Impact of context dependenent variability in CMOS embedded with SiGe on circuit performance & power

Author(s):  
Ashesh Parikh ◽  
Oluwamuyiwa Olubuyide ◽  
Mak Kulkarni
Keyword(s):  
2010 ◽  
Vol E93-C (6) ◽  
pp. 893-904
Author(s):  
Jin SUN ◽  
Kiran POTLURI ◽  
Janet M. WANG

Author(s):  
Nik Ahmad Zainal Abidin ◽  
◽  
Norkharziana Mohd Nayan ◽  
Azuwa Ali ◽  
N. A. Azli ◽  
...  

This research presents a simulation analysis for the AC-DC converter circuit with a different configurations of the array connection of the piezoelectric sensor. The selection of AC-DC converter circuits is full wave bridge rectifier (FWBR), parallel SSHI (P-SSHI) and parallel voltage multiplier (PVM) with array configuration variation in series (S), parallel (P), series-parallel (SP) and parallel-series (PS). The system optimizes with different load configurations ranging from 10 kΩ to 1 MΩ. The best configuration of AC-DC converter with an appropriate array piezoelectric connection producing the optimum output of harvested power is presented. According to the simulation results, the harvested power produced by using P-SSHI converter connected with 3 parallel piezoelectric transducer array was 85.9% higher than for PVM and 15.88% higher than FWBR.


Author(s):  
Pei Y. Tsai ◽  
Junedong Lee ◽  
Paul Ronsheim ◽  
Lindsay Burns ◽  
Richard Murphy ◽  
...  

Abstract A stringent sampling plan is developed to monitor and improve the quality of 300mm SOI (silicon on insulator) starting wafers procured from the suppliers. The ultimate goal is to obtain the defect free wafers for device fabrication and increase yield and circuit performance of the semiconductor integrated circuits. This paper presents various characterization techniques for QC monitor and examples of the typical defects attributed to wafer manufacturing processes.


1993 ◽  
Vol 29 (8) ◽  
pp. 726
Author(s):  
H.-G. Yang ◽  
P. Migliorato ◽  
C. Reita ◽  
S. Fluxman

1995 ◽  
Vol 31 (22) ◽  
pp. 1918-1919
Author(s):  
P.J. Mather ◽  
P. Hallam ◽  
M. Brouwer

Author(s):  
Soumajit Ghosh ◽  
Mitiko Miura-Mattausch ◽  
Takahiro Iizuka ◽  
Hideyuki Kikuchihara ◽  
Hafizur Rahaman ◽  
...  

2019 ◽  
Vol 963 ◽  
pp. 797-800 ◽  
Author(s):  
Ajit Kanale ◽  
Ki Jeong Han ◽  
B. Jayant Baliga ◽  
Subhashish Bhattacharya

The high-temperature switching performance of a 1.2kV SiC JBSFET is compared with a 1.2kV SiC MOSFET using a clamped inductive load switching circuit representing typical H-bridge inverters. The switching losses of the SiC MOSFET are also evaluated with a SiC JBS Diode connected antiparallel to it. Measurements are made with different high-side and low-side device options across a range of case temperatures. The JBSFET is observed to display a reduction in peak turn-on current – up to 18.9% at 150°C and a significantly lesser turn-on switching loss – up to 46.6% at 150°C, compared to the SiC MOSFET.


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