Evaluation of bonding characteristics of thermal compression bonded solder joints via nanoindentation test

2021 ◽  
Author(s):  
Hungsuk You ◽  
Kyung Deuk Min ◽  
Choong-Jae Lee ◽  
Jun-Ho Jang ◽  
Dong-Gil Kang ◽  
...  
Keyword(s):  
Solder Joints ◽  
Nanoindentation Test ◽  
Thermal Compression ◽  
Bonding Characteristics

scholarly journals Suppression of the Growth of Intermetallic Compound Layers with the Addition of Graphene Nano-Sheets to an Epoxy Sn–Ag–Cu Solder on a Cu Substrate

Materials ◽  
2019 ◽  
Vol 12 (6) ◽  
pp. 936 ◽  
Author(s):  
Min-Soo Kang ◽  
Do-Seok Kim ◽  
Young-Eui Shin
Keyword(s):  
Intermetallic Compound ◽  
Isothermal Aging ◽  
Solder Joints ◽  
Solder Paste ◽  
Shear Tests ◽  
Sac305 Solder ◽  
Epoxy Solder ◽  
The Relationship ◽  
Bonding Characteristics ◽  
Preventive Effects

This study investigated the suppression of the growth of the intermetallic compound (IMC) layer that forms between epoxy solder joints and the substrate in electronic packaging by adding graphene nano-sheets (GNSs) to 96.5Sn–3.0Ag–0.5Cu (wt %, SAC305) solder whose bonding characteristics had been strengthened with a polymer. IMC growth was induced in isothermal aging tests at 150 °C, 125 °C and 85 °C for 504 h (21 days). Activation energies were calculated based on the IMC layer thickness, temperature, and time. The activation energy required for the formation of IMCs was 45.5 KJ/mol for the plain epoxy solder, 52.8 KJ/mol for the 0.01%-GNS solder, 62.5 KJ/mol for the 0.05%-GNS solder, and 68.7 KJ/mol for the 0.1%-GNS solder. Thus, the preventive effects were higher for increasing concentrations of GNS in the epoxy solder. In addition, shear tests were employed on the solder joints to analyze the relationship between the addition of GNSs and the bonding characteristics of the solder joints. It was found that the addition of GNSs to epoxy solder weakened the bonding characteristics of the solder, but not critically so because the shear force was higher than for normal solder (i.e., without the addition of epoxy). Thus, the addition of a small amount of GNSs to epoxy solder can suppress the formation of an IMC layer during isothermal aging without significantly weakening the bonding characteristics of the epoxy solder paste.

Nanoindentation Measurements of the Mechanical Properties of Individual Phases Within Lead Free Solder Joints Subjected to Isothermal Aging

2018 ◽  
Author(s):  
Abdullah Fahim ◽  
Sudan Ahmed ◽  
Jeffrey C. Suhling ◽  
Pradeep Lall
Keyword(s):  
Mechanical Properties ◽  
Isothermal Aging ◽  
Solder Joints ◽  
Bulk Solder ◽  
Lead Free ◽  
Nanoindentation Test ◽  
Lead Free Solder ◽  
Free Solder ◽  
The Individual ◽  
Sac Solder

Exposure of lead free solder joints to high temperature isothermal aging conditions leads to microstructure evolution, which mainly includes coarsening of the intermetallic (IMC) phases. In our previous work, it was found that the coarsening of IMCs led to degradation of the overall mechanical properties of the SAC solder composite consisting of β-Sn matrix and IMC particles. However, it is not known whether the isothermal aging changes properties of the individual β-Sn and IMC phases, which could also be affecting to the overall degradation of properties. In this study, the aging induced variations of the mechanical properties of the β-Sn phase, and of Sn-Cu IMC particles in SAC solder joints have been explored using nanoindentation. SAC solder joints extracted from SuperBGA (SBGA) packages were aged for different time intervals (0, 1, 5, 10 days) at T = 125 °C. Nanoindentation test samples were prepared by cross sectioning the solder joints, and then molding them in epoxy and polishing them to prepare the joint surfaces for nanoindentation. Multiple β-Sn grains were identified in joints using optical polarized microscopy and IMCs were also observed. Individual β-Sn grains and IMC particles were then indented at room temperature to measure their mechanical properties (elastic modulus and hardness) and time dependent creep deformations. Properties measured at different aging time were then compared to explore aging induced degradations of the individual phases. The properties of the individual phases did not show significant degradation. Thus, IMC coarsening is the primary reason for the degradation of bulk solder joint properties, and changes of the properties of the individual phases making up the lead free solder material are negligible.

Predictive Failure Analysis of Solder Joints with Simultaneous High Speed EBSD and EDS

2018 ◽  
Author(s):  
J. Lindsay ◽  
P. Trimby ◽  
J. Goulden ◽  
S. McCracken ◽  
R. Andrews
Keyword(s):  
High Speed ◽  
Solder Joints ◽  
Phase Distribution ◽  
Bond Failure ◽  
Microstructural Parameters ◽  
Snpb Solder ◽  
Grain Orientations ◽  
Accelerated Thermal Cycling ◽  
The Relationship ◽  
Opening Up

Abstract The results presented here show how high-speed simultaneous EBSD and EDS can be used to characterize the essential microstructural parameters in SnPb solder joints with high resolution and precision. Analyses of both intact and failed solder joints have been carried out. Regions of strain localization that are not apparent from the Sn and Pb phase distribution are identified in the intact bond, providing key insights into the mechanism of potential bond failure. In addition, EBSD provides a wealth of quantitative detail such as the relationship between parent Sn grain orientations and Pb coarsening, the morphology and distribution of IMCs on a sub-micron scale and accurate grain size information for all phases within the joint. Such analyses enable a better understanding of the microstructural developments leading up to failure, opening up the possibility of improved accelerated thermal cycling (ATC) testing and better quality control.

Interfacial Bonding Behavior of Stainless Steel / Carbon Steel in Cold Rolling Process

2020 ◽  
Vol 982 ◽  
pp. 121-127
Author(s):  
Shuo Li ◽  
Qing Dong Zhang
Keyword(s):  
Stainless Steel ◽  
Carbon Steel ◽  
Great Influence ◽  
Rolling Process ◽  
Interfacial Bonding ◽  
304 Stainless Steel ◽  
Nanoindentation Test ◽  
Real Contact Area ◽  
Steel Matrix ◽  
Bonding Quality

A cylindrical indenter was designed to simulate the roller and 304 stainless steel / Q235A carbon steel plate with different roughness were bonded together. The interfacial bonding behavior was investigated by SEM, ultrasonic “C” scanning detection and nanoindentation test. The result reveal that with the increase of contact pressure between interfaces, the atoms of dissimilar metals begin to diffuse across interfaces in some regions, then form island-like bonding regions, and eventually extend to the whole interface. There are no obvious cracks on the surface of stainless steel and carbon steel after deformation. The cold roll-bonding mechanism of stainless steel and carbon steel is that elements on both sides of the interface diffuse and form a shallow diffusion layer under pressure to ensure the joint strength, and the joint bonding strength is greater than the strength of carbon steel matrix. In addition, the surface morphology of base metal has a great influence on the interfacial bonding quality. The higher surface roughness values increases the hardening degree of rough peak, which makes real contact area difficult to increase and reduce the interfacial bonding quality.

Effect of Bi and In on Microstructure Formation in Sn-3Ag-3Bi-3In/Cu and /Ni Solder Joints

2016 ◽  
Vol 700 ◽  
pp. 142-151 ◽  
Author(s):  
Sergey A. Belyakov ◽  
Christopher M. Gourlay
Keyword(s):  
Solid Solution ◽  
Phase Equilibria ◽  
Ternary Compound ◽  
Fine Particles ◽  
Solder Joints ◽  
Primary Phase ◽  
Significant Fraction ◽  
Microstructure Formation ◽  
Five Phases

Sn-3Ag-3Bi-3In solder has been investigated to improve the understanding of microstructure formation in this solder during solidification and soldering to Cu and Ni substrates. The as-solidified microstructures of Sn-3Ag-3Bi-3In samples were found to consist of a significant fraction of βSn dendrites with a complex eutectic between the dendrites. In total five phases were observed to form during solidification: βSn, Ag3Sn, Bi, ζAg and a “Sn-In-Bi” ternary compound. Soldering of Sn-3Ag-3Bi-3In to substrates changed the phase equilibria in the system and caused the formation of additional phases: Cu6Sn5 during soldering to Cu and Ni3Sn4 and metastable NiSn4 during soldering to Ni. It is shown that metastable NiSn4 forms as a primary phase in a complex 5-component Sn-3Ag-3Bi-3In-Ni system. In and Bi were detected in solid solution in the βSn matrix in amounts of ~1.5-2at% and ~1.2at% respectively. Bi also existed as fine particles of two distinct types. (i): sub-micron (<500nm) coral-like particles and (ii) facetted particles measuring up to 7-8 μm.

Site preference and atomic ordering in the ternary Rh5Ga2As: first-principles calculations

2021 ◽  
Vol 0 (0) ◽  
Author(s):  
Nilanjan Roy ◽  
Sucharita Giri ◽  
Harshit ◽  
Partha P. Jana
Keyword(s):  
Total Energy ◽  
First Principles ◽  
Density Functional ◽  
Structure Type ◽  
Site Preference ◽  
X Ray Diffraction ◽  
Atomic Ordering ◽  
Functional Theory ◽  
The Stability ◽  
Bonding Characteristics

Abstract The site preference and atomic ordering of the ternary Rh5Ga2As have been investigated using first-principles density functional theory (DFT). An interesting atomic ordering of two neighboring elements Ga and As reported in the structure of Rh5Ga2As by X-ray diffraction data only is confirmed by first-principles total-energy calculations. The previously reported experimental model with Ga/As ordering is indeed the most stable in the structure of Rh5Ga2As. The calculation detected that there is an obvious trend concerning the influence of the heteroatomic Rh–Ga/As contacts on the calculated total energy. Interestingly, the orderly distribution of As and Ga that is found in the binary GaAs (Zinc-blende structure type), retained to ternary Rh5Ga2As. The density of states (DOS) and Crystal Orbital Hamiltonian Population (COHP) are calculated to enlighten the stability and bonding characteristics in the structure of Rh5Ga2As. The bonding analysis also confirms that Rh–Ga/As short contacts are the major driving force towards the overall stability of the compound.

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