Parametric thermal modeling of heat transfer in handheld electronic devices

Author(s):  
Jaeho Lee ◽  
David W. Gerlach ◽  
Yogendra K. Joshi
2021 ◽  
Author(s):  
Guilin Liu ◽  
Jing Liu

Abstract The increasingly high power density of today's electronic devices requires the cooling techniques to produce highly effective heat dissipation performance with as little sacrifice as possible to the system compactness. Among the currently available thermal management schemes, the convective liquid metal cooling provides considerably high performance due to their unique thermal properties. This paper firstly reviews the studies on convective cooling using low-melting-point metals published in the past few decades. A group of equations for the thermophysical properties of In-Ga-Sn eutectic alloy is then documented by rigorous literature examination, following by a section of correlations for the heat transfer and flow resistance calculation to partially facilitate the designing work at the current stage. The urgent need to investigate the heat transfer and flow resistance of forced convection of low-melting-point metals in small/mini-channels, typical in compact electronic devices, is carefully argued. Some special aspects pertaining to the practical application of this cooling technique, including the entrance effect, mixed convection, and compact liquid metal heat exchanger design, are also discussed. Finally, future challenges and prospects are outlined.


Author(s):  
Ali Rahimi Gheynani ◽  
Omid Ali Akbari ◽  
Majid Zarringhalam ◽  
Gholamreza Ahmadi Sheikh Shabani ◽  
Abdulwahab A. Alnaqi ◽  
...  

Purpose Although many studies have been conducted on the nanofluid flow in microtubes, this paper, for the first time, aims to investigate the effects of nanoparticle diameter and concentration on the velocity and temperature fields of turbulent non-Newtonian Carboxymethylcellulose (CMC)/copper oxide (CuO) nanofluid in a three-dimensional microtube. Modeling has been done using low- and high-Reynolds turbulent models. CMC/CuO was modeled using power law non-Newtonian model. The authors obtained interesting results, which can be helpful for engineers and researchers that work on cooling of electronic devices such as LED, VLSI circuits and MEMS, as well as similar devices. Design/methodology/approach Present numerical simulation was performed with finite volume method. For obtaining higher accuracy in the numerical solving procedure, second-order upwind discretization and SIMPLEC algorithm were used. For all Reynolds numbers and volume fractions, a maximum residual of 10−6 is considered for saving computer memory usage and the time for the numerical solving procedure. Findings In constant Reynolds number and by decreasing the diameter of nanoparticles, the convection heat transfer coefficient increases. In Reynolds numbers of 2,500, 4,500 and 6,000, using nanoparticles with the diameter of 25 nm compared with 50 nm causes 0.34 per cent enhancement of convection heat transfer coefficient and Nusselt number. Also, in Reynolds number of 2,500, by increasing the concentration of nanoparticles with the diameter of 25 nm from 0.5 to 1 per cent, the average Nusselt number increases by almost 0.1 per cent. Similarly, In Reynolds numbers of 4,500 and 6,000, the average Nusselt number increases by 1.8 per cent. Research limitations/implications The numerical simulation was carried out for three nanoparticle diameters of 25, 50 and 100 nm with three Reynolds numbers of 2,500, 4,500 and 6,000. Constant heat flux is on the channel, and the inlet fluid becomes heated and exists from it. Practical implications The authors obtained interesting results, which can be helpful for engineers and researchers that work on cooling of electronic devices such as LED, VLSI circuits and MEMS, as well as similar devices. Originality/value This manuscript is an original work, has not been published and is not under consideration for publication elsewhere. About the competing interests, the authors declare that they have no competing interests.


1991 ◽  
Vol 113 (1) ◽  
pp. 42-50 ◽  
Author(s):  
Kurt O. Lund ◽  
Anthony M. Colangelo ◽  
Gregory S. McKim

A thermal design for a solar pointing Space Shuttle mission is presented. The apparatus, which will measure solar flux intensity variations, contains sensors and data acquisition electronics which must be maintained within certain temperature constraints. The thermal design, which utilizes parallel heat flow paths and conduction fins to reject dissipated heat, is shown by finite difference thermal modeling to maintain component temperatures within these constraints. In the thermal modeling, arithmetic nodes are used to represent surface radiosity for radiation heat transfer. Also, the concept of mean fin conduction length and effective fin capacitance are introduced as means of simplifying the model representation of the conduction fins. An experiment was conducted to evaluate the chip/fin contact conductance.


Author(s):  
Kazuhisa Yuki ◽  
Masahiro Uemura ◽  
Koichi Suzuki ◽  
Ken-ichi Sunamoto

Two-phase flow loop system using a metal porous heat sink is proposed as a cooling system of the future power electronic devices with a heat load exceeding 300W/cm2. In this paper, as the first step, the heat transfer performance of the porous heat sink is evaluated under high heat flux conditions and the applicability and some engineering issues are discussed. The porous medium, which is fabricated by sintering copper particles, has a functional structure with several sub-channels inside it to enhance phase-change as well as discharge of generated vapor outside the porous medium. This porous heat sink is attached onto a heating chip and removes the heat by evaporating cooling liquid passing through the porous medium against the heat flow. Experiments using 30 kW of heating system show that the heat transfer performance of a copper-particles-sintered porous medium with the sub-channels exceeds 800W/cm2 in both high and low subcooling cases and achieves 300W/cm2 at a wall temperature of 150 °C (Tin = 70 °C) and 130 °C (Tin = 70 °C). These results prove that this porous heat sink is applicable enough for cooling 300 W/cm2 class of power electronic devices.


2021 ◽  
Vol 1163 ◽  
pp. 73-88
Author(s):  
Md Tanbir Sarowar

Microchannel heat sink plays a vital role in removing a considerable amount of heat flux from a small surface area from different electronic devices. In recent times, the rapid development of electronic devices requires the improvement of these heat sinks to a greater extent. In this aspect, the selection of appropriate substrate materials of the heat sinks is of vital importance. In this paper, three boron-based ultra-high temperature ceramic materials (ZrB2, TiB2, and HfB2) are compared as a substrate material for the microchannel heat sink using a numerical approach. The fluid flow and heat transfer are analyzed using the finite volume method. The results showed that the maximum temperature of the heat source didn’t exceed 355K at 3.6MWm-2 for any material. The results also indicated HfB2 and TiB2 to be more useful as a substrate material than ZrB2. By applying 3.6 MWm-2 heat flux at the source, the maximum obtained surface heat transfer coefficient was 175.2 KWm-2K-1 in a heat sink having substrate material HfB2.


2021 ◽  
Author(s):  
Noriyuki Unno ◽  
Kazuhisa Yuki ◽  
Risako Kibushi ◽  
Rika Nogita ◽  
Atsuyuki Mitani

Abstract Boiling heat transfer (BHT) is a promising technique to remove a high heat flux emitted from next-generation electronic devices. However, critical heat flux (CHF) is a big problem in BHT because it restricts the maximum performance of the cooling devices using BHT. Nanofluid has been widely used to improve the CHF. In this study, the authors investigated the BHT of a compact cooling device at low pressure using a special nanofluid: that is made with partially soluble particles in water. The experimental result found that the CHF with the special nanofluid is 170 W/cm2 and is higher than that with nanofluid made with an insoluble nanoparticle.


2021 ◽  
Author(s):  
Jean-François Duhé ◽  
Stéphane Victor ◽  
Pierre Melchior ◽  
Youssef Abdelmounen ◽  
François Roubertie

Abstract Sufficiently accurate thermal modeling is necessary for many applications such as heat dissipation, melting processes, building design or even bio-heat transfers in surgery. Circuit models help modeling heat transfer dynamics: this method is simple and is often used to model thermal phenomena. However, such models well approximates low and high frequency behavior but they are not accurate enough in the middle band of interest, thus lacking of precision in dynamical terms. A more complete and accurate description of conductive heat transfer can be obtained by using a two-port network. The resulting analytical expressions are complex and nonlinear in the frequency ω. This complexity in the frequency domain is difficult to handle when it comes to control applications and more specifically in real-time applications such as surgery. Consequently, an analysis of this thermal two-port network in the frequency domain directly leads to fractional-order systems. A frequency domain analysis of the series and shunt impedances will be presented and different approximations will be explored in order to obtain simple but sufficiently precise linear fractional transfer function models. The series impedances are approximated by using asymptotic and pole-zero approximations and the shunt impedance is approximated by using a capacitance approximation and two fractional model approximations.


Author(s):  
N. Manikanda Prabu ◽  
S. Nallusamy ◽  
G. Sureshkannan

Removal of heat generation is an important characteristic needs to be considered in electromechanical and electronic devices which improve the stability and feasibility of system. Despite numerous cooling methods, heat pipes are recent updating in research line. Heat pipes are one of the super conducting medium of heat energy and it is being used as an equipment to absorb more heat through phase change process of cooling medium circulated in it. It ensures the direct enhancement in heat transfer capacity and characteristics. Nowadays, improvement of the thermal performance in heat pipes getting up with various technologies, especially combination of heat pipe and Nano fluids. It has been experimentally practiced and various results are observed by previous researches that wick structure also a part of reason in improvement. The aim of this research work is to analyze the influence of wick material to improve heat transfer characteristics in heat pipes. In addition, combination of nano coated wick material with heat pipes is comparatively analyzed. From the final observed results it was found that, the best combination of wick material is supporting the better cooling requirements in electronic devices.


2019 ◽  
Vol 126 (16) ◽  
pp. 165105
Author(s):  
Sunchao Huang ◽  
R. A. Lewis ◽  
Chao Zhang

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