coupling stress. Design/methodology/approach The samples of the BGA package were subjected to a migration test at different currents and temperatures. Voltage variation was recorded for analysis. Scanning electron microscope and electron back-scattered diffraction were applied to achieve the micromorphological observations. Additionally, the experimental and simulation results were combined to fit the modified model parameters. Findings Voids appeared at the corner of the cathode. The resistance of the daisy chain increased. Two stages of resistance variation were confirmed. The crystal lattice orientation rotated and became consistent and ordered. Electrical and thermal stresses had an impact on the void formation. As the current density and temperature increased, the void increased. The lifetime of the solder joint decreased as the electrical and thermal stresses increased. A modified MTTF model was proposed and its parameters were confirmed by theoretical derivation and test data fitting. Originality/value This study focuses on the effects of coupling stress on the void formation of the SAC305 BGA solder joint. The microstructure and macroscopic performance were studied to identify the effects of different stresses with the use of a variety of analytical methods. The modified MTTF model was constructed for application to SAC305 BGA solder joints. It was found suitable for larger current densities and larger influences of Joule heating and for the welding ball structure with current crowding.

Effect of microwave operating power and reflow time on the microstructure and tensile properties of Sn–3.0Ag–0.5Cu/Cu solder joints

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Mardiana Said ◽  
Muhammad Firdaus Mohd Nazeri ◽  
Nurulakmal Mohd Sharif ◽  
Ahmad Azmin Mohamad
Keyword(s):  
Tensile Properties ◽  
Design Methodology ◽  
Solder Joints ◽  
Reflow Time ◽  
Sac305 Solder ◽  
Cross Sectional ◽  
Content Type ◽  
Solder Reflow ◽  
Microwave Hybrid Heating ◽  
Si Wafer

Purpose This paper aims to investigate the morphology and tensile properties of SAC305 solder alloy under the influence of microwave hybrid heating (MHH) for soldering at different microwave parameters. Design/methodology/approach Si wafer was used as susceptor in MHH for solder reflow. Microwave operating power for medium and high ranging from 40 to 140 s reflow time was used to investigate their effect on the microstructure and strength of SAC305/Cu solder joints. The morphology and elemental composition of the intermetallic compound (IMC) joint were evaluated on the top surface and cross-sectional view. Findings IMC formation transformed from scallop-like to elongated scallop-like structure for medium operating power and scallop-like to planar-like structure for high operating power when exposed to longer reflow time. Compositional and phase analysis confirmed that the observed IMCs consist of Cu6Sn5, Cu3Sn and Ag3Sn. A thinner IMC layer was formed at medium operating power, 80 s (2.4 µm), and high operating power, 40 s (2.5 µm). The ultimate tensile strength at high operating power, 40 s (45.5 MPa), was 44.9% greater than that at medium operating power, 80 s (31.4 MPa). Originality/value Microwave parameters with the influence of Si wafer in MHH in soldering have been developed and optimized. A microwave temperature profile was established to select the appropriate parameter for solder reflow. For this MHH soldering method, the higher operating power and shorter reflow time are preferable.

Morphology transformation on Cu3Sn grains during the formation of full Cu3Sn solder joints in electronic packaging

2018 ◽  
Vol 30 (1) ◽  
pp. 14-25 ◽  
Author(s):  
Peng Yao ◽  
Xiaoyan Li ◽  
Fengyang Jin ◽  
Yang Li
Keyword(s):  
Electronic Packaging ◽  
Design Methodology ◽  
Solder Joints ◽  
Critical Size ◽  
Content Type ◽  
Detailed Mechanism ◽  
Ripening Process ◽  
Research Gap ◽  
Equivalent Method ◽  
First Time

Purpose This paper aims to analyze the morphology transformation on the Cu3Sn grains during the formation of full Cu3Sn solder joints in electronic packaging. Design/methodology/approach Because of the infeasibility of analyzing the morphology transformation intuitively, a novel equivalent method is used. The morphology transformation on the Cu3Sn grains, during the formation of full Cu3Sn solder joints, is regarded as equivalent to the morphology transformation on the Cu3Sn grains derived from the Cu/Sn structures with different Sn thickness. Findings During soldering, the Cu3Sn grains first grew in the fine equiaxial shape in a ripening process until the critical size. Under the critical size, the Cu3Sn grains were changed from the equiaxial shape to the columnar shape. Moreover, the columnar Cu3Sn grains could be divided into different clusters with different growth directions. With the proceeding of soldering, the columnar Cu3Sn grains continued to grow in a feather of the width growing at a greater extent than the length. With the growth of the columnar Cu3Sn grains, adjacent Cu3Sn grains, within each cluster, merged with each other. Next, the merged columnar Cu3Sn grains, within each cluster, continued to merge with each other. Finally, the columnar Cu3Sn grains, within each cluster, merged into one coarse columnar Cu3Sn grain with the formation of full Cu3Sn solder joints. The detailed mechanism, for the very interesting morphology transformation, has been proposed. Originality/value Few researchers focused on the morphology transformation of interfacial phases during the formation of full intermetallic compounds joints. To bridge the research gap, the morphology transformation on the Cu3Sn grains during the formation of full Cu3Sn solder joints has been studied for the first time.

SAC–xTiO2 nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly

2018 ◽  
Vol 30 (1) ◽  
pp. 1-13 ◽  
Author(s):  
Fakhrozi Che Ani ◽  
Azman Jalar ◽  
Abdullah Aziz Saad ◽  
Chu Yee Khor ◽  
Roslina Ismail ◽  
...  
Keyword(s):  
Electron Microscope ◽  
Solder Joint ◽  
Solder Joints ◽  
Ion Beam ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Paste ◽  
Content Type ◽  
X Ray ◽  
Free Solder

Purpose This paper aims to investigate the characteristics of ultra-fine lead-free solder joints reinforced with TiO2 nanoparticles in an electronic assembly. Design/methodology/approach This study focused on the microstructure and quality of solder joints. Various percentages of TiO2 nanoparticles were mixed with a lead-free Sn-3.5Ag-0.7Cu solder paste. This new form of nano-reinforced lead-free solder paste was used to assemble a miniature package consisting of an ultra-fine capacitor on a printed circuit board by means of a reflow soldering process. The microstructure and the fillet height were investigated using a focused ion beam, a high-resolution transmission electron microscope system equipped with an energy dispersive X-ray spectrometer (EDS), and a field emission scanning electron microscope coupled with an EDS and X-ray diffraction machine. Findings The experimental results revealed that the intermetallic compound with the lowest thickness was produced by the nano-reinforced solder with a TiO2 content of 0.05 Wt.%. Increasing the TiO2 content to 0.15 Wt.% led to an improvement in the fillet height. The characteristics of the solder joint fulfilled the reliability requirements of the IPC standards. Practical implications This study provides engineers with a profound understanding of the characteristics of ultra-fine nano-reinforced solder joint packages in the microelectronics industry. Originality/value The findings are expected to provide proper guidelines and references with regard to the manufacture of miniaturized electronic packages. This study also explored the effects of TiO2 on the microstructure and the fillet height of ultra-fine capacitors.

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