History effect investigation in SOI MOSFET for minimizing impact on circuit performance

Author(s):  
Soumajit Ghosh ◽  
Takahiro Iizuka
Author(s):  
Soumajit Ghosh ◽  
Mitiko Miura-Mattausch ◽  
Takahiro Iizuka ◽  
Hideyuki Kikuchihara ◽  
Hafizur Rahaman ◽  
...  

2010 ◽  
Vol E93-C (6) ◽  
pp. 893-904
Author(s):  
Jin SUN ◽  
Kiran POTLURI ◽  
Janet M. WANG

Author(s):  
Nik Ahmad Zainal Abidin ◽  
◽  
Norkharziana Mohd Nayan ◽  
Azuwa Ali ◽  
N. A. Azli ◽  
...  

This research presents a simulation analysis for the AC-DC converter circuit with a different configurations of the array connection of the piezoelectric sensor. The selection of AC-DC converter circuits is full wave bridge rectifier (FWBR), parallel SSHI (P-SSHI) and parallel voltage multiplier (PVM) with array configuration variation in series (S), parallel (P), series-parallel (SP) and parallel-series (PS). The system optimizes with different load configurations ranging from 10 kΩ to 1 MΩ. The best configuration of AC-DC converter with an appropriate array piezoelectric connection producing the optimum output of harvested power is presented. According to the simulation results, the harvested power produced by using P-SSHI converter connected with 3 parallel piezoelectric transducer array was 85.9% higher than for PVM and 15.88% higher than FWBR.


Author(s):  
Pei Y. Tsai ◽  
Junedong Lee ◽  
Paul Ronsheim ◽  
Lindsay Burns ◽  
Richard Murphy ◽  
...  

Abstract A stringent sampling plan is developed to monitor and improve the quality of 300mm SOI (silicon on insulator) starting wafers procured from the suppliers. The ultimate goal is to obtain the defect free wafers for device fabrication and increase yield and circuit performance of the semiconductor integrated circuits. This paper presents various characterization techniques for QC monitor and examples of the typical defects attributed to wafer manufacturing processes.


2019 ◽  
Vol 9 (4) ◽  
pp. 504-511
Author(s):  
Sikha Mishra ◽  
Urmila Bhanja ◽  
Guru Prasad Mishra

Introduction: A new analytical model is designed for Workfunction Modulated Rectangular Recessed Channel-Silicon On Insulator (WMRRC-SOI) MOSFET that considers the concept of groove gate and implements an idea of workfunction engineering. Methods: The impact of Negative Junction Depth (NJD) and oxide thickness (tox) are analyzed on device performances such as Sub-threshold Slope (SS), Drain Induced Barrier Lowering (DIBL) and threshold voltage. Results: The results of the proposed work are evaluated with the Rectangular Recessed Channel-Silicon On Insulator (RRC-SOI) MOSFET keeping the metal workfunction constant throughout the gate region. Furthermore, an analytical model is developed using 2D Poisson’s equation and threshold voltage is estimated in terms of minimum surface potential. Conclusion: In this work, the impact of Negative Junction Depth (NJD) on minimum surface potential and the drain current are also evaluated. It is observed from the analysis that the analog switching performance of WMRRC-SOI MOSFET surpasses RRC-SOI MOSFET in terms of better driving capability, high Ion/Ioff ratio, minimized Short Channel Effects (SCEs) and hot carrier immunity. Results are simulated using 2D Sentaurus TCAD simulator for validation of the proposed structure.


1993 ◽  
Vol 29 (8) ◽  
pp. 726
Author(s):  
H.-G. Yang ◽  
P. Migliorato ◽  
C. Reita ◽  
S. Fluxman

1995 ◽  
Vol 31 (22) ◽  
pp. 1918-1919
Author(s):  
P.J. Mather ◽  
P. Hallam ◽  
M. Brouwer

Silicon ◽  
2021 ◽  
Author(s):  
Pradipta Dutta ◽  
SubhashreeSoubhagyamayee Behera ◽  
Soumendra Prasad Rout

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