scholarly journals Experimental Study on the Reliability of PBGA Electronic Packaging under Shock Loading

Electronics ◽  
2019 ◽  
Vol 8 (3) ◽  
pp. 279 ◽  
Author(s):  
Jiang Shao ◽  
Hongjian Zhang ◽  
Bo Chen
Keyword(s):  
Fatigue Life ◽  
Electronic Packaging ◽  
Failure Modes ◽  
Solder Joints ◽  
Optical Microscope ◽  
Micro Cracks ◽  
Plastic Ball ◽  
Plastic Ball Grid Array ◽  
Aeronautical Industry ◽  
The Relationship

Plastic Ball Grid Array (PBGA) one of the most important electronic packaging methods, is widely used in aeronautical industry field. According to the JEDEC standard, shock tests of PBGA assemblies are conducted under different loading conditions. Several important parameters, such as the fatigue life of PBGA assemblies, the relationship between solder joint positions and fatigue life, the relationship between strain energy density and fatigue life, are analyzed based on experiment results. The failure modes of PBGA assemblies are studied by optical microscope (OM). The results show that during the shock tests, the strains of the solder joints near the center of the specimen are larger than other positions, and these solder joints are prone to form micro cracks. With the increase of the shock times, these micro cracks extend rapidly which will eventually cause the failure of the PBGA electronic packaging.

A Systematic Approach for Determining the Thermal Fatigue-Life of Plastic Ball Grid Array (PBGA) Lead-Free Solder Joints

2005 ◽  
Author(s):  
John Lau ◽  
Ricky Lee ◽  
Walter Dauksher ◽  
Dongkai Shangguan ◽  
Fubin Song ◽  
...  
Keyword(s):  
Fatigue Life ◽  
Thermal Fatigue ◽  
Solder Joints ◽  
Ball Grid Array ◽  
Lead Free ◽  
Lead Free Solder ◽  
Thermal Fatigue Life ◽  
Plastic Ball ◽  
Plastic Ball Grid Array ◽  
Free Solder

Reliability of plastic ball grid array (PBGA) SnAgCu lead-free solder joints is investigated. Emphasis is placed on the design for reliability (DFR) of lead-free solder joints. In particular, the thermal-fatigue life of the lead-free solder joints of a PBGA package assembly is predicted and compared with thermal cycling test results.

Thermal Fatigue-Life Prediction of Lead-Free Solder Joints

2004 ◽  
Author(s):  
John Lau ◽  
Ricky Lee ◽  
Dongkai Shangguan
Keyword(s):  
Fatigue Life ◽  
Thermal Fatigue ◽  
Life Prediction ◽  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Thermal Fatigue Life ◽  
Plastic Ball ◽  
Plastic Ball Grid Array ◽  
Free Solder

Reliability of lead-free solder joints is investigated. Emphasis is placed on the design for reliability (DFR) of lead-free solder joints. In particular, the thermal-fatigue life of the lead-free solder joints of a plastic ball grid array (PBGA) package assembly is predicted and discussed.

Metal Surface Fatigue Detection Using Nonlinear Ultrasonic

2014 ◽  
Vol 510 ◽  
pp. 156-162 ◽  
Author(s):  
Hong Juan Yan ◽  
Chun Guang Xu ◽  
Qi Lin ◽  
Hai Chao Cai
Keyword(s):  
Fatigue Life ◽  
Nonlinear Coefficient ◽  
304 Stainless Steel ◽  
2024 Aluminum Alloy ◽  
Surface Fatigue ◽  
Micro Cracks ◽  
Nonlinear Ultrasonic ◽  
Ultrasonic Propagation ◽  
Fatigue Detection ◽  
The Relationship

Based on theory of ultrasonic nondestructive testing on surface fatigue damage of metal components, the wave law of ultrasonic nonlinearity caused by fatigue is studied. When there are lattice defects in metal material, second-order nonlinear coefficient β changes during ultrasonic propagation. According to the point, the system of nonlinear ultrasonic testing is build. The change trends of harmonic amplitudes and ultrasonic coefficients are measured during fatigue bending testing of materials such as 45 steel, 2024 aluminum alloy and 304 stainless steel. The results shows: in elastic phase, the ratios of harmonic and fundamental waves monotonically increase with fatigue life, and in plastic phase, deformations appear and micro-cracks expand into macro-cracks in materials, the ratios firstly decrease and then increase with fatigue life. However the quadratic sums of nonlinear coefficient are approximately linear with the fatigue life. Therefore, when the relationship between the quadratic sums and fatigue life is known, it can be used to characterize fatigue state of metal materials.

Finite Element Analysis on the Ability of Solder Joints to Resist Thermal Fatigue

2010 ◽  
Vol 118-120 ◽  
pp. 738-742
Author(s):  
Xue Xia Yang ◽  
Yu Zhang ◽  
Xue Feng Shu
Keyword(s):  
Finite Element ◽  
Thermal Fatigue ◽  
Solder Joints ◽  
Strain Response ◽  
Shape Parameters ◽  
Element Analysis ◽  
Finite Element Software ◽  
Plastic Ball ◽  
Plastic Ball Grid Array ◽  
Fatigue Characteristics

The purpose of this paper is to study the ability of solder joints to resist thermal fatigue. 2D simplified models of Plastic Ball Grid Array package (PBGA) structures with ten different solder joints obtained from surface mount experiment are established by finite element software, then stress-strain response of solder joints subjected to the thermal cycle load are calculated. And the effects of shape parameters of solder joints on the ability to resist thermal fatigue are discussed. Results indicate that for the same material and volume solders, the solder joints which have higher height, smaller diameter and contact angle have a stronger ability against thermal fatigue, and that the thermal fatigue characteristics are also greatly influenced by the solder outlines. Comparing with SP solder joints, LF solder joints have stronger ability against thermal fatigue.

Effect of high-frequency PCB laminate on thermal cycling behavior of electronic packaging structures

2022 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Lijuan Huang ◽  
Zhenghu Zhu ◽  
Hiarui Wu ◽  
Xu Long
Keyword(s):  
Fatigue Life ◽  
Thermal Cycling ◽  
Electronic Packaging ◽  
High Frequency ◽  
Solder Joints ◽  
Fatigue Cracks ◽  
Cyclic Stress ◽  
Content Type ◽  
Stress States ◽  
Packaging Structure

PurposeAs the solution to improve fatigue life and mechanical reliability of packaging structure, the material selection in PCB stack-up and partitioning design on PCB to eliminate the electromagnetic interference by keeping all circuit functions separate are suggested to be optimized from the mechanical stress point of view.Design/methodology/approachThe present paper investigated the effect of RO4350B and RT5880 printed circuit board (PCB) laminates on fatigue life of the QFN (quad flat no-lead) packaging structure for high-frequency applications. During accelerated thermal cycling between −50 °C and 100 °C, the mismatched coefficients of thermal expansion (CTE) between packaging and PCB materials, initial PCB warping deformation and locally concentrated stress states significantly affected the fatigue life of the packaging structure. The intermetallics layer and mechanical strength of solder joints were examined to ensure the satisfactorily soldering quality prior to the thermal cycling process. The failure mechanism was investigated by the metallographic observations using a scanning electron microscope.FindingsTypical fatigue behavior was revealed by grain coarsening due to cyclic stress, while at critical locations of packaging structures, the crack propagations were confirmed to be accompanied with coarsened grains by dye penetration tests. It is confirmed that the cyclic stress induced fatigue deformation is dominant in the deformation history of both PCB laminates. Due to the greater CTE differences in the RT5880 PCB laminate with those of the packaging materials, the thermally induced strains among different layered materials were more mismatched and led to the initiation and propagation of fatigue cracks in solder joints subjected to more severe stress states.Originality/valueIn addition to the electrical insulation and thermal dissipation, electronic packaging structures play a key role in mechanical connections between IC chips and PCB.

The Effect of Stencil Printing Optimization on Reliability of CBGA and PBGA Solder Joints

1998 ◽  
Vol 120 (1) ◽  
pp. 54-60 ◽  
Author(s):  
Y. Li ◽  
R. L. Mahajan ◽  
G. Subbarayan
Keyword(s):  
Fatigue Life ◽  
Solder Joints ◽  
Maximum Strain ◽  
Stencil Printing ◽  
Eutectic Solder ◽  
Printing Process ◽  
Ceramic Ball ◽  
Ball Grid Arrays ◽  
Solder Volume ◽  
Plastic Ball

As a follow-up and conclusion to previous work in stencil printing process modeling and optimization (Li et al., 1996), we investigate the effect of stencil printing optimization on the reliability of the ceramic and plastic ball grid arrays. For ceramic ball grid arrays, the eutectic solder fillet shape is calculated using a series of simple mathematical equations. The thermal strain distributions within the solder joints after two cycles of accelerated thermal cycling test are estimated using three-dimensional finite element models. The modified Coffin-Manson relationship is applied to calculate the mean fatigue lives of the solder joints. The results reveal that an optimized stencil printing process significantly reduces variation in the fatigue life of ceramic ball grid arrays. The results also show that the fatigue life of ceramic ball grid arrays is very sensitive to the card-side solder volume. The maximum strain region shifts from the card-side eutectic solder to the module side as the card-side eutectic solder volume increases. This shift in maximum strain suggests that there exists an optimum ratio between the card-side solder volume and the module-side solder volume for the reliability of a given ceramic ball grid array design. The implications of this for the package developers and users are discussed. The calculations indicate that the fatigue life of plastic ball grid arrays is almost insensitive to the card-side solder volume.

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