scholarly journals Corrections to “A Fully Integrated Arbitrary Power Divider on Printed Circuit Board by a Novel SMD-Resistor-Free Isolation Network” [Nov 20 1889-1901]

2021 ◽  
Vol 11 (9) ◽  
pp. 1514-1514
Author(s):  
Siang Chen ◽  
Tzong-Lin Wu
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Power Divider ◽  
Fully Integrated ◽  
Printed Circuit ◽  
Arbitrary Power

An Optimized On-Chip Boost-Type DC-DC Converter With an On-Board Inductance

2014 ◽  
Author(s):  
Paul C.-P. Chao ◽  
Ching-Hua Kuan ◽  
Jia-Wei Su
Keyword(s):  
Printed Circuit Board ◽  
High Efficiency ◽  
Rapid Development ◽  
Current Drive ◽  
Circuit Board ◽  
Electronic Products ◽  
Fully Integrated ◽  
Printed Circuit ◽  
Limited Output ◽  
On Chip

The rapid development of portable electronic products in recent years increases demands of varied displays. With resolutions of panel sizes and pixels under current drive capability improved, this study is intended for designing an inductive DC boost converter circuit for displays, which is fully integrated with IC fabrication technology [1][2]. Most of current displays employ capacitances for voltage-boosting to supply relative high-voltage biases to displays. These booster circuits are in small sizes and with high efficiency, but limited output currents, which are inadequate for some of large-sized displays. To remedy the problem, an on-board, small-sized inductor in the forms of coils in a printed circuit board (PCB) is proposed for a superior solution. This PCB-type inductor can be incorporated into the same board with other drive chips for the displays, while offering large, adequate current, as an incapable task via an on-chip coil.

scholarly journals Highly Integrated Elastic Island-Structured Printed Circuit Board with Controlled Young’s Modulus for Stretchable Electronics

Micromachines ◽  
2020 ◽  
Vol 11 (6) ◽  
pp. 617
Author(s):  
Duho Cho ◽  
Junhyung Kim ◽  
Pyoenggeun Jeong ◽  
Wooyoung Shim ◽  
Su Yeon Lee ◽  
...  
Keyword(s):  
Young’S Modulus ◽  
Printed Circuit Board ◽  
Young's Modulus ◽  
Circuit Board ◽  
Stretchable Electronics ◽  
Fully Integrated ◽  
Printed Circuit ◽  
Reinforcing Agent ◽  
Highly Stretchable ◽  
Levels Of Integration

A stretchable printed circuit board (PCB), which is an essential component of next-generation electronic devices, should be highly stretchable even at high levels of integration, as well as durable under repetitive stretching and patternable. Herein, an island-structured stretchable PCB composed of materials with controlled Young’s modulus and viscosity by adding a reinforcing agent or controlling the degree of crosslinking is reported. Each material was fabricated with the most effective structures through a 3D printer. The PCB was able to stretch 71.3% even when highly integrated and was patterned so that various components could be mounted. When fully integrated, the stress applied to the mounted components was reduced by 99.9% even when stretched by over 70%. Consequently, a 4 × 4 array of capacitance sensors in a stretchable keypad demonstration using our PCB was shown to work, even at 50% stretching of the PCB.

PRINTED QUASI-YAGI ANTENNAS WITH CENTER-END-FED DIPOLE DRIVER

2018 ◽  
pp. 19-23
Author(s):  
D. A. Bukhtiyarov ◽  
A. P. Gorbachev
Keyword(s):  
Printed Circuit Board ◽  
Phased Arrays ◽  
Dielectric Material ◽  
Circuit Board ◽  
Power Divider ◽  
The Novel ◽  
Printed Circuit ◽  
Radio Systems ◽  
Hybrid Ring

The novel realization of printed Yagi-Uda antenna is presented in this paper. Such the aerials are widely used in the modern telecommunication and radiolocation systems. The described method uses the nontraditional center-end-fed in-phase excitation through the hybrid ring two-way power divider. This divider behaves acceptable behavior, when all the lengths and clearances between printed conductors are optimized for Russian dielectric material FAF-4. This material is the successful discovery, when the aerial is excited through the subminiature version A connector that satisfies double-sided printed circuit board realization. The simulation-derived results indicate that the proposed aerial is the fan-beam radiator. This radiator is a good candidate for the use in the novel printed planar equidistant phased arrays for various radio systems including radiolocation, radio-finder arrangements, navigation an so on.

Characteristics of Radiated Emission from a Printed Circuit Board with a Slit

2012 ◽  
Vol 132 (6) ◽  
pp. 404-410 ◽  
Author(s):  
Kenichi Nakayama ◽  
Kenichi Kagoshima ◽  
Shigeki Takeda
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Radiated Emission

Confirming the Signal Integrity in Transmission of Digital Signals on Microstrip Straight Circuits via the Eye Diagrams

2014 ◽  
Vol 5 (1) ◽  
pp. 737-741
Author(s):  
Alejandro Dueñas Jiménez ◽  
Francisco Jiménez Hernández
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Board ◽  
Signal Integrity ◽  
High Volume ◽  
Information Storage ◽  
Circuit Board ◽  
Electromagnetic Simulation ◽  
Electronic Systems ◽  
Digital Signals ◽  
Printed Circuit

Because of the high volume of processing, transmission, and information storage, electronic systems presently requires faster clock speeds tosynchronizethe integrated circuits. Presently the “speeds” on the connections of a printed circuit board (PCB) are in the order of the GHz. At these frequencies the behavior of the interconnects are more like that of a transmission line, and hence distortion, delay, and phase shift- effects caused by phenomena like cross talk, ringing and over shot are present and may be undesirable for the performance of a circuit or system.Some of these phrases were extracted from the chapter eight of book “2-D Electromagnetic Simulation of Passive Microstrip Circuits” from the corresponding author of this paper.

Root Cause Analysis of a Connector Time-Delayed Fracture

2015 ◽  
Author(s):  
Prabjit Singh ◽  
Ying Yu ◽  
Robert E. Davis
Keyword(s):  
Printed Circuit Board ◽  
Ceramic Substrate ◽  
Circuit Board ◽  
Delayed Fracture ◽  
Ceramic Substrates ◽  
Printed Circuit ◽  
Root Cause ◽  
Chip Carrier ◽  
Electrical Connections ◽  
Grain Boundary Grooves

Abstract A land-grid array connector, electrically connecting an array of plated contact pads on a ceramic substrate chip carrier to plated contact pads on a printed circuit board (PCB), failed in a year after assembly due to time-delayed fracture of multiple C-shaped spring connectors. The land-grid-array connectors analyzed had arrays of connectors consisting of gold on nickel plated Be-Cu C-shaped springs in compression that made electrical connections between the pads on the ceramic substrates and the PCBs. Metallography, fractography and surface analyses revealed the root cause of the C-spring connector fracture to be plating solutions trapped in deep grain boundary grooves etched into the C-spring connectors during the pre-plating cleaning operation. The stress necessary for the stress corrosion cracking mechanism was provided by the C-spring connectors, in the land-grid array, being compressed between the ceramic substrate and the printed circuit board.

Application of Lock-in Thermography on PCB for Fault Localization and Validation of Failure Mechanism Due to External Discrete Component Variation

2010 ◽  
Author(s):  
William Ng ◽  
Kevin Weaver ◽  
Zachary Gemmill ◽  
Herve Deslandes ◽  
Rudolf Schlangen
Keyword(s):  
Failure Mechanism ◽  
Integrated Circuit ◽  
Printed Circuit Board ◽  
Hot Spot ◽  
Circuit Board ◽  
Discrete Component ◽  
Printed Circuit ◽  
Thermal Signature ◽  
Lock In

Abstract This paper demonstrates the use of a real time lock-in thermography (LIT) system to non-destructively characterize thermal events prior to the failing of an integrated circuit (IC) device. A case study using a packaged IC mounted on printed circuit board (PCB) is presented. The result validated the failing model by observing the thermal signature on the package. Subsequent analysis from the backside of the IC identified a hot spot in internal circuitry sensitive to varying value of external discrete component (inductor) on PCB.

Temperature and Humidity Dependent Reliability Analysis of RGB LED Chips

2006 ◽  
Author(s):  
Jun-Xian Fu ◽  
Shukri Souri ◽  
James S. Harris
Keyword(s):  
Reliability Analysis ◽  
Printed Circuit Board ◽  
Light Emitting Diode ◽  
Circuit Board ◽  
Light Emitting ◽  
Printed Circuit ◽  
Root Cause ◽  
Micro Cracks ◽  
Temperature And Humidity

Abstract Temperature and humidity dependent reliability analysis was performed based on a case study involving an indicator printed-circuit board with surface-mounted multiple-die red, green and blue light-emitting diode chips. Reported intermittent failures were investigated and the root cause was attributed to a non-optimized reflow process that resulted in micro-cracks and delaminations within the molding resin of the chips.

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