Air Cooling of Power Electronics Through Vertically Enhanced Manifold Microchannel Systems (VEMMS)

2021 ◽  
Author(s):  
Sevket Umut Yuruker ◽  
Raphael Mandel ◽  
Patrick McCluskey ◽  
Michael Ohadi
Keyword(s):  
Power Electronics ◽  
Thermal Management ◽  
Power Density ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Cooling Power ◽  
Air Cooling ◽  
Ambient Conditions ◽  
Numerical Predictions ◽  
Manifold Microchannel

Abstract Optimum thermal management of power electronics is necessary for their improved reliability and efficiency. Next generation electronics systems are predicted to dissipate more heat as die size shrinks and power levels increase. Traditional air-cooling approaches usually provide insufficient performance or require heavy and bulky heatsinks to achieve adequate thermal management. To tackle this, a novel air-cooled vertically enhanced manifold microchannel system (VEMMS) was developed. While minimizing the footprint requirement on the printed circuit board, it offers an efficient thermal management in a conformal scheme that accommodates the associated power electronics and their electrical connections. The present work describes manufacturing of the air-cooled VEMMS heatsink, and its experimental characterization and thermo-fluidic performance. Good agreement was obtained between the test results and numerical predictions. Using air at ambient conditions, a thermal resistance of 2.6 K/W was achieved, at 1.5cm2 footprint and 2cm3 total heatsink volume in a single-sided cooling architecture, enabling a full-bridge electrical power density of ~84 kWe/L and overall DC-DC converter's power density of ~20kWe/L, at reasonable flow rates and pressure drops using commercially available miniature electric fans. Index Terms-Air cooling, heatsink, manifold microchannel cooling, power electronics, power density, thermal management

scholarly journals Enhanced Thermal Management of GaN Power Amplifier Electronics with Micro-Pin Fin Heat Sinks

Electronics ◽  
2020 ◽  
Vol 9 (11) ◽  
pp. 1778
Author(s):  
Ting Kang ◽  
Yuxin Ye ◽  
Yuncong Jia ◽  
Yanmei Kong ◽  
Binbin Jiao
Keyword(s):  
Thermal Resistance ◽  
Thermal Management ◽  
Power Density ◽  
Power Amplifier ◽  
Heat Dissipation ◽  
Printed Circuit Board ◽  
Element Model ◽  
Circuit Board ◽  
Device Performance ◽  
Pin Fin

This study introduces an enhanced thermal management strategy for efficient heat dissipation from GaN power amplifiers with high power densities. The advantages of applying an advanced liquid-looped silicon-based micro-pin fin heat sink (MPFHS) as the mounting plate for GaN devices are illustrated using both experimental and 3D finite element model thermal simulation methods, then compared against traditional mounting materials. An IR thermography system was equipped to obtain the temperature distribution of GaN mounted on three different plates. The influence of mass flow rate on a MPFHS was also investigated in the experiments. Simulation results showed that GaN device performance could be improved by increasing the thermal conductivity of mounting plates’ materials. The dissipated power density of the GaN power amplifier increased 17.5 times when the mounting plate was changed from LTCC (Low Temperature Co-fired Ceramics) (k = 2 Wm−1 K−1) to HTCC (High-Temperature Co-fired Ceramics) (k = 180 Wm−1 K−1). Experiment results indicate that the GaN device performance was significantly improved by applying liquid-looped MPFHS, with the maximum dissipated power density reaching 7250 W/cm2. A thermal resistance model for the whole system, replacing traditional plates (PCB (Printed Circuit Board), silicon wafer and LTCC/HTCC) with an MPFHS plate, could significantly reduce θjs (thermal resistance of junction to sink) to its theoretical limitation value.

scholarly journals Research on Small Square PCB Rogowski Coil Measuring Transient Current in the Power Electronics Devices

Sensors ◽  
2019 ◽  
Vol 19 (19) ◽  
pp. 4176 ◽  
Author(s):  
Chaoqun Jiao ◽  
Juan Zhang ◽  
Zhibin Zhao ◽  
Zuoming Zhang ◽  
Yuanliang Fan
Keyword(s):  
Power Electronics ◽  
Printed Circuit Board ◽  
Electronic Devices ◽  
Rogowski Coil ◽  
Bipolar Transistors ◽  
Circuit Board ◽  
Power Electronic ◽  
Insulated Gate Bipolar Transistors ◽  
Printed Circuit ◽  
Internal Structures

With the development of China’s electric power, power electronics devices such as insulated-gate bipolar transistors (IGBTs) have been widely used in the field of high voltages and large currents. However, the currents in these power electronic devices are transient. For example, the uneven currents and internal chip currents overshoot, which may occur when turning on and off, and could have a great impact on the device. In order to study the reliability of these power electronics devices, this paper proposes a miniature printed circuit board (PCB) Rogowski coil that measures the current of these power electronics devices without changing their internal structures, which provides a reference for the subsequent reliability of their designs.

CFD Analysis of Thermal Shadowing and Optimization of Heatsinks in 3rd Generation Open Compute Server for Single-Phase Immersion Cooling

2019 ◽  
Author(s):  
Jimil M. Shah ◽  
Ravya Dandamudi ◽  
Chinmay Bhatt ◽  
Pranavi Rachamreddy ◽  
Pratik Bansode ◽  
...  
Keyword(s):  
Thermal Management ◽  
Power Density ◽  
Heat Sink ◽  
Single Phase ◽  
Data Centers ◽  
Air Cooling ◽  
Third Generation ◽  
Dielectric Fluids ◽  
Immersion Cooling ◽  
The Impact

Abstract In today’s networking world, utilization of servers and data centers has been increasing significantly. Increasing demand of processing and storage of data causes a corresponding increase in power density of servers. The data center energy efficiency largely depends on thermal management of servers. Currently, air cooling is the most widely used thermal management technology in data centers. However, air cooling has started to reach its limits due to high-powered processors. To overcome these limitations of air cooling in data centers, liquid immersion cooling methods using different dielectric fluids can be a viable option. Thermal shadowing is an effect in which temperature of a cooling medium increases by carrying heat from one source and results in decreasing its heat carrying capacity due to reduction in the temperature difference between the maximum junction temperature of successive heat sink and incoming fluid. Thermal Shadowing is a challenge for both air and low velocity oil flow cooling. In this study, the impact of thermal shadowing in a third-generation open compute server using different dielectric fluids is compared. The heat sink is a critical part for cooling effectiveness at server level. This work also provides an efficient range of heat sinks with computational modelling of third generation open compute server. Optimization of heat sink can allow to cool high-power density servers effectively for single-phase immersion cooling applications. A parametric study is conducted, and significant savings in the volume of a heat sink have been reported.

Influence of the area of a thermal pad on optical and thermal parameters of LED modules

Circuit World ◽  
2020 ◽  
Vol 46 (2) ◽  
pp. 65-70 ◽  
Author(s):  
Krzysztof Górecki ◽  
Przemysław Piotr Ptak
Keyword(s):  
Thermal Resistance ◽  
Power Density ◽  
Printed Circuit Board ◽  
Thermal Parameters ◽  
Circuit Board ◽  
Optical Parameters ◽  
Metal Core ◽  
Content Type ◽  
Printed Circuit

Purpose The purpose of this paper is to present and discuss the results of measurements illustrating influence of the area of a thermal pad and the kind of the used base on thermal and optical parameters of LED modules. Design/methodology/approach LED modules including six power LEDs are designed. In the layout of these modules, different areas of a thermal pad of each LED are used. These modules are made using the classical FR-4 base and metal core printed circuit board (MCPCB). Thermal and optical parameters of all the tested modules are measured using the method elaborated by the authors. Findings The obtained results of measurements prove that increasing the area of a thermal pad causes a decrease in thermal resistance of the tested LED modules and an increase in power density of the emitted light. The role of the area of a thermal pad is more important for the classical FR-4 base than for MCPCB. Research limitations/implications Investigations were performed for only two values of the area of thermal pads and selected values of LEDs forward current. Originality/value The presented results of investigations show how the used layout and type of the used base of these modules influence optical and thermal parameters of LED modules. Changing the base of a module can cause even a double decrease in thermal resistance and a double increase in power density of the emitted light.

scholarly journals Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions

2021 ◽  
Author(s):  
Gilberto Moreno ◽  
Sreekant Narumanchi ◽  
Xuhui Feng ◽  
Paul Anschel ◽  
Steve Myers ◽  
...  
Keyword(s):  
Thermal Resistance ◽  
Power Electronics ◽  
Thermal Management ◽  
Power Density ◽  
Thermal Performance ◽  
Electric Drive ◽  
Thermal Analyses ◽  
Heat Fluxes ◽  
Current Status ◽  
Dielectric Fluid

Abstract Effective thermal management of traction-drive power electronics is critical to the advancement of electric-drive vehicles and is necessary for increasing power density and improving reliability. Replacing traditional silicon devices with more efficient, higher temperature, higher voltage, and higher frequency wide-bandgap (WBG) devices will enable increased power density but will result in higher device heat fluxes. Compact packaging of high-temperature WBG devices near low-temperature-rated components creates thermal management challenges that need to be addressed for future power-dense systems. This paper summarizes the thermal performance of on-road automotive power electronics thermal management systems and provides thermal performance and pumping-power metrics for select vehicles. Thermal analyses reveal that the package/conduction resistance dominates the total thermal resistance (for existing automotive systems). We model advanced packaging concepts and compare the results with existing packaging designs to quantify their thermal performance enhancements. Double-side-cooled configurations that do not use thermal interface materials are package concepts predicted to provide a low junction-to-fluid thermal resistance (compared to current packages). Dielectric-fluid-cooled concepts enable a redesign of the package to reduce the package resistance, can be implemented in single- and two-phase cooling approaches, and allow for cooling of passive components (e.g., capacitors) and bus bars.

Experimental Study on the Double-Sided Air Cooling for Integrated Power Electronics Modules

2005 ◽  
Author(s):  
Ying Feng Pang ◽  
Elaine P. Scott ◽  
Zhenxian Liang ◽  
J. D. van Wyk
Keyword(s):  
Thermal Resistance ◽  
Power Electronics ◽  
Thermal Management ◽  
Heat Sink ◽  
Three Dimensional ◽  
Management Approach ◽  
Air Cooling ◽  
Thermal Tests ◽  
Heat Spreaders ◽  
Embedded Power

The objective of this work is to quantify the advantages of using double-sided cooling as the thermal management approach for the integrated power electronics modules. To study the potential advantage of the Embedded Power packaging method for the double-sided cooling, experiments were conducted. Three different cases were studied. To eliminate the effect of the heat sink on either side of the module, no heat sink was used in all three cases. The thermal tests were conducted such that the integrated power electronics modules were placed in the middle of flowing air in an insulated wind tunnel. Modules without additional top DBC, with additional top DBC, and with additional top DBC as well as heat spreaders on both sides were tested under the same condition. A common parameter, junction-to-ambient thermal resistance, was used to compare the thermal performance of these three cases. Despite the shortcoming of this parameter in describing the three-dimensional heat flow within the integrated power electronics modules, the concept of the thermal resistance is still worthwhile for evaluating various cooling methods for the module. The results show that increasing the top surface area can help in transferring the heat from the heat source to the ambient through the top side of the module. Consequently, the ability to handle higher power loss can also be increased. In summary, the Embedded Power technology provides an opportunity for implementing double-sided cooling as thermal management approach compared to modules with wire-bonded interconnects for the multichips.

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