Aerospace Thermal-Structural Testing Technology

1997 ◽  
Vol 50 (9) ◽  
pp. 477-498 ◽  
Author(s):  
Earl A. Thornton
Keyword(s):  
High Speed ◽  
Structural Testing ◽  
Aerodynamic Heating ◽  
Heating And Cooling ◽  
Structural Test ◽  
Space Experiments ◽  
Test Technology ◽  
Testing Technology ◽  
Structural Tests ◽  
Structural Boundary

This review article describes aerospace thermal-structural testing technology. It begins with discussions of aerodynamic heating and space radiation heating. The review continues with a general discussion of thermal-structural test technology including heating and cooling, instrumentation, and thermal-structural boundary conditions. Then illustrative thermal structural tests are presented for high speed flight in the atmosphere and flight in space. Experiments conducted in the laboratory as well as flight tests are described. Several experiments are reviewed to demonstrate the diversity of thermal-structural phenomena. This article includes 120 references.

Effect of cold hydrostatic extrusion on processes occurring during heating and cooling of high-speed steels

1979 ◽  
Vol 21 (10) ◽  
pp. 795-798
Author(s):  
Yu. F. Chernyi ◽  
F. K. Tkachenko ◽  
V. Z. Spuskanyuk ◽  
A. I. Mel'nichenko ◽  
A. A. Lyadskaya
Keyword(s):  
High Speed ◽  
Hydrostatic Extrusion ◽  
Heating And Cooling

High-Speed Wired Drill Pipe and its Corresponding Manufacture & Test Technology Research

2021 ◽  
Author(s):  
Haochen Han ◽  
Yong Zhang ◽  
Jia Chen ◽  
Qi Sun ◽  
Zhimeng Fang ◽  
...  
Keyword(s):  
Mass Production ◽  
Manufacturing Process ◽  
High Speed ◽  
Transmission Rate ◽  
Drill Pipe ◽  
Pass Rate ◽  
Series System ◽  
Validation Test ◽  
Test Technology ◽  
Drill Pipes

Abstract High-speed wired drill pipe and its corresponding communication technology not only can achieve high-speed transmission rate and high-capacity, but also can realize real-time monitoring and dual-way communication in whole section, which can prevent downhole problems effectively. As a series system, the homogeneity and robustness of these wired drill pipes are crucial. This paper focuses on how to overcome the difficulty in manufacturing process of information drill pipe and complete the validation test. In order to guarantee the quality of information drill pipe and satisfy the technological requirements of mass production, we optimize the manufacturing process and put forward reasonable test techniques. The optimizations of manufacturing process include the analysis on constant tension of pressure pipe, quantitative cutting pipe and perforation in pipe nozzle. The testing techniques includes magnetic coupling coil impedance test, high pressure test, communication performance test of both single pipe and series system. The test result can be judged and evaluated by the attenuation value of the signal attenuation test and the signal reflection waveform as well as sealing reliability. With the help of the optimization of the manufacturing process and the application of new tooling, the quality and robustness of information drill pipe is improved obviously. Pass rate in primary assembly is increased from 70% to 92%. After the second assembly, pass rate can be increased to 99.5%. Besides, the work efficiency is greatly improved and the process requirements of mass production are satisfied. The validation test can screen out the drill pipe with poor quality and performance effectively thus to improve the reliability of the whole system. By means of the improvement of manufacturing and the validation test, the comprehensive pass rate of information drill pipes is increased from 84% to 95%. During three field tests in Jilin and Daqing Oilfield, the information drill pipes functioned well and accomplished all the test tasks successfully. High-speed wired drill pipe can improve the downhole data transmission on a large margin. The theorical transmission rate can be up to 100 kbps, 10,000 times as much as the traditional mud impulse telemetry. The manufacturing optimization and test technology can guarantee the performance and realize downhole data highway.

High Productivity Thermo-Compression Flip Chip Bonding

2014 ◽  
Vol 2014 (1) ◽  
pp. 000100-000106
Author(s):  
Tom Colosimo ◽  
Horst Clauberg ◽  
Evan Galipeau ◽  
Matthew B. Wasserman ◽  
Michael Schmidt-Lange ◽  
...  
Keyword(s):  
High Speed ◽  
Large Scale ◽  
Flip Chip ◽  
Solder Joints ◽  
Rapid Heating ◽  
Temperature Cycle ◽  
Temperature Uniformity ◽  
Heating Rates ◽  
Heating And Cooling ◽  
Chip Technology

Advancements in electronic packaging performance and cost have historically been driven by higher integration primarily provided by fab shrinks that has followed the well-known Moore's law. However, due to the tremendous and continuously increasing cost of building new fabs, the performance/cost improvements achieved via node shrinks are negated. This leaves packaging innovation as the vehicle to achieve future cost-performance improvements. This has initiated a More-than-Moore idea that has led to vigorous R&D in packaging. Advanced packages which employ ultra-fine pitch flip chip technology for chip-to-substrate, chip-to-chip, or chip-to-interposer for the first level interconnect have been developed as an answer to obtaining higher performance. However, the costs are too high as compared to traditional wire bonding. The status today is that the fundamental technical hurdles of manufacturing the new advanced packages have been solved, but cost reduction and yield improvements have to be addressed for large-scale adoption into high volume manufacturing. In traditional flip chip assembly silicon chips are tacked onto a substrate and then the solder joints are melted and mass reflowed in an oven. This mass reflow technique is troublesome as the pitch of the solder bumps become finer. This is due to the large differences in the thermal expansion coefficient of the die and the substrate, which creates stress at the solder joints and warpage of the package when the die and substrate are heated and cooled together. To mitigate and resolve this issue, thermo-compression bonders have been developed which locally reflow the solder without subjecting the entire substrate to the heating and cooling cycle. This requires that the bondhead undergo heating past the melting point of solder and then cooling down to a low enough temperature to pick the next die from the wafer that is mounted to tape. Machines in the market today can accomplish this temperature cycle in 7 to 15 seconds. This is substantially slower than the standard flip chip process which leads to high cost and is delaying the introduction of these new packages. This paper shows a flip chip bonder with a new heating and cooling concept that will radically improve the productivity of thermo-compression bonding. Data and productivity cycles from this new bond head with heating rates of over 200°C/sec and cooling of faster than 100°C/sec are revealed. Experimental results are shown of exceptional temperature accuracy across the die of 5°C throughout the cycle and better than 3°C at the final heating stage. The high speed thermo-compression bonds are analyzed and the efficacy of the new concept is proven. Excellent temperature uniformity while heating rapidly is an absolute necessity for enabling good solder joints in a fast process. Without good temperature uniformity, additional dwell times need to be incorporated to allow heat to flow to all of the joints, negating any benefits from rapid heating. Whereas the current state-of-that-art is often to program temperature in steps, this bonder can be commanded and accurately follows more complex temperature profiles with great accuracy. Examples of how this profiling can be used to enhance the uniformity and integrity of the joints with non-conductive pastes, film, and without underfill along with the associated productivity improvements will be shown. Tests that show portability across platforms that will lead to set up time and yield improvements and are identified and quantified. Additionally new ideas for materials and equipment development to further enhance productivity and yield are explored.

scholarly journals A Rapid Thermal Nanoimprint Apparatus through Induction Heating of Nickel Mold

Micromachines ◽  
2019 ◽  
Vol 10 (5) ◽  
pp. 334 ◽  
Author(s):  
Xinxin Fu ◽  
Qian Chen ◽  
Xinyu Chen ◽  
Liang Zhang ◽  
Aibin Yang ◽  
...  
Keyword(s):  
Magnetic Field ◽  
Cooling Rate ◽  
Induction Heating ◽  
Nanoimprint Lithography ◽  
High Speed ◽  
Eddy Currents ◽  
Magnetic Hysteresis ◽  
Alternating Magnetic Field ◽  
Polymer Materials ◽  
Heating And Cooling

Thermal nanoimprint lithography is playing a vital role in fabricating micro/nanostructures on polymer materials by the advantages of low cost, high throughput, and high resolution. However, a typical thermal nanoimprint process usually takes tens of minutes due to the relatively low heating and cooling rate in the thermal imprint cycle. In this study, we developed an induction heating apparatus for the thermal imprint with a mold made of ferromagnetic material, nickel. By applying an external high-frequency alternating magnetic field, heat was generated by the eddy currents and magnetic hysteresis losses of the ferromagnetic nickel mold at high speed. Once the external alternating magnetic field was cut off, the system would cool down fast owe to the small thermal capacity of the nickel mold; thus, providing a high heating and cooling rate for the thermal nanoimprint process. In this paper, nanostructures were successfully replicated onto polymer sheets with the scale of 4-inch diameter within 5 min.

Steady Temperature in a Rotating Cylinder Subject to Surface Heating and Convective Cooling

1984 ◽  
Vol 106 (1) ◽  
pp. 120-126 ◽  
Author(s):  
B. Gecim ◽  
W. O. Winer
Keyword(s):  
Heat Source ◽  
Peclet Number ◽  
High Speed ◽  
Integral Transform ◽  
The Body ◽  
Cooling Zone ◽  
Dimensionless Numbers ◽  
Péclet Number ◽  
Heating And Cooling ◽  
Simultaneous Heating

This study utilizes an integral transform technique in order to solve the heat conduction equation in cylindrical coordinates. The major assumption is the high speed (i.e., large Peclet number) assumption. The boundary value problem is governed by the parabolic form of the heat equation representing the quasi-stationary state. The boundary conditions are a combination of Neumann and mixed type due to simultaneous heating and cooling on the surface of the cylinder. The surface temperature reaches a peak value over the heat source and gradually decreases to a nearly constant level over the cooling zone. Thermal penetration in the radial direction is shown to be only a few percent of the radius, leaving the bulk of the body at a uniform temperature. The width of the heat source and the total heat input are shown to be effective on the level of temperature whereas the input distribution is shown to be unimportant. The dimensionless numbers involved are the Biot and the Peclet numbers where the solution is governed by the ratio of the Biot number to the square root of the Peclet number.

The Application of Fiber Optic Test Technology in Deformation Monitoring of Highway Corrugated Steel Pipe Culvert

2011 ◽  
Vol 255-260 ◽  
pp. 1007-1011
Author(s):  
Fan Zhang ◽  
Ping Fang ◽  
Hai Tao Qian
Keyword(s):  
Term Structure ◽  
Fiber Optic ◽  
Steel Structure ◽  
Deformation Monitoring ◽  
Steel Pipe ◽  
Test Results ◽  
Test Technology ◽  
Testing Technology ◽  
Fbg Sensors ◽  
Test Points

Compared to the traditional testing technology, the fiber bragg grating(FBG) test technology has many unique advantages and is suitable for the long-term structure health monitoring. By testing the stress and strain conditions of the corrugated steel pipe culverts under different fill heights with FBG sensors set in the inner and outer of the culverts, the mechanical properties of the steel pipe culverts could be obtained. The field fiber optic test results show that the FBG sensors can be used in the structures under complex engineering conditions. When the fill height is added, the FBG test results will change significantly in real-time, and the strain values of all test points on the culvert will change with the increase of the fill height, particularly in the top and bottom test points of the culvert. So the Fiber optic test technology can adapt to the testing requirements of the corrugated steel structure, and can provide a basis for the design of the corrugated steel pipe.

Optimization Design on Headstock of Shape High-Speed Vertical Machining Center

2011 ◽  
Vol 121-126 ◽  
pp. 1023-1027
Author(s):  
Chun Zhang ◽  
Zhi Yuan Li
Keyword(s):  
Optimal Design ◽  
Response Surface ◽  
High Speed ◽  
Optimization Design ◽  
Parametric Model ◽  
Machining Center ◽  
Design Variables ◽  
Test Technology ◽  
Design Result ◽  
Ansys Workbench

Optimization design was a technology that searched and determined the optimal design. Parametric model of headstock was established in Pro/E, and the parametric model was imported into the ANSYS Workbench. Then multi-objective optimization design was carried out in DesignXplorer module based on test technology, response surface that the combinations of design variables aimed at the objective function was obtained, the situation which design variables changes impacted on performance parameters from the response surface was viewed, a relatively ideal optimal design result was chosen. The mass of improved headstock was reduced, under the condition that performance in all aspects was not diminished.

Flow Visualization Techniques for the Evaluation of Non-Contact Trace Contraband Detectors

2010 ◽  
Author(s):  
Matthew Staymates ◽  
Greg Gillen ◽  
Wayne Smith ◽  
Richard Lareau ◽  
Robert Fletcher
Keyword(s):  
High Speed ◽  
Trace Detection ◽  
Confined Space ◽  
Screening Process ◽  
Detection Systems ◽  
Air Jets ◽  
Heating And Cooling ◽  
Lift Off ◽  
Visualization Techniques ◽  
Chemical Analyzer

Efforts are underway in the Surface and Microanalysis Science Division at the National Institute of Standards and Technology to study trace aerodynamic sampling of contraband materials (explosives or narcotics) in non-contact trace detection systems. Trace detection systems are designed to screen people, personal items, and cargo for particles that have contaminated surfaces. In a typical implementation of people screening, a human subject walks into a confined space where they are interrogated by a series of pulsed air jets and are screened for contraband materials by a chemical analyzer. The screening process requires particle and vapor removal, transport, collection, desorption, and detection. Aerodynamic sampling is the critical front-end process for effective detection. In this paper, a number of visualization techniques are employed to study non-contact aerodynamic sampling in detail. Particle lift-off and removal is visualized using high-speed videography, transport of air and particles by laser light scattering, and desorption surface heating and cooling patterns by infrared thermography. These tools are used to identify sampling inefficiencies and may be used to study next-generation screening approaches for aerodynamic sampling of particles and vapors.

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