Thermomechanical Stress Analysis of Multi-Layered Electronic Packaging
2003 ◽
Vol 125
(1)
◽
pp. 134-138
◽
Keyword(s):
An accurate estimate of thermal stresses in multilayered microelectronics structures along the bonded interfaces is crucial for design and prediction of delamination-related failures. Compared with a numerical method, analytical closed-form solution can offer a more rapid method to obtain the stresses at the interfaces. An analytical model for ply-level sub-laminate analysis is investigated in this paper. The theory presented treats each layer as a beam-type plate with orthotropic material properties. As an example, the results are shown for a three-layer beam problem with special orthotropic material properties. Analytical model results are compared with the finite element analysis results, as a first order approximation.
2006 ◽
Vol 129
(3)
◽
pp. 300-306
◽
2011 ◽
Vol 467-469
◽
pp. 275-278
Keyword(s):
2021 ◽
1990 ◽
Vol 17
(5)
◽
pp. 835-843
◽