Experimental Study on the Double-Sided Air Cooling for Integrated Power Electronics Modules

2005 ◽  
Author(s):  
Ying Feng Pang ◽  
Elaine P. Scott ◽  
Zhenxian Liang ◽  
J. D. van Wyk
Keyword(s):  
Thermal Resistance ◽  
Power Electronics ◽  
Thermal Management ◽  
Heat Sink ◽  
Three Dimensional ◽  
Management Approach ◽  
Air Cooling ◽  
Thermal Tests ◽  
Heat Spreaders ◽  
Embedded Power

The objective of this work is to quantify the advantages of using double-sided cooling as the thermal management approach for the integrated power electronics modules. To study the potential advantage of the Embedded Power packaging method for the double-sided cooling, experiments were conducted. Three different cases were studied. To eliminate the effect of the heat sink on either side of the module, no heat sink was used in all three cases. The thermal tests were conducted such that the integrated power electronics modules were placed in the middle of flowing air in an insulated wind tunnel. Modules without additional top DBC, with additional top DBC, and with additional top DBC as well as heat spreaders on both sides were tested under the same condition. A common parameter, junction-to-ambient thermal resistance, was used to compare the thermal performance of these three cases. Despite the shortcoming of this parameter in describing the three-dimensional heat flow within the integrated power electronics modules, the concept of the thermal resistance is still worthwhile for evaluating various cooling methods for the module. The results show that increasing the top surface area can help in transferring the heat from the heat source to the ambient through the top side of the module. Consequently, the ability to handle higher power loss can also be increased. In summary, the Embedded Power technology provides an opportunity for implementing double-sided cooling as thermal management approach compared to modules with wire-bonded interconnects for the multichips.

Single-Phase Microchannel Cooling for Stacked Single Core Chip and DRAM

2011 ◽  
Author(s):  
Anjali Chauhan ◽  
Bahgat Sammakia ◽  
Kanad Ghose ◽  
Gamal Refai-Ahmed ◽  
Dereje Agonafer
Keyword(s):  
Thermal Resistance ◽  
Thermal Management ◽  
Heat Sink ◽  
Single Phase ◽  
Cooling System ◽  
Three Dimensional ◽  
Form Factors ◽  
Memory Access ◽  
Thermal Interface Material ◽  
Level Energy

The stacking of processing and memory components in a three-dimensional (3D) configuration enables the implementation of processing systems with small form factors. Such stacking shortens the interconnection length between processing and memory components to dramatically lower the memory access latencies, and contributes to significant improvements in the memory access bandwidth. Both of these factors elevate overall system performance to levels that are not realizable with prevailing and other proposed solutions. The shorter interconnection lengths in stacked architectures also enable the use of smaller drivers for the interconnections, which in turn reduces interconnection-level energy dissipations. On the down side, stacking of processing and memory components introduces a significant thermal management challenge that is rooted in the high thermal resistance of stacked designs. This paper examines and evaluates three distinct solutions that address thermal management challenges in a system that stacks DRAM components onto a processing core. We primarily focus on three different configurations of a microchannel-based single-phase liquid cooling system with a traditional air-cooled heat sink. Our evaluations, which are intended to study the limits of each solution, assume a uniform power dissipation model for the processor and accounts for the thermal resistance offered by the thermal interface material (TIM), the interconnect layer, and through-silicon vias (TSVs). The liquid-cooled microchannel heat sink shows more promising results when integrated into the package than when added to the microprocessor package from outside.

Thermal Design and Optimization of Harsh Environment Power Electronics in Natural Convection Heat Transfer

2003 ◽  
Author(s):  
Mehmet Arik ◽  
Manoj Nagulapally ◽  
Steven Brzozowski ◽  
John Glaser
Keyword(s):  
Heat Transfer ◽  
Power Electronics ◽  
Thermal Management ◽  
Heat Sink ◽  
Performance Enhancement ◽  
Cooling System ◽  
Thermal Design ◽  
Harsh Environment ◽  
Air Cooling ◽  
Heat Spreader

A study of thermal management of a harsh environment power electronics system is presented. The thermal environments were found to be between 65 °C and 90 °C that is considerably higher than many traditional electronics applications. A modular, low cost, and passive air-cooling system was desired. An analytical model was developed to obtain the heat transfer characteristics. Further performance verification of the thermal management solution was completed using a commercially available CFD tool. A small footprint area for thermal design of the power electronics connected with an electrically isolating low-conductivity material to the heat sink increased the challenge. A further thermal performance enhancement was achieved with the addition of a heat spreader between power electronics and the heat sink, and optimization of the heat spreader was achieved by utilizing FEM technique.

Thermal management of power electronics with liquid cooled metal foam heat sink

2021 ◽  
Vol 163 ◽  
pp. 106796
Author(s):  
Yongtong Li ◽  
Liang Gong ◽  
Bin Ding ◽  
Minghai Xu ◽  
Yogendra Joshi
Keyword(s):  
Power Electronics ◽  
Thermal Management ◽  
Heat Sink ◽  
Metal Foam

Characterization of Light Weight Heat Sink Materials for Thermal Management of Electronics

2007 ◽  
Author(s):  
Tunc Icoz ◽  
Mehmet Arik ◽  
John T. Dardis
Keyword(s):  
Thermal Management ◽  
Heat Sink ◽  
High Efficiency ◽  
Computational Study ◽  
Heat Sinks ◽  
Advanced Materials ◽  
Air Cooling ◽  
Thermal Management Of Electronics ◽  
Thermal Solution

Thermal management of electronics is a critical part of maintaining high efficiency and reliability. Adequate cooling must be balanced with weight and volumetric requirements, especially for passive air-cooling solutions in electronics applications where space and weight are at a premium. It should be noted that there are systems where thermal solution takes more than 95% of the total weight of the system. Therefore, it is necessary to investigate and utilize advanced materials to design low weight and compact systems. Many of the advanced materials have anisotropic thermal properties and their performances depend strongly on taking advantage of superior properties in the desired directions. Therefore, control of thermal conductivity plays an important role in utilization of such materials for cooling applications. Because of the complexity introduced by anisotropic properties, thermal performances of advanced materials are yet to be fully understood. Present study is an experimental and computational study on characterization of thermal performances of advanced materials for heat sink applications. Numerical simulations and experiments are performed to characterize thermal performances of four different materials. An estimated weight savings in excess of 75% with lightweight materials are observed compared to the traditionally used heat sinks.

Thermal Management of Air-Cooling Lithium-Ion Battery Pack

2021 ◽  
Vol 38 (11) ◽  
pp. 118201
Author(s):  
Jianglong Du ◽  
Haolan Tao ◽  
Yuxin Chen ◽  
Xiaodong Yuan ◽  
Cheng Lian ◽  
...  
Keyword(s):  
Lithium Ion Battery ◽  
Thermal Management ◽  
Thermal Performance ◽  
Three Dimensional ◽  
Lithium Ion ◽  
Battery Pack ◽  
Cooling Effect ◽  
Air Cooling ◽  
Safety Issues ◽  
Battery Packs

Lithium-ion battery packs are made by many batteries, and the difficulty in heat transfer can cause many safety issues. It is important to evaluate thermal performance of a battery pack in designing process. Here, a multiscale method combining a pseudo-two-dimensional model of individual battery and three-dimensional computational fluid dynamics is employed to describe heat generation and transfer in a battery pack. The effect of battery arrangement on the thermal performance of battery packs is investigated. We discuss the air-cooling effect of the pack with four battery arrangements which include one square arrangement, one stagger arrangement and two trapezoid arrangements. In addition, the air-cooling strategy is studied by observing temperature distribution of the battery pack. It is found that the square arrangement is the structure with the best air-cooling effect, and the cooling effect is best when the cold air inlet is at the top of the battery pack. We hope that this work can provide theoretical guidance for thermal management of lithium-ion battery packs.

Integration of Silver Heat Spreaders in LTCC utilizing Thick Silver Tape in the Co-fire Process

2015 ◽  
Vol 2015 (CICMT) ◽  
pp. 000062-000066 ◽  
Author(s):  
T. Welker ◽  
S. Günschmann ◽  
N. Gutzeit ◽  
J. Müller
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Heat Sink ◽  
Junction Temperature ◽  
Large Area ◽  
Heat Spreader ◽  
Integration Density ◽  
Heat Spreaders ◽  
Cte Mismatch ◽  
Pattern Resolution

The integration density in semiconductor devices is significantly increased in the last years. This trend is already described by Moore's law what forecasts a doubling of the integration density every two years. This evolution makes greater demands on the substrate technology which is used for the first level interconnect between the semiconductor and the device package. Higher pattern resolution is required to connect more functions on a smaller chip. Also the thermal performance of the substrate is a crucial issue. The increased integration density leads to an increased power density, what means that more heat has to dissipate on a smaller area. Thus, substrates with a high thermal conductivity (e. g. direct bonded copper (DBC)) are utilized which spread the heat over a large area. However, the reduced pattern resolution caused by thick metal layers is disadvantageous for this substrate technology. Alternatively, low temperature co-fired ceramic (LTCC) can be used. This multilayer technology provides a high pattern resolution in combination with a high integration grade. The poor thermal conductivity of LTCC (3 … 5 W*m−1*K−1) requires thermal vias made of silver paste which are placed between the power chip and the heat sink and reduce the thermal resistance of the substrate. The via-pitch and diameter is limited by the LTCC technology, what allows a maximum filling grade of approx. 20 to 25 %. Alternatively, an opening in the ceramic is created, to bond the chip directly to the heat sink. This leads to technological challenges like the CTE mismatch between the chip and the heat sink material. Expensive materials like copper molybdenum composites with matched CTE have to be used. In the presented investigation, a thick silver tape is used to form a thick silver heat spreader through the LTCC substrate. An opening is structured by laser cutting in the LTCC tape and filled with a laser cut silver tape. After lamination, the substrate is fired using a constraint sintering process. The bond strength of the silver to LTCC interface is approx. 5.6 MPa. The thermal resistance of the silver structure is measured by a thermal test chip (Delphi PST1, 2.5 mm × 2.5 mm) glued with a high thermal conducting epoxy to the silver structure. The chip contains a resistor and diodes to generate heat and to determine the junction temperature respectively. The backside of the test structure is temperature stabilized by a temperature controlled heat sink. The resulting thermal resistance is in the range of 1.1 K/W to 1.5 K/W depending on the length of silver structure (5 mm to 7 mm). Advantages of the presented heat spreader are the low thermal resistance and the good embedding capability in the co-fire LTCC process.

Assessment of Some Integrated Cooling Mechanisms for an Active IPEM

2004 ◽  
Author(s):  
Y. Pang ◽  
E. Scott ◽  
J. D. van Wyk ◽  
Z. Liang
Keyword(s):  
Power Electronics ◽  
Thermal Management ◽  
Three Dimensional ◽  
The Other ◽  
Other Hand ◽  
3D Packaging ◽  
3D Package

With the growing demands on the performance, cost, and advances in packaging and interconnection technology, three-dimensional (3D) packaging provides higher density packaging. On the other hand, thermal management of the 3D package becomes a very important issue. This paper assesses the various possibilities of integrated thermal management for integrated power electronics modules (IPEMs).

CFD Analysis of Thermal Shadowing and Optimization of Heatsinks in 3rd Generation Open Compute Server for Single-Phase Immersion Cooling

2019 ◽  
Author(s):  
Jimil M. Shah ◽  
Ravya Dandamudi ◽  
Chinmay Bhatt ◽  
Pranavi Rachamreddy ◽  
Pratik Bansode ◽  
...  
Keyword(s):  
Thermal Management ◽  
Power Density ◽  
Heat Sink ◽  
Single Phase ◽  
Data Centers ◽  
Air Cooling ◽  
Third Generation ◽  
Dielectric Fluids ◽  
Immersion Cooling ◽  
The Impact

Abstract In today’s networking world, utilization of servers and data centers has been increasing significantly. Increasing demand of processing and storage of data causes a corresponding increase in power density of servers. The data center energy efficiency largely depends on thermal management of servers. Currently, air cooling is the most widely used thermal management technology in data centers. However, air cooling has started to reach its limits due to high-powered processors. To overcome these limitations of air cooling in data centers, liquid immersion cooling methods using different dielectric fluids can be a viable option. Thermal shadowing is an effect in which temperature of a cooling medium increases by carrying heat from one source and results in decreasing its heat carrying capacity due to reduction in the temperature difference between the maximum junction temperature of successive heat sink and incoming fluid. Thermal Shadowing is a challenge for both air and low velocity oil flow cooling. In this study, the impact of thermal shadowing in a third-generation open compute server using different dielectric fluids is compared. The heat sink is a critical part for cooling effectiveness at server level. This work also provides an efficient range of heat sinks with computational modelling of third generation open compute server. Optimization of heat sink can allow to cool high-power density servers effectively for single-phase immersion cooling applications. A parametric study is conducted, and significant savings in the volume of a heat sink have been reported.

Mixed Convection of Impinging Air Cooling Over Heat Sink in Telecom System Application

2004 ◽  
Vol 126 (4) ◽  
pp. 519-523 ◽  
Author(s):  
Siddharth Bhopte ◽  
Musa S. Alshuqairi ◽  
Dereje Agonafer ◽  
Gamal Refai-Ahmed
Keyword(s):  
Heat Transfer ◽  
Heat Source ◽  
Mixed Convection ◽  
Heat Sink ◽  
Three Dimensional ◽  
Source Surface ◽  
Air Cooling ◽  
Transfer Rates ◽  
Nusselt Numbers ◽  
Air Jet

The current numerical investigation will examine the effect of an impinging mixed convection air jet on the heat transfer rate of a parallel flat plate heat sink. A three-dimensional numerical model was developed to evaluate the effects of the nozzle diameter d, nozzle-to-target vertical placement H/d, Rayleigh number, and the jet Reynolds number on the heat transfer rates from a discrete heat source. Simulations were performed for a Prandtl number of 0.7 and for Reynolds numbers ranging from 100 to 5000. The governing equations were solved in the dimensionless form using a commercial finite-volume package. Average Nusselt numbers were obtained, at H/d=3 and two jet diameters, for the bare heat source, for the heat source with a base heat sink, and for the heat source with the finned heat sink. The heat transfer rates from the bare heat source surface have been compared with the ones obtained with the heat sink in order to determine the overall performance of the heat sink in an impingement configuration.

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