Investigation of Contact Angles of SnAgCu Solder Paste Mixed with Graphene Oxide Using Digital Holography Technique

2021 ◽  
Author(s):  
Kavisra Jongjinakool ◽  
Tawipon Prakobsang ◽  
Suwan Plaipichit ◽  
Kannachai Kanlayasiri ◽  
Mettaya Kitiwan ◽  
...  
Keyword(s):  
Graphene Oxide ◽  
Digital Holography ◽  
Contact Angles ◽  
Solder Paste ◽  
Snagcu Solder

Contact Angle Measurement of Melting SnAgCu Solder Paste Mix with Carbon Allotropes Using In-Line Digital Holography Technique

2021 ◽  
Vol 904 ◽  
pp. 369-374
Author(s):  
Mamart Wikatsama ◽  
Nuttakrit Somdock ◽  
Chantira Boonsri ◽  
Suwan Plaipichit ◽  
Prathan Buranasiri ◽  
...  
Keyword(s):  
Contact Angle ◽  
Melting Temperature ◽  
Digital Holography ◽  
Graphene Quantum Dots ◽  
Angular Spectrum ◽  
Angle Measurement ◽  
Interfacial Microstructure ◽  
Solder Paste ◽  
Snagcu Solder ◽  
Carbon Allotropes

In this research we investigated the contact angle of commercial SnAgCu solder paste mixing with some carbon allotropes such as graphite, graphene quantum dots, and fullerene of varying concentrations with melting temperature, wettability, interfacial microstructure. The wettability was assessed in terms of the contact angle. The in-line digital holography was used for determining the contact angle and morphological of samples at each temperature which the samples have been heating from room temperature until the melting temperature. In the experiment, only one beam was used as the object and reference beams which recorded by a CMOS camera. The recorded image was reconstructed by the angular spectrum digital holography numerical programing. Using the reconstructed images of our results, the shape and contact angle of solder pastes can be investigated.

A study of SnAgCu solder paste transfer efficiency and effects of optimal reflow profile on solder deposits

2011 ◽  
Vol 88 (7) ◽  
pp. 1610-1617 ◽  
Author(s):  
E.H. Amalu ◽  
W.K. Lau ◽  
N.N. Ekere ◽  
R.S. Bhatti ◽  
S. Mallik ◽  
...  
Keyword(s):  
Transfer Efficiency ◽  
Solder Paste ◽  
Snagcu Solder

Wetting properties of Nd:YAG laser treated copper by SAC solders

2017 ◽  
Vol 29 (2) ◽  
pp. 69-74 ◽  
Author(s):  
József Hlinka ◽  
Miklós Berczeli ◽  
Gábor Buza ◽  
Zoltán Weltsch
Keyword(s):  
Surface Treatment ◽  
Laser Treatment ◽  
Contact Angles ◽  
Laser Surface ◽  
Lead Free Solder ◽  
Solder Paste ◽  
Laser Surface Treatment ◽  
Content Type ◽  
Wetting Properties ◽  
Free Solder

Purpose This paper aims to discuss the effect of surface treatment on the wettability between copper and a lead-free solder paste. The industrial applications of laser technologies are increasing constantly. A specific laser treatment can modify the surface energy of copper and affect the wetting properties. Design/methodology/approach The surfaces of copper plates were treated using an Nd:YAG laser with varying laser powers. After laser surface treatment, wetting experiments were performed between the copper plates and SAC305 lead-free solder paste. The effect of laser treatment on copper surface was analysed using optical microscopy and scanning electron microscopy (SEM). Findings The experimental results showed that the wetting contact angles changed with the variation in laser power. Furthermore, it means that the surface energy of copper plates was changed by the laser treatment. The results demonstrated that the contact angles also changed when a different soldering paste was used. Originality/value Previous laser surface treatment can be a possible way to optimize the wettability between solders and substrates and to increase the quality of the soldered joints.

An Investigation of the Lead-Free Surface Mount Soldering Process: Solder Joint Evaluation and Process Optimisation

2004 ◽  
Author(s):  
Claire Ryan ◽  
Jeff M. Punch ◽  
Bryan Rodgers ◽  
Greg Heaslip ◽  
Shane O’Neill ◽  
...  
Keyword(s):  
Screen Printing ◽  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Paste ◽  
Surface Mount ◽  
Snagcu Solder ◽  
Soldering Process ◽  
Free Process ◽  
Free Solder

A European Union ban on lead in most electrical and electronic equipment will be imposed as of July 1st 2006. The ban, along with market pressures, means that manufacturers must transfer from a tin-lead soldering process to a lead-free process. In this paper the implications on the surface mount (SMT) soldering process are presented. A set of experiments was conducted to investigate the screen-printing and reflow steps of the SMT process using a tin-silver-copper (95.5Sn3.8Ag0.7Cu) solder and a baseline of standard tin-lead (63Sn37Pb). 10×10 arrays of micro Ball Grid Array (micro-BGA) components mounted on 8-layer FR4 printed wiring boards (PWBs) were used. The screen-printing experiment addressed the deposition of the solder paste on the board. The parameters used in the investigation were print speed, squeegee pressure, snap-off distance, separation speed and cleaning interval, with the responses being measurements of paste height and volume. Optimum screen-printer settings were determined which give adequate paste volume and height and a good print definition. The reflow experiment investigated the following parameters of the temperature profile: preheat, soak, peak and cool down temperatures, and conveyor speed. The resulting solder joints were evaluated using cross-section analysis and x-ray techniques in order to determine the presence of defects. A mechanical fatigue test was also carried out in order to compare the strength of the solder joints. The overall quality of the lead-free solder joints was determined from these tests and compared to that of tin-lead. The outcome is a set of manufacturing guidelines for transferring to lead-free solder including optimum screen-printer and reflow oven settings for use with an SnAgCu solder.

Preparation, characterization, and chemical-induced hydrophobicity of thermostable amine-modified graphene oxide

RSC Advances ◽  
2015 ◽  
Vol 5 (127) ◽  
pp. 105393-105399 ◽  
Author(s):  
Jing Wang ◽  
Hong-Zhang Geng ◽  
Zhi-Jia Luo ◽  
Songting Zhang ◽  
Jinqiu Zhang ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Graphene Oxide ◽  
Small Molecule ◽  
Contact Angles ◽  
Oxide Surfaces ◽  
Graphene Oxides ◽  
Excellent Thermal Stability ◽  
Modified Graphene Oxide ◽  
Modified Graphene

A small molecule was grafted onto the graphene oxide surfaces using two different approaches and the obtained amine-modified graphene oxides have excellent thermal stability and significantly enhanced water/air contact angles.

High Reliability No-Clean Solder Paste for Designs where Flux Cannot be Dried

2015 ◽  
Vol 2015 (1) ◽  
pp. 000434-000442
Author(s):  
Fen Chen ◽  
Ning-Cheng Lee
Keyword(s):  
Cost Reduction ◽  
High Reliability ◽  
Solder Paste ◽  
Reflow Process ◽  
Snagcu Solder ◽  
Wetting Ability ◽  
Electromagnetic Shield ◽  
Halogen Free ◽  
The Cost ◽  
Assembly Performance

The miniaturization trend is driving industry to adopting low standoff components or components in cavity. The cost reduction pressure is pushing telecommunication industry to combine assembly of components and electromagnetic shield in one single reflow process. As a result, the flux outgassing/drying is getting very difficult for devices due to poor venting channel. This resulted in insufficiently dried/burnt-off flux residue. For a properly formulated flux, the remaining flux activity posed no issue in a dried flux residue for no-clean process. However, when venting channel is blocked, not only solvents remain, but also activators could not be burnt off. The presence of solvents allows mobility of active ingredients and the associated corrosion, thus poses a major threat to the reliability. In this work, a new halogen-free no-clean SnAgCu solder paste, 33-76-1, has been developed. This solder paste exhibited SIR value above the IPC spec 100 MΩ without any dendrite formation, even with a wet flux residue on the comb pattern. The wet flux residue was caused by covering the comb pattern with 10 mm × 10 mm glass slide during reflow and SIR testing in order to mimic the poorly vented low standoff components. Paste 33-76-1 also showed very good SMT assembly performance, including voiding of QFN and HIP resistance. The wetting ability of paste 33-76-1 was very good under nitrogen. For air reflow, 33-76-1 still matched paste C which is widely accepted by industry for air reflow process. The above good performance on both non-corrosion with wet flux residue and robust SMT process can only be accomplished through a breakthrough in flux technology.

Controlling the Superior Reliability of Lead Free Assemblies With Short Standoff Height Through Design and Materials Selection

2012 ◽  
Author(s):  
B. Arfaei ◽  
L. Wentlent ◽  
S. Joshi ◽  
M. Anselm ◽  
P. Borgesen
Keyword(s):  
Solder Joint ◽  
Electron Backscatter Diffraction ◽  
Grain Morphology ◽  
Superior Performance ◽  
Solder Paste ◽  
Materials Selection ◽  
Sac305 Solder ◽  
Solidification Temperature ◽  
Snagcu Solder ◽  
Systematic Effects

We have recently demonstrated a significantly longer life in accelerated thermal cycling for Land Grid Arrays (LGAs) assembled only with SAC305 solder paste than for the corresponding SAC305 based BGA assemblies. This superior performance was shown to be a direct effect of the solder microstructure. The final Sn solidification temperature strongly affects the initial microstructure of a SnAgCu solder joint, including the Sn grain morphology, and thus the thermomechanical behavior of the joint. Right after reflow, larger BGA joints of SnAgCu alloys, which solidify at higher temperature, reveal either a single β-Sn grain or three large grains with clearly defined boundaries formed by cyclic twinning. The orientations of the highly anisotropic Sn grains are not yet controllable in manufacturing, leading to substantial statistical scatter in the performance of the solder joints. Typical LGA solder joint dimensions, however, tend to facilitate greater undercooling and the formation of an alternative interlaced twinning microstructure. A systematic study was undertaken to identify the parameters that control the interlaced twinning microstructure. Sn grain structures were characterized by crossed polarizer microscopy and electron backscatter diffraction (EBSD). Precipitate sizes and distributions were measured using backscattered scanning electron microscopy and quantified using image analysis software. Systematic effects of solder alloy, dimensions and pad finishes were identified. Recommendations are made as to design and materials selection. The practicality of controlling the desired microstructure, as well as potential disadvantages for certain applications is discussed.

scholarly journals Sustainable Desalination by 3:1 Reduced Graphene Oxide/Titanium Dioxide Nanotubes (rGO/TiONTs) Composite via Capacitive Deionization at Different Sodium Chloride Concentrations

Nanomaterials ◽  
2019 ◽  
Vol 9 (9) ◽  
pp. 1319 ◽  
Author(s):  
John Paolo L. Lazarte ◽  
Liza Bautista-Patacsil ◽  
Ramon Christian P. Eusebio ◽  
Aileen H. Orbecido ◽  
Ruey-an Doong
Keyword(s):  
Titanium Dioxide ◽  
Graphene Oxide ◽  
Energy Consumption ◽  
Reduced Graphene Oxide ◽  
Contact Angles ◽  
Capacitive Deionization ◽  
Titanium Dioxide Nanotubes ◽  
Charging Time ◽  
Reduced Graphene ◽  
Charge Discharge

The capability of novel 3:1 reduced graphene oxide/titanium dioxide nanotubes (rGO/TiONTs) composite to desalinate using capacitive deionization (CDI) employing highly concentrated NaCl solutions was tested in this study. Parameters such as material wettability, electrosorption capacity, charge efficiency, energy consumption, and charge-discharge retention were tested at different NaCl initial concentrations—100 ppm, 2000 ppm, 15,000 ppm, and 30,000 ppm. The rGO/TiONTs composite showed good material wettability before and after CDI runs with its contact angles equal to 52.11° and 56.07°, respectively. Its two-hour electrosorption capacity during CDI at 30,000 ppm NaCl influent increased 1.34-fold compared to 100 ppm initial NaCl influent with energy consumption constant at 1.11 kWh per kg with NaCl removed. However, the percentage discharge (concentration-independent) at zero-voltage ranged from 4.9–7.27% only after 30 min of desorption. Repeated charge/discharge at different amperes showed that the slowest charging rate of 0.1 A·g−1 had the highest charging time retention at 60% after 100 cycles. Increased concentration likewise increases charging time retention. With this consistent performance of a CDI system utilizing rGO/TiONTs composite, even at 30,000 ppm and 100 cycles, it can be a sustainable alternative desalination technology, especially if a low charging current with reverse voltage discharge is set for a longer operation.

The Influence of Activated Carbon (AC) on Melting Temperature, Wettability and Intermetallic Compound Formation of Sn-Cu-Ni (SN100C) Solder Paste

2015 ◽  
Vol 754-755 ◽  
pp. 551-555 ◽  
Author(s):  
Rita Mohd Said ◽  
Norainiza Saud ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Mohd Nazree Derman ◽  
Mohd Izrul Izwan Ramli ◽  
...  
Keyword(s):  
Activated Carbon ◽  
Intermetallic Compound ◽  
Melting Temperature ◽  
Composite Solder ◽  
Copper Substrate ◽  
Contact Angles ◽  
Solder Paste ◽  
Compound Formation ◽  
Carbon Particles ◽  
Intermetallic Compound Formation

This paper reports on the effect of activated carbon (AC) addition on the properties of Sn-Cu-Ni (SN100C) solder paste. The composite solder was prepared by mixing reinforcement particles (0, 0.25, 0.5, 0.75 and 1.0 wt. %) into SN100C solder paste. The melting temperature of composite solder was determined by using differential scanning calorimetry (DSC). Wettability of fabricated solder was studied through contact angles between solder and copper substrate interface. The intermetallic compound formation was studied after reflow soldering process.With increased carbon particles addition, the composite solder was found to have a slightly lower melting temperature compared to monolithic solder while the wettability of composite solder effectively had improved. The activated carbon particles in solder paste composite have significant effects on the formation of intermetallic compounds (IMCs) at the solder/Cu substrate interfaces by suppressing the IMCs thickness.

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