Experimental system for analysing the combined loading and failure modes of solder joints in electronic packaging

2012 ◽  
Author(s):  
Krystian Jankowski ◽  
Artur Wymyslowski ◽  
Didier Chicot
Keyword(s):  
Electronic Packaging ◽  
Failure Modes ◽  
Solder Joints ◽  
Experimental System ◽  
Combined Loading

scholarly journals Experimental Study on the Reliability of PBGA Electronic Packaging under Shock Loading

Electronics ◽  
2019 ◽  
Vol 8 (3) ◽  
pp. 279 ◽  
Author(s):  
Jiang Shao ◽  
Hongjian Zhang ◽  
Bo Chen
Keyword(s):  
Fatigue Life ◽  
Electronic Packaging ◽  
Failure Modes ◽  
Solder Joints ◽  
Optical Microscope ◽  
Micro Cracks ◽  
Plastic Ball ◽  
Plastic Ball Grid Array ◽  
Aeronautical Industry ◽  
The Relationship

Plastic Ball Grid Array (PBGA) one of the most important electronic packaging methods, is widely used in aeronautical industry field. According to the JEDEC standard, shock tests of PBGA assemblies are conducted under different loading conditions. Several important parameters, such as the fatigue life of PBGA assemblies, the relationship between solder joint positions and fatigue life, the relationship between strain energy density and fatigue life, are analyzed based on experiment results. The failure modes of PBGA assemblies are studied by optical microscope (OM). The results show that during the shock tests, the strains of the solder joints near the center of the specimen are larger than other positions, and these solder joints are prone to form micro cracks. With the increase of the shock times, these micro cracks extend rapidly which will eventually cause the failure of the PBGA electronic packaging.

scholarly journals Design and analysis of concrete-filled tubular flange girders under combined loading

2021 ◽  
pp. 136943322110015
Author(s):  
Rana Al-Dujele ◽  
Katherine Ann Cashell
Keyword(s):  
Finite Element ◽  
Axial Force ◽  
Failure Modes ◽  
Numerical Study ◽  
Combined Loading ◽  
Torsional Stiffness ◽  
Fe Model ◽  
Combined Effects ◽  
Element Analysis ◽  
Hollow Section

This paper is concerned with the behaviour of concrete-filled tubular flange girders (CFTFGs) under the combination of bending and tensile axial force. CFTFG is a relatively new structural solution comprising a steel beam in which the compression flange plate is replaced with a concrete-filled hollow section to create an efficient and effective load-carrying solution. These members have very high torsional stiffness and lateral torsional buckling strength in comparison with conventional steel I-girders of similar depth, width and steel weight and are there-fore capable of carrying very heavy loads over long spans. Current design codes do not explicitly include guidance for the design of these members, which are asymmetric in nature under the combined effects of tension and bending. The current paper presents a numerical study into the behaviour of CFTFGs under the combined effects of positive bending and axial tension. The study includes different loading combinations and the associated failure modes are identified and discussed. To facilitate this study, a finite element (FE) model is developed using the ABAQUS software which is capable of capturing both the geometric and material nonlinearities of the behaviour. Based on the results of finite element analysis, the moment–axial force interaction relationship is presented and a simplified equation is proposed for the design of CFTFGs under combined bending and tensile axial force.

Failure modes and FEM analysis of power electronic packaging

2002 ◽  
Vol 38 (7) ◽  
pp. 601-612 ◽  
Author(s):  
Hua Ye ◽  
Minghui Lin ◽  
Cemal Basaran
Keyword(s):  
Electronic Packaging ◽  
Failure Modes ◽  
Fem Analysis ◽  
Power Electronic

A Validated Methodology to Establish Structural Capacities for Subsea Connector Families

2021 ◽  
Author(s):  
Michael John Stephens ◽  
Simon John Roberts ◽  
Derek James Bennet
Keyword(s):  
Failure Modes ◽  
Bending Moment ◽  
Full Scale ◽  
Structural Testing ◽  
Combined Loading ◽  
Test Sequence ◽  
Fea Model ◽  
Analysis Methodology ◽  
Industry Standards ◽  
Physical Testing

Abstract Understanding the structural limits of subsea connectors used in offshore environments is critical to ensure safe operations. The latest industry standards establish the requirement for physical testing to validate analysis methodologies for connector designs. In this paper, an analysis methodology, compliant with the latest API 17G standard, is presented for calculating structural capacities of non-preloaded connectors. The methodology has been developed for complex combined loading scenarios and validated using full-scale physical testing for different connector families. Detailed 3-D, non-linear, finite element models were developed for three different non-preloaded connections, which consisted of threaded and load shoulder connectors. A comprehensive set of combined tension and bending moment structural capacities at normal, extreme and survival conditions were calculated for each connection. The calculated capacities were validated for each connection by performing a test sequence using full-scale structural testing. A final tension or bending to failure test was also completed for each test connection to validate the physical failure mode, exceeding the latest API 17G requirements. For all connections tested, capacities calculated using the methodology were validated from the successful completion of the test sequences. The physical failure modes of the test connections also matched the predicted failure modes from the FEA, and the tensile or bending moment loading at physical collapse exceeded that predicted by the global collapse of the FEA model. Using the validated approach described in this paper significantly reduces the requirement of physical testing for connector families, establishing confidence in the structural limits that are critical for safe operations.

HPHT Subsea Connector Verification and Validation Using an API 17TR8 Methodology

2021 ◽  
Author(s):  
Barry Stewart ◽  
Sam Kwok Lun Lee
Keyword(s):  
Failure Modes ◽  
Production Systems ◽  
Three Dimensional ◽  
Full Scale ◽  
Verification And Validation ◽  
Combined Loading ◽  
Load Path ◽  
Capacity Curves ◽  
Industry Standards ◽  
Full Scale Tests

Abstract Wellhead connectors form a critical part of subsea tree production systems. Their location in the riser load path means that they are subjected to high levels of bending and tension loading in addition to internal pressure and cyclic loading. As more fields continue to be discovered and developed that are defined as High Pressure and/or High Temperature (HPHT) these loading conditions become even more arduous. In order to ensure the integrity of HPHT components, industry requirements for components are setout in API 17TR8. This technical report provides a design verification methodology for HPHT products and some requirements for validation testing. The methodology provides detail on the assessment of static structural and cyclic capacities but less detail on how to assess the functional and serviceability criteria for wellhead connectors. Similarly, API 17TR8 does not include prescriptive validation requirements for wellhead connectors and refers back to historical methods. This paper describes a practical application of the API 17TR8 methodology to the development of a 20k HPHT connector and how it was implemented to verify and validate the connector design through full scale tests to failure. A methodology was developed to meet the requirements of the relevant industry standards and applied to the connector to develop capacity charts for static combined loading. Verification was carried out on three dimensional 180° FEA models to ensure all non axi-symmetric loading is accurately captured. Connector capacities are defined based on API 17TR8 criteria with elastic plastic analysis (i.e. collapse load, local failure and ratcheting), functionality/serviceability criteria defined through a FMECA review and also including API STD 17G criteria including failure modes such as lock/unlock functionality, fracture based failure, mechanical disengagement, leakage and preload exceedance. These capacities are validated through full scale testing based on the requirements of API 17TR7 and API STD 17G with combined loading applied to the Normal, Extreme and Survival capacity curves (as defined by "as-built" FEA using actual material properties). Various test parameters such as strain gauge data, hub separation data, displacements, etc. were recorded and correlated to FEA prediction to prove the validity of the methodology. Further validation was carried out by applying a combined load up to the FEA predicted failure to confirm the design margins of the connector. Post-test review was carried out to review the suitability of the requirements set out in API 17TR8 and API STD 17G for the verification and validation of subsea connectors. The results build on previous test results to validate the effectiveness of the API 17TR8 code for verification and validation of connectors. The results show that real margins between failure of the connector and rated loads are higher than those defined in API 17TR8 and show that the methodology can be conservative.

scholarly journals Study on Chip Reliability Modeling Based on Mutually Dependent Competing Failure of Solder Joints in Different Failure Modes

IEEE Access ◽  
2020 ◽  
Vol 8 ◽  
pp. 204695-204708
Author(s):  
Longteng Li ◽  
Bo Jing ◽  
Jiaxing Hu ◽  
Xiaoxuan Jiao ◽  
Jinxin Pan ◽  
...  
Keyword(s):  
Failure Modes ◽  
Solder Joints ◽  
Reliability Modeling ◽  
On Chip

Morphology transformation on Cu3Sn grains during the formation of full Cu3Sn solder joints in electronic packaging

2018 ◽  
Vol 30 (1) ◽  
pp. 14-25 ◽  
Author(s):  
Peng Yao ◽  
Xiaoyan Li ◽  
Fengyang Jin ◽  
Yang Li
Keyword(s):  
Electronic Packaging ◽  
Design Methodology ◽  
Solder Joints ◽  
Critical Size ◽  
Content Type ◽  
Detailed Mechanism ◽  
Ripening Process ◽  
Research Gap ◽  
Equivalent Method ◽  
First Time

Purpose This paper aims to analyze the morphology transformation on the Cu3Sn grains during the formation of full Cu3Sn solder joints in electronic packaging. Design/methodology/approach Because of the infeasibility of analyzing the morphology transformation intuitively, a novel equivalent method is used. The morphology transformation on the Cu3Sn grains, during the formation of full Cu3Sn solder joints, is regarded as equivalent to the morphology transformation on the Cu3Sn grains derived from the Cu/Sn structures with different Sn thickness. Findings During soldering, the Cu3Sn grains first grew in the fine equiaxial shape in a ripening process until the critical size. Under the critical size, the Cu3Sn grains were changed from the equiaxial shape to the columnar shape. Moreover, the columnar Cu3Sn grains could be divided into different clusters with different growth directions. With the proceeding of soldering, the columnar Cu3Sn grains continued to grow in a feather of the width growing at a greater extent than the length. With the growth of the columnar Cu3Sn grains, adjacent Cu3Sn grains, within each cluster, merged with each other. Next, the merged columnar Cu3Sn grains, within each cluster, continued to merge with each other. Finally, the columnar Cu3Sn grains, within each cluster, merged into one coarse columnar Cu3Sn grain with the formation of full Cu3Sn solder joints. The detailed mechanism, for the very interesting morphology transformation, has been proposed. Originality/value Few researchers focused on the morphology transformation of interfacial phases during the formation of full intermetallic compounds joints. To bridge the research gap, the morphology transformation on the Cu3Sn grains during the formation of full Cu3Sn solder joints has been studied for the first time.

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